SUBSTRATE TREATING APPARATUS
    1.
    发明公开

    公开(公告)号:US20230207280A1

    公开(公告)日:2023-06-29

    申请号:US18147381

    申请日:2022-12-28

    CPC classification number: H01J37/32568 H01J2237/0262 H01J2237/334

    Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a housing having a treatment space, in which a substrate is treated, a support unit that supports the substrate in the treatment space, a shower plate having a through-hole, through which a process gas flows to the treatment space, a plasma source that excites plasma by exciting the process gas supplied to the treatment space, and a density adjusting member that adjusts a density of the plasma generated in the treatment space by changing a dielectric permittivity, and the density adjusting member is located on the shower plate.

    PLASMA BOUNDARY LIMITER UNIT AND APPARATUS FOR TREATING SUBSTRATE
    2.
    发明申请
    PLASMA BOUNDARY LIMITER UNIT AND APPARATUS FOR TREATING SUBSTRATE 有权
    等离子体边界限制单元和处理基板的装置

    公开(公告)号:US20130220550A1

    公开(公告)日:2013-08-29

    申请号:US13779992

    申请日:2013-02-28

    Abstract: Provided is an apparatus for treating a substrate. The apparatus comprises a plasma boundary limiter unit disposed within a process chamber to surround a discharge space defined above a support unit. The plasma boundary limiter unit comprises a plurality of plates disposed along a circumference of the discharge space, and the plurality of plates are spaced apart from each other along the circumference of the discharge space so that a gas within the discharge space flows to the outside of the discharge space through passages provided between the adjacent plates.

    Abstract translation: 提供了一种处理基板的装置。 该装置包括设置在处理室内以围绕限定在支撑单元上方的放电空间的等离子体边界限制器单元。 等离子体边界限制器单元包括沿着放电空间的圆周布置的多个板,并且多个板沿着放电空间的周边彼此间隔开,使得放电空间内的气体流到 通过设置在相邻板之间的通道的放电空间。

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