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1.
公开(公告)号:US12198943B2
公开(公告)日:2025-01-14
申请号:US17133104
申请日:2020-12-23
Applicant: SEMES CO., LTD.
Inventor: Junhee Youn , Seung Hwan Cho
IPC: H01L21/67 , B08B3/08 , C02F1/58 , C02F1/72 , C02F1/78 , B08B3/14 , C02F1/34 , C02F101/10 , C02F103/34
Abstract: Disclosed are a substrate processing apparatus and a process fluid treating apparatus. The substrate processing apparatus includes a process chamber that processes a substrate with a process fluid including ozone, a discharge conduit connected to the process chamber to discharge the process fluid used to process the substrate, and a process fluid treating apparatus connected with the discharge conduit. The process fluid treating apparatus includes a housing having an inner space with a set volume in which the process fluid is received and an injection nozzle connecting the discharge conduit and the inner space of the housing.
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公开(公告)号:US10453672B2
公开(公告)日:2019-10-22
申请号:US15297728
申请日:2016-10-19
Applicant: SEMES CO., LTD.
Inventor: Byungsun Bang , Junhee Youn , Kilsung Kwon
Abstract: Disclosed are a dissolved ozone removal unit that removes dissolved ozone from liquid, an apparatus for treating a substrate, a method of removing dissolved ozone, and a method of cleaning a substrate. The method of removing dissolved ozone in liquid includes supplying micro bubbles to the liquid, and allowing dissolved ozone to exit from the liquid by energy or radical ions that are generated while the micro bubbles are dissolved in the liquid.
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3.
公开(公告)号:US20210114902A1
公开(公告)日:2021-04-22
申请号:US17133104
申请日:2020-12-23
Applicant: SEMES CO., LTD.
Inventor: Junhee Youn , Seung Hwan Cho
Abstract: Disclosed are a substrate processing apparatus and a process fluid treating apparatus. The substrate processing apparatus includes a process chamber that processes a substrate with a process fluid including ozone, a discharge conduit connected to the process chamber to discharge the process fluid used to process the substrate, and a process fluid treating apparatus connected with the discharge conduit. The process fluid treating apparatus includes a housing having an inner space with a set volume in which the process fluid is received and an injection nozzle connecting the discharge conduit and the inner space of the housing.
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4.
公开(公告)号:US20180111860A1
公开(公告)日:2018-04-26
申请号:US15791975
申请日:2017-10-24
Applicant: SEMES CO., LTD.
Inventor: Junhee Youn , Seung Hwan Cho
CPC classification number: C02F1/727 , B08B3/08 , B08B3/14 , C02F1/34 , C02F2101/10 , C02F2103/346 , C02F2301/024 , C02F2301/046 , C02F2303/18 , H01L21/67017 , H01L21/67051
Abstract: Disclosed are a substrate processing apparatus and a process fluid treating apparatus. The substrate processing apparatus includes a process chamber that processes a substrate with a process fluid including ozone, a discharge conduit connected to the process chamber to discharge the process fluid used to process the substrate, and a process fluid treating apparatus connected with the discharge conduit. The process fluid treating apparatus includes a housing having an inner space with a set volume in which the process fluid is received and an injection nozzle connecting the discharge conduit and the inner space of the housing.
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