PLASMA GENERATION APPARATUS, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME, AND CONTROL METHOD FOR THE PLASMA GENERATION APPARATUS

    公开(公告)号:US20200051784A1

    公开(公告)日:2020-02-13

    申请号:US16530468

    申请日:2019-08-02

    Abstract: A substrate treating apparatus includes a chamber having a space therein in which a substrate is treated, a support unit that supports the substrate in the chamber, a gas supply unit that supplies gas into the chamber, and a plasma generation unit that excites the gas in the chamber into a plasma state. The plasma generation unit includes a high-frequency power supply, a first antenna connected to one end of the high-frequency power supply, a second antenna connected with the first antenna in parallel, and a current divider that distributes electric current to the first antenna and the second antenna. The current divider includes a first capacitor disposed between the first antenna and the second antenna, a second capacitor connected with the second antenna in parallel, and a third capacitor connected with the second antenna in series. The second capacitor and the third capacitor are implemented with a variable capacitor.

    APPARATUS FOR SUPPLYING POWER AND APPARATUS FOR TREATING SUBSTRATE INCLUDING THE SAME

    公开(公告)号:US20180315580A1

    公开(公告)日:2018-11-01

    申请号:US15962487

    申请日:2018-04-25

    CPC classification number: H01J37/32174 H01J37/321 H03H7/40

    Abstract: Disclosed inventions are apparatus for supplying power and an apparatus for treating a substrate including the same. The apparatus for supplying power includes a high-frequency power source that provides a high-frequency power; a plasma source including first and second antennas that generates plasma by using the high-frequency power; and a power divider connected between the high-frequency power source and the plasma source to divide the high-frequency power supplied to the first and second antennas. The power divider includes a first variable device that controls the high-frequency power supplied to the first and second antennas; and a second variable device that compensates for non-linearity of the high-frequency power supplied to the first and second antennas.

    APPARATUS FOR GENERATING PLASMA, APPARATUS FOR TREATING SUBSTRATE INCLUDING THE SAME, AND METHOD FOR CONTROLLING THE SAME

    公开(公告)号:US20220181118A1

    公开(公告)日:2022-06-09

    申请号:US17540742

    申请日:2021-12-02

    Abstract: Disclosed is an apparatus for treating a substrate. The apparatus may include a chamber having a space for treating the substrate therein; a support unit supporting the substrate in the chamber; a gas supply unit supplying gas into the chamber; and a plasma generation unit exciting the gas in the chamber into a plasma state, wherein the plasma generation unit may include high frequency power supply; a first antenna; a second antenna; and a matcher connected between the high frequency power supply and the first and second antennas, wherein the matcher may include a current distributor distributing a current to the first antenna and the second antenna, and the current distributor includes a first capacitor disposed between the first antenna and the second antenna; a second capacitor connected with the second antenna in series; and a third capacitor connected with the second antenna in parallel, wherein the first capacitor and the second capacitor may be provided as variable capacitors.

    FILTER UNIT, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME, AND SUBSTRATE TREATING METHOD

    公开(公告)号:US20200373125A1

    公开(公告)日:2020-11-26

    申请号:US16880221

    申请日:2020-05-21

    Abstract: A substrate treating apparatus is disclosed. The substrate treating apparatus may include a chamber having a treating space defined therein, a support unit for supporting the substrate in the treating space, a heater power source for applying electric power to a heater in the support unit, a high-frequency power source for applying high-frequency power to a lower electrode in the support unit, and a filter unit installed at a line for connecting the heater power source with the heater to prevent high-frequency inflow. The filter unit may include a housing, one or more coils in the housing, and an adjustment member disposed between the housing and the coil. The adjustment member may be made of a non-magnetic material. The adjustment member may be spaced from the coil at a predefined spacing, and spaced apart from an inner wall of the housing or in contact with the housing inner wall.

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