公开(公告)号：US20240146103A1

公开(公告)日：2024-05-02

申请号：US18307092

申请日：2023-04-26

Applicant: SEMES CO., LTD.

Inventor： Chan Young Choi ,  Ki Won Han ,  Wan Hee Jeong ,  Kyo Bong Kim ,  Hee Chan Kim ,  Doo Hyun Baek ,  Sang-Oh Kim ,  Hee Jae Byun

IPC: H02J50/00 ,  H01L21/67 ,  H01L21/687 ,  H02J50/10

CPC classification number: H02J50/005 ,  H01L21/67011 ,  H01L21/68707 ,  H02J50/10

Abstract: Embodiments of the inventive concept provide a wireless power apparatus for a substrate treating apparatus and a manufacturing method for the wireless power apparatus for the substrate treating apparatus for preventing a heat generation by preventing a generation of an eddy current in a coupling element, if the coupling element is used around an outer housing at which an induced magnetic field is formed. The inventive concept provides a wireless power apparatus for a substrate treating apparatus. The wireless power apparatus includes an outer housing having a main power line forming an induced magnetic field by receiving a power, and a coupling part coupling at least two components among components which are positioned at a periphery of the main power line for fixing the main power line; and an inner housing positioned spaced apart from the outer housing, generating an electromotive force through the induced magnetic field generated from the outer housing, and supplying the electromotive force which is generated to the substrate treating apparatus, and wherein the coupling part is formed of a material at which an eddy current is not generated by the induced magnetic field.

公开(公告)号：US12243727B2

公开(公告)日：2025-03-04

申请号：US17889298

申请日：2022-08-16

Applicant: SEMES CO., LTD.

Inventor： Dong Chan Lee ,  Kyo Bong Kim

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/687

Abstract: An electrostatic chuck includes a chuck body which supports a substrate, at least one pin hole penetrating the chuck body in a vertical direction, a lift pin disposed in one of the at least one pin hole, wherein the lift pin moves along the one of the at least one pin hole, and an expansion member which is provided at an inner circumference of the one of the at least one pin hole, the expansion member having an inner circumferential surface that, in response to a first power, selectively holds or releases an outer circumferential surface of the lift pin.

公开(公告)号：US20240063039A1

公开(公告)日：2024-02-22

申请号：US18135681

申请日：2023-04-17

Applicant: SEMES CO., LTD

Inventor： Hee Jae BYUN ,  Chang Rak Baek ,  Kyo Bong Kim ,  Chan Young Choi ,  Wan Hee Jeong ,  Ki Won Han ,  Sang Oh Kim

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67259 ,  H01L21/68707

Abstract: An apparatus and method of detecting a wafer edge using a laser scanner, and a semiconductor transfer device are provided. The apparatus for detecting a wafer edge using a laser scanner includes a laser scanner disposed on a rear side of a mounted wafer and radiating a laser to a portion of an edge of the wafer, and a detection unit receiving an image acquired by the laser scanner and detecting the wafer edge in the image. The detection unit determines whether each wafer is present or aligned according to wafer edges detected in a plurality of wafer areas in the image.