公开(公告)号：US20220305530A1

公开(公告)日：2022-09-29

申请号：US17702127

申请日：2022-03-23

申请人： SEMES CO., LTD.

发明人： Jin Woo JUNG ,  Do Hyeon YOON ,  Young Hun LEE

IPC分类号： B08B3/08 ,  H01L21/67 ,  B08B3/04 ,  B08B3/02 ,  B08B13/00

摘要： The inventive concept provides a substrate treating method. The substrate treating method comprising: a liquid treating step for cleaning a substrate by supplying a treating liquid to the substrate in a first process chamber; a transfer step for transferring the substrate to a second process chamber after the liquid treating step; and a drying step for removing the treating liquid remaining on the substrate in the second process chamber, and wherein the method further comprises a standby step of a liquid treated substrate to standby in the first process chamber when the liquid treated substrate of the liquid treating step cannot be transferred to the second process chamber, and at the standby step the treating liquid is discharged until the substrate can be transferred to the second process chamber.

公开(公告)号：US20220165606A1

公开(公告)日：2022-05-26

申请号：US17529649

申请日：2021-11-18

申请人： SEMES CO., LTD.

发明人： Sang Min LEE ,  Do Hyeon YOON

IPC分类号： H01L21/687

摘要： The present invention provides an apparatus for treating a substrate, including: a process chamber including a first body and a second body which are combined with each other to form a treatment space for treating a substrate is treated therein; a driver which moves the process chamber to an open position or a close position; a support unit which supports a substrate within the treatment space; and a fluid supply unit which supplies a fluid to the treatment space, in which the support unit includes: a support pin coupled to the first body or the second body; and a guide member which is coupled to the support pin and extends in a lateral direction of the support pin to support the substrate.

公开(公告)号：US20240234171A1

公开(公告)日：2024-07-11

申请号：US18406880

申请日：2024-01-08

申请人： SEMES CO., LTD.

发明人： Do Hyeon YOON ,  Eun Seok KIM ,  Mi So PARK

IPC分类号： H01L21/67

CPC分类号： H01L21/67028

摘要： Provided is an apparatus for processing a substrate, the apparatus including: a liquid treatment chamber; a drying chamber; and a light treatment chamber, in which the light treatment chamber includes: a treatment housing having a treatment space in which the substrate is processed; a support member for supporting the substrate in the treatment space; a light source for irradiating the substrate supported on the support member with light in the form of pulses; and a light filter for selecting a set range of wavelengths of the light generated by the light source and allowing the selected wavelengths to pass through.

公开(公告)号：US20240170305A1

公开(公告)日：2024-05-23

申请号：US18425816

申请日：2024-01-29

申请人： SEMES CO., LTD.

发明人： Jin Woo JUNG ,  Do Hyeon YOON ,  Yong Hee LEE

IPC分类号： H01L21/67 ,  H01L21/02 ,  H01L21/677

CPC分类号： H01L21/67028 ,  H01L21/02101 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/67739

摘要： A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.

公开(公告)号：US20220384216A1

公开(公告)日：2022-12-01

申请号：US17714999

申请日：2022-04-06

申请人： SEMES CO., LTD.

发明人： Jin Se PARK ,  Ki Bong KIM ,  Myung Seok CHA ,  Do Hyeon YOON

IPC分类号： H01L21/67

摘要： The present invention discloses an exhausting device and an exhausting method in substrate processing equipment, and more particularly, a technique for controlling a processing process environment by providing a buffer space for storing chemical fumes outside a ventilation unit of the substrate processing equipment, and discharging the chemical fumes into the buffer space in accordance with a processing process in a chamber interior space.

公开(公告)号：US20220367221A1

公开(公告)日：2022-11-17

申请号：US17745116

申请日：2022-05-16

申请人： SEMES CO., LTD.

发明人： Do Hyeon YOON ,  Yong Hee LEE ,  Jin Woo JUNG ,  Mi So PARK

IPC分类号： H01L21/67 ,  H01L21/687 ,  H01L21/677 ,  B08B3/08 ,  B08B13/00 ,  F26B5/00

摘要： The present invention provides a substrate treating apparatus. The substrate treating apparatus includes: a liquid treatment chamber configured to treat a substrate with a liquid; a drying chamber configured to dry the liquid-treated substrate; a transfer robot configured to transfer the substrate between the liquid treatment chamber and the drying chamber, and including a hand which is movable along an X-axis, a Y-axis, and a Z-axis and is rotatably driven based on the Z-axis, and on which the substrate is placed; an optical system configured to photograph a form of a liquid film of the substrate, in which when the substrate is transferred from the liquid treatment chamber to the drying chamber, the substrate is wetted with a chemical liquid and is transferred by the transfer robot in a state of being formed with a liquid film formed; and a controller configured to measure the form of the liquid film photographed by the optical system.

公开(公告)号：US20220208565A1

公开(公告)日：2022-06-30

申请号：US17520826

申请日：2021-11-08

申请人： SEMES CO., LTD.

发明人： Jin Woo JUNG ,  Do Hyeon YOON ,  Yong Hee LEE

IPC分类号： H01L21/67 ,  H01L21/02 ,  H01L21/677

摘要： A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.