公开(公告)号：US20160118241A1

公开(公告)日：2016-04-28

申请号：US14879389

申请日：2015-10-09

Applicant: Semes Co., Ltd.

Inventor： Seong Soo LEE ,  Keunje JO ,  Soon Kab KWON ,  Jong Han KIM ,  Bok Kyu LEE ,  Yoon-Jong JU

IPC: H01L21/02 ,  B08B3/10 ,  B08B3/02 ,  H01L21/67 ,  H01L21/687

CPC classification number: B08B3/102 ,  B08B3/024 ,  H01L21/67051 ,  H01L21/6715

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a housing defining a space for treating a substrate therein, a spin head supporting and rotating the substrate in the housing, a spray unit including a first nozzle member for spraying a first treating solution on the substrate placed on the spin head, and a controller controlling the spray unit. The controller sprays the first treating solution while moving the first nozzle member between edge and center regions of the substrate and above the substrate. The controller differently adjusts a first height at which the first treating solution is sprayed on the edge region of the substrate and a second height at which the first treating solution is sprayed on the center region of the substrate.

Abstract translation: 公开了一种基板处理装置。 基板处理装置包括限定用于在其中处理基板的空间的壳体，支撑并旋转基板在壳体中的旋转头，喷射单元，其包括用于将第一处理溶液喷射在放置在旋转头上的基板上的第一喷嘴构件 ，以及控制喷雾单元的控制器。 控制器喷射第一处理溶液，同时将第一喷嘴构件在衬底的边缘和中心区域之间以及衬底上方移动。 所述控制器不同地调节所述第一处理液喷射到所述基板的边缘区域上的第一高度以及所述第一处理溶液喷射到所述基板的中心区域的第二高度。

公开(公告)号：US20230158533A1

公开(公告)日：2023-05-25

申请号：US17992930

申请日：2022-11-23

Applicant: SEMES CO., LTD.

Inventor： Joo Sung LEE ,  Kang Suk LEE ,  Soon Kab KWON

IPC: B05B14/00 ,  B05B12/00 ,  B05B7/24

CPC classification number: B05B14/00 ,  B05B12/00 ,  B05B7/2486

Abstract: Proposed are a chemical liquid supply unit, a substrate processing apparatus having the same, and a chemical liquid supply method. More particularly, proposed is a technique for supplying chemical liquids of different flow rates, in which a chemical liquid is supplied at the same flow rate to each of a plurality of chemical liquid lines and the flow rate of the chemical liquid is adjusted through a flow control valve disposed on at least one chemical liquid line selected among the plurality of chemical liquid lines, so that the plurality of chemical liquid lines can supply chemical liquids at different flow rates.

公开(公告)号：US20210094055A1

公开(公告)日：2021-04-01

申请号：US17028211

申请日：2020-09-22

Applicant: SEMES CO., LTD.

Inventor： Kang Suk LEE ,  Joo Sung LEE ,  Soon Kab KWON

IPC: B05B12/10 ,  H01L21/02 ,  B08B3/08 ,  B05B12/12

Abstract: The inventive concept relates to an apparatus for treating a substrate. The apparatus includes a substrate support unit that supports the substrate, a nozzle unit that dispenses a treatment liquid onto the substrate supported on the substrate support unit, and a liquid supply unit that supplies the treatment liquid to the nozzle unit. The liquid supply unit includes a main supply line that is connected to the nozzle unit and that supplies the treatment liquid to the nozzle unit, wherein the treatment liquid is prepared by mixing a chemical with DIW at a first temperature and DIW at a second temperature higher than the first temperature, and temperature of the treatment liquid is adjusted by regulating a flow rate of the DIW at the first temperature and a flow rate of the DIW at the second temperature.