Unit for supplying fluid, apparatus and method for treating substrate with the unit

    公开(公告)号:US10109506B2

    公开(公告)日:2018-10-23

    申请号:US15604141

    申请日:2017-05-24

    Abstract: Provided is an apparatus and method for supplying a fluid. The substrate treating apparatus comprises a treating unit for treating a substrate and a fluid supply unit for supplying fluid to the treating unit, wherein the fluid supply unit comprises a supply tank in which the fluid is stored, a supply line connecting the supply tank and the treating unit to supply the fluid from the supply tank to the treating unit, a filter installed on the supply line, and an exhaust line branching from the supply line, wherein a branch point of the exhaust line in the supply line is located upstream of the filter.

    Substrate treating apparatus and substrate treating method

    公开(公告)号:US10707101B2

    公开(公告)日:2020-07-07

    申请号:US15677321

    申请日:2017-08-15

    Inventor: Heehwan Kim Sul Lee

    Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus including a spin head configured to support the substrate, a nozzle configured to discharge a chemical to the substrate located on the spin head, a first passage configured to supply a first chemical, a chemical property of which is the same as the chemical, a second passage configured to supply a second chemical, a chemical property of which is the same as the first chemical, and a discharge passage connecting the first passage and the second passage, and the nozzle.

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