公开(公告)号：US20230201884A1

公开(公告)日：2023-06-29

申请号：US18068917

申请日：2022-12-20

Applicant: SEMES CO, LTD.

Inventor： Yong Hyun CHOI ,  Young Hun LEE ,  Seung Hoon OH ,  Mi So PARK ,  Tae Jong CHOI ,  Yong Sun KO ,  Jin Woo JUNG

IPC: B08B3/02 ,  F26B5/00

CPC classification number: B08B3/022 ,  F26B5/005 ,  H01L21/02057

Abstract: The present invention provides a method for treating a substrate. The method for treating a substrate comprises: treating the substrate with liquid; and drying the liquid-treated substrate, and the liquid treatment step includes: a first liquid supply step of supplying a first liquid to an upper surface of the rotating substrate; and a second liquid supply step of supplying a second liquid to an upper surface of the rotating substrate, and in the second liquid supply step, a rotation speed of the substrate is adjusted such that the second liquid supplied on the substrate flows from a central region of the substrate to an edge region of the substrate.

公开(公告)号：US20220367213A1

公开(公告)日：2022-11-17

申请号：US17745074

申请日：2022-05-16

Applicant: SEMES CO., LTD.

Inventor： Mi So PARK ,  Young Hun LEE ,  Young Seop CHOI ,  Jin Woo JUNG

IPC: H01L21/67 ,  F26B3/04

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having an inner space therein; a fluid supply unit having a supply line configured to supply a treating fluid to the inner space and a fluid supply source configured to supply the treating fluid to the supply line; a first exhaust unit configured to exhaust the inner space; a second exhaust unit configured to exhaust the supply line; and a controller configured to control the fluid supply unit, the first exhaust unit, and the second exhaust unit, and wherein the controller controls the fluid supply unit and the second exhaust unit so a pressure of the supply line is maintained at a critical pressure of the treating fluid or above during at least a part of a standby step for keeping a substrate outside the inner space before introducing thereof into the inner space.

公开(公告)号：US20220305530A1

公开(公告)日：2022-09-29

申请号：US17702127

申请日：2022-03-23

Applicant: SEMES CO., LTD.

Inventor： Jin Woo JUNG ,  Do Hyeon YOON ,  Young Hun LEE

IPC: B08B3/08 ,  H01L21/67 ,  B08B3/04 ,  B08B3/02 ,  B08B13/00

Abstract: The inventive concept provides a substrate treating method. The substrate treating method comprising: a liquid treating step for cleaning a substrate by supplying a treating liquid to the substrate in a first process chamber; a transfer step for transferring the substrate to a second process chamber after the liquid treating step; and a drying step for removing the treating liquid remaining on the substrate in the second process chamber, and wherein the method further comprises a standby step of a liquid treated substrate to standby in the first process chamber when the liquid treated substrate of the liquid treating step cannot be transferred to the second process chamber, and at the standby step the treating liquid is discharged until the substrate can be transferred to the second process chamber.

公开(公告)号：US20240170305A1

公开(公告)日：2024-05-23

申请号：US18425816

申请日：2024-01-29

Applicant: SEMES CO., LTD.

Inventor： Jin Woo JUNG ,  Do Hyeon YOON ,  Yong Hee LEE

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/677

CPC classification number: H01L21/67028 ,  H01L21/02101 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/67739

Abstract: A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.

公开(公告)号：US20220367221A1

公开(公告)日：2022-11-17

申请号：US17745116

申请日：2022-05-16

Applicant: SEMES CO., LTD.

Inventor： Do Hyeon YOON ,  Yong Hee LEE ,  Jin Woo JUNG ,  Mi So PARK

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677 ,  B08B3/08 ,  B08B13/00 ,  F26B5/00

Abstract: The present invention provides a substrate treating apparatus. The substrate treating apparatus includes: a liquid treatment chamber configured to treat a substrate with a liquid; a drying chamber configured to dry the liquid-treated substrate; a transfer robot configured to transfer the substrate between the liquid treatment chamber and the drying chamber, and including a hand which is movable along an X-axis, a Y-axis, and a Z-axis and is rotatably driven based on the Z-axis, and on which the substrate is placed; an optical system configured to photograph a form of a liquid film of the substrate, in which when the substrate is transferred from the liquid treatment chamber to the drying chamber, the substrate is wetted with a chemical liquid and is transferred by the transfer robot in a state of being formed with a liquid film formed; and a controller configured to measure the form of the liquid film photographed by the optical system.

公开(公告)号：US20220208565A1

公开(公告)日：2022-06-30

申请号：US17520826

申请日：2021-11-08

Applicant: SEMES CO., LTD.

Inventor： Jin Woo JUNG ,  Do Hyeon YOON ,  Yong Hee LEE

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/677

Abstract: A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.

公开(公告)号：US20230129923A1

公开(公告)日：2023-04-27

申请号：US17971734

申请日：2022-10-24

Applicant: SEMES CO., LTD.

Inventor： Jin Woo JUNG ,  Jin Mo JAE ,  Sang Min LEE ,  Young Hun LEE ,  Yong Hyun CHOI ,  Yong Joon IM ,  Seung Hoon OH

IPC: H01L21/687 ,  H01L21/67 ,  B08B3/04 ,  B08B13/00

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing for providing a treating space for treating a substrate within; a support unit for supporting the substrate in the treating space; a bottom supply port for supplying a process fluid to the treating space; and a filler member positioned below the substrate supported on the support unit in the treating space, and wherein the filler member forms a buffer space facing the bottom supply port, and a passage is formed between the filler member and an inner wall of the housing and flows the process fluid which is introduced to the buffer space in a direction of the substrate.

公开(公告)号：US20230081833A1

公开(公告)日：2023-03-16

申请号：US17892214

申请日：2022-08-22

Applicant: SEMES CO., LTD.

Inventor： Jin Woo JUNG ,  Myung Seok CHA

IPC: H01L21/02 ,  H01L21/67

Abstract: Provided is a substrate treating apparatus including: a fluid supply unit supplying a supercritical fluid to the treatment space, a plurality of components installed in the fluid supply line; and a detection member detecting whether or not metal particles are released from the component. The detection member includes: an upstream detection port connected to the fluid supply line upstream from a first component which is one of the plurality of components; a downstream detection port connected to the fluid supply line downstream from the first component; and a detector provided to be coupled to a selected detection port between the upstream detection port and the downstream detection port, and detecting metal particles from a fluid flowing through the detection port from the fluid supply line.