UNIT FOR SUPPLYING LIQUID, APPARATUS AND METHOD FOR TREATING SUBSTRATE WITH THE UNIT

    公开(公告)号:US20230131576A1

    公开(公告)日:2023-04-27

    申请号:US17969155

    申请日:2022-10-19

    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to support a substrate; and a liquid supply unit configured to supply a treating liquid onto the substrate supported on the support unit, and wherein the liquid supply unit comprises: a tank configured to have an accommodation space for storing the treating liquid therein; a circulation line configured to circulate the treating liquid stored in the accommodation space; a supplementary line configured to supply the treating liquid to the accommodation space, and at which a valve is installed; a heater installed at the circulation line, and for heating the treating liquid; and a controller is configured to control the valve and the heater.

    APPARATUS FOR PROCESSING SUBSTRATE AND METHOD OF PROCESSING SUBSTRATE

    公开(公告)号:US20250016888A1

    公开(公告)日:2025-01-09

    申请号:US18660317

    申请日:2024-05-10

    Abstract: An apparatus for processing a substrate includes a liquid supply line; a pressure tank configured to store liquid; a circulation line including a first heating unit configured to heat liquid, wherein liquid heated by the first heating unit circulates in the pressure tank in a liquid supply standby state, which is before liquid is supplied to the substrate in a process chamber; a pressured gas supply line configured to supply pressured gas to the pressure tank in the liquid supply standby state and to pressurize gas; an exhaust line configured to exhaust gas in the pressure tank; and a control unit configured to control pressure in the pressure tank to increase to a predetermined pressure by opening the pressured gas supply line in a state in which the pressure tank is closed before liquid circulates in the pressure tank in the liquid supply standby state.

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