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公开(公告)号:US20200051784A1
公开(公告)日:2020-02-13
申请号:US16530468
申请日:2019-08-02
Applicant: SEMES CO., LTD.
Inventor: Ogsen GALSTYAN , Young-Bin Kim , Jamyung GU , Jong-Hwan An
Abstract: A substrate treating apparatus includes a chamber having a space therein in which a substrate is treated, a support unit that supports the substrate in the chamber, a gas supply unit that supplies gas into the chamber, and a plasma generation unit that excites the gas in the chamber into a plasma state. The plasma generation unit includes a high-frequency power supply, a first antenna connected to one end of the high-frequency power supply, a second antenna connected with the first antenna in parallel, and a current divider that distributes electric current to the first antenna and the second antenna. The current divider includes a first capacitor disposed between the first antenna and the second antenna, a second capacitor connected with the second antenna in parallel, and a third capacitor connected with the second antenna in series. The second capacitor and the third capacitor are implemented with a variable capacitor.
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公开(公告)号:US20180315580A1
公开(公告)日:2018-11-01
申请号:US15962487
申请日:2018-04-25
Applicant: SEMES CO., LTD.
Inventor: Harutyun MELIKYAN , Ogsen GALSTYAN , Junghwan LEE , Jong Hwan AN , Shin-Woo NAM
CPC classification number: H01J37/32174 , H01J37/321 , H03H7/40
Abstract: Disclosed inventions are apparatus for supplying power and an apparatus for treating a substrate including the same. The apparatus for supplying power includes a high-frequency power source that provides a high-frequency power; a plasma source including first and second antennas that generates plasma by using the high-frequency power; and a power divider connected between the high-frequency power source and the plasma source to divide the high-frequency power supplied to the first and second antennas. The power divider includes a first variable device that controls the high-frequency power supplied to the first and second antennas; and a second variable device that compensates for non-linearity of the high-frequency power supplied to the first and second antennas.
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公开(公告)号:US20220181118A1
公开(公告)日:2022-06-09
申请号:US17540742
申请日:2021-12-02
Applicant: SEMES CO., LTD.
Inventor: Ogsen GALSTYAN , Shant ARAKELYAN , Young-Bin KIM , Youn Gun BONG , Jong-Hwan AN
IPC: H01J37/32
Abstract: Disclosed is an apparatus for treating a substrate. The apparatus may include a chamber having a space for treating the substrate therein; a support unit supporting the substrate in the chamber; a gas supply unit supplying gas into the chamber; and a plasma generation unit exciting the gas in the chamber into a plasma state, wherein the plasma generation unit may include high frequency power supply; a first antenna; a second antenna; and a matcher connected between the high frequency power supply and the first and second antennas, wherein the matcher may include a current distributor distributing a current to the first antenna and the second antenna, and the current distributor includes a first capacitor disposed between the first antenna and the second antenna; a second capacitor connected with the second antenna in series; and a third capacitor connected with the second antenna in parallel, wherein the first capacitor and the second capacitor may be provided as variable capacitors.
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4.
公开(公告)号:US20200373125A1
公开(公告)日:2020-11-26
申请号:US16880221
申请日:2020-05-21
Applicant: SEMES CO., LTD.
Inventor: Ogsen GALSTYAN , Hyo Seong SEONG , Byeung Geon JEON , Jong Hwan AN
IPC: H01J37/32 , H03H7/01 , H01L21/683
Abstract: A substrate treating apparatus is disclosed. The substrate treating apparatus may include a chamber having a treating space defined therein, a support unit for supporting the substrate in the treating space, a heater power source for applying electric power to a heater in the support unit, a high-frequency power source for applying high-frequency power to a lower electrode in the support unit, and a filter unit installed at a line for connecting the heater power source with the heater to prevent high-frequency inflow. The filter unit may include a housing, one or more coils in the housing, and an adjustment member disposed between the housing and the coil. The adjustment member may be made of a non-magnetic material. The adjustment member may be spaced from the coil at a predefined spacing, and spaced apart from an inner wall of the housing or in contact with the housing inner wall.
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