公开(公告)号：US20210020412A1

公开(公告)日：2021-01-21

申请号：US16929231

申请日：2020-07-15

Applicant: Semes Co., Ltd

Inventor： Daehyun KIM ,  Saewon NA ,  Sun Joo PARK

IPC: H01J37/32 ,  H01L21/67

Abstract: An apparatus for treating a substrate includes a process chamber having a treatment space therein, a support unit that supports the substrate in the treatment space, a gas supply unit that supplies a process gas into the treatment space, an RF power supply that supplies an RF signal to excite the process gas into plasma, and a matching circuit connected between the RF power supply and the process chamber. The matching circuit includes an impedance matching device that performs impedance matching and a harmonic removal device that removes harmonics caused by the RF power supply. The matching circuit operates in a first mode when the harmonics caused by the RF power supply are sensed and in a second mode when the harmonics caused by the RF power supply are not sensed.

公开(公告)号：US20230207280A1

公开(公告)日：2023-06-29

申请号：US18147381

申请日：2022-12-28

Applicant: SEMES CO., LTD.

Inventor： Sun Joo PARK ,  Kyung Seok MIN ,  Hyun Jong SHIM ,  Sun Wook JUNG ,  Sang Min MUN ,  Ho Joong SUN

IPC: H01J37/32

CPC classification number: H01J37/32568 ,  H01J2237/0262 ,  H01J2237/334

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a housing having a treatment space, in which a substrate is treated, a support unit that supports the substrate in the treatment space, a shower plate having a through-hole, through which a process gas flows to the treatment space, a plasma source that excites plasma by exciting the process gas supplied to the treatment space, and a density adjusting member that adjusts a density of the plasma generated in the treatment space by changing a dielectric permittivity, and the density adjusting member is located on the shower plate.