公开(公告)号：US20220305530A1

公开(公告)日：2022-09-29

申请号：US17702127

申请日：2022-03-23

Applicant: SEMES CO., LTD.

Inventor： Jin Woo JUNG ,  Do Hyeon YOON ,  Young Hun LEE

IPC: B08B3/08 ,  H01L21/67 ,  B08B3/04 ,  B08B3/02 ,  B08B13/00

Abstract: The inventive concept provides a substrate treating method. The substrate treating method comprising: a liquid treating step for cleaning a substrate by supplying a treating liquid to the substrate in a first process chamber; a transfer step for transferring the substrate to a second process chamber after the liquid treating step; and a drying step for removing the treating liquid remaining on the substrate in the second process chamber, and wherein the method further comprises a standby step of a liquid treated substrate to standby in the first process chamber when the liquid treated substrate of the liquid treating step cannot be transferred to the second process chamber, and at the standby step the treating liquid is discharged until the substrate can be transferred to the second process chamber.

公开(公告)号：US20220165606A1

公开(公告)日：2022-05-26

申请号：US17529649

申请日：2021-11-18

Applicant: SEMES CO., LTD.

Inventor： Sang Min LEE ,  Do Hyeon YOON

IPC: H01L21/687

Abstract: The present invention provides an apparatus for treating a substrate, including: a process chamber including a first body and a second body which are combined with each other to form a treatment space for treating a substrate is treated therein; a driver which moves the process chamber to an open position or a close position; a support unit which supports a substrate within the treatment space; and a fluid supply unit which supplies a fluid to the treatment space, in which the support unit includes: a support pin coupled to the first body or the second body; and a guide member which is coupled to the support pin and extends in a lateral direction of the support pin to support the substrate.

公开(公告)号：US20250046631A1

公开(公告)日：2025-02-06

申请号：US18792709

申请日：2024-08-02

Applicant: SEMES CO., LTD.

Inventor： Young Hun LEE ,  Do Hyeon YOON ,  Eun Seok KIM

IPC: H01L21/67 ,  H01L21/677

Abstract: Disclosed is a substrate treating apparatus including: a treating chamber for treating a substrate; a transfer unit for loading and unloading the substrate into and from a treatment space in which the substrate is treated in the treating chamber; and a heating unit provided to be loaded into and unloaded from the treatment space, and for cleaning the treatment space by heating, in which the treating chamber includes: a chamber body providing the treatment space; and a support unit for supporting the substrate within the treatment space; and a fluid supply unit for supplying a fluid, which treats the substrate, into the treatment space, and the heating unit includes: a base; and a heater installed on the base.

公开(公告)号：US20250132145A1

公开(公告)日：2025-04-24

申请号：US18901094

申请日：2024-09-30

Applicant: SEMES CO., LTD.

Inventor： Do Hyeon YOON ,  Mi So PARK ,  Yong Joon IM ,  Hye Bin GWON

IPC: H01L21/02 ,  B08B3/04 ,  B08B3/08 ,  B08B7/00 ,  B08B15/02

Abstract: Disclosed is a manufacturing method including: a substrate loading operation of loading a substrate into a liquid treating chamber; a liquid treating operation of supplying a treatment solution to the substrate rotating in the liquid treating chamber through a nozzle; a substrate unloading operation of unloading the substrate from the liquid treating chamber, and a pressure control operation of changing a pressure of a space above the substrate at least one time in a period between the substrate loading operation and the substrate unloading operation.

公开(公告)号：US20240234171A1

公开(公告)日：2024-07-11

申请号：US18406880

申请日：2024-01-08

Applicant: SEMES CO., LTD.

Inventor： Do Hyeon YOON ,  Eun Seok KIM ,  Mi So PARK

IPC: H01L21/67

CPC classification number: H01L21/67028

Abstract: Provided is an apparatus for processing a substrate, the apparatus including: a liquid treatment chamber; a drying chamber; and a light treatment chamber, in which the light treatment chamber includes: a treatment housing having a treatment space in which the substrate is processed; a support member for supporting the substrate in the treatment space; a light source for irradiating the substrate supported on the support member with light in the form of pulses; and a light filter for selecting a set range of wavelengths of the light generated by the light source and allowing the selected wavelengths to pass through.

公开(公告)号：US20240170305A1

公开(公告)日：2024-05-23

申请号：US18425816

申请日：2024-01-29

Applicant: SEMES CO., LTD.

Inventor： Jin Woo JUNG ,  Do Hyeon YOON ,  Yong Hee LEE

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/677

CPC classification number: H01L21/67028 ,  H01L21/02101 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/67739

Abstract: A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.

公开(公告)号：US20220384216A1

公开(公告)日：2022-12-01

申请号：US17714999

申请日：2022-04-06

Applicant: SEMES CO., LTD.

Inventor： Jin Se PARK ,  Ki Bong KIM ,  Myung Seok CHA ,  Do Hyeon YOON

IPC: H01L21/67

Abstract: The present invention discloses an exhausting device and an exhausting method in substrate processing equipment, and more particularly, a technique for controlling a processing process environment by providing a buffer space for storing chemical fumes outside a ventilation unit of the substrate processing equipment, and discharging the chemical fumes into the buffer space in accordance with a processing process in a chamber interior space.

公开(公告)号：US20220367221A1

公开(公告)日：2022-11-17

申请号：US17745116

申请日：2022-05-16

Applicant: SEMES CO., LTD.

Inventor： Do Hyeon YOON ,  Yong Hee LEE ,  Jin Woo JUNG ,  Mi So PARK

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677 ,  B08B3/08 ,  B08B13/00 ,  F26B5/00

Abstract: The present invention provides a substrate treating apparatus. The substrate treating apparatus includes: a liquid treatment chamber configured to treat a substrate with a liquid; a drying chamber configured to dry the liquid-treated substrate; a transfer robot configured to transfer the substrate between the liquid treatment chamber and the drying chamber, and including a hand which is movable along an X-axis, a Y-axis, and a Z-axis and is rotatably driven based on the Z-axis, and on which the substrate is placed; an optical system configured to photograph a form of a liquid film of the substrate, in which when the substrate is transferred from the liquid treatment chamber to the drying chamber, the substrate is wetted with a chemical liquid and is transferred by the transfer robot in a state of being formed with a liquid film formed; and a controller configured to measure the form of the liquid film photographed by the optical system.

公开(公告)号：US20220208565A1

公开(公告)日：2022-06-30

申请号：US17520826

申请日：2021-11-08

Applicant: SEMES CO., LTD.

Inventor： Jin Woo JUNG ,  Do Hyeon YOON ,  Yong Hee LEE

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/677

Abstract: A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.