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公开(公告)号:US20240116086A1
公开(公告)日:2024-04-11
申请号:US18117524
申请日:2023-03-06
Applicant: SEMES CO., LTD.
Inventor: Yong Hyun CHOI , Woo Young KIM , Dong Gyu JIN
CPC classification number: B08B3/08 , B08B3/02 , B08B5/00 , B08B7/0071 , B08B7/04 , B08B2220/01 , F26B3/06
Abstract: A substrate processing facility includes a cleaning device for cleaning a substrate; and a drying device for drying the substrate cleaned by the cleaning device with a supercritical gas, wherein the cleaning device includes a sulfuric acid cleaning chamber.
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公开(公告)号:US20160334162A1
公开(公告)日:2016-11-17
申请号:US15152979
申请日:2016-05-12
Applicant: Semes Co., Ltd.
Inventor: Boong KIM , Min Sung HAN , Joo Jib PARK , Woo Young KIM
CPC classification number: F26B21/145 , F26B3/04 , F26B9/06 , F26B21/10 , F26B21/12 , F26B21/14 , H01L21/02101 , H01L21/67034 , H01L21/67051 , H01L21/67109 , H01L21/6719 , H01L21/67248 , H01L21/67253
Abstract: Disclosed is a substrate drying apparatus of substrate processing apparatus including a chamber that provides a space for processing a substrate, and a fluid supply unit that supplies a process fluid to the chamber, wherein the liquid supply unit includes a supply tank in which the fluid is stored, a supply line that connects the supply tank and the chamber, a branch line branched from a first point of the supply line and connected to a second point of the supply line, and a temperature control unit that adjusts the temperature of the fluid such that the temperatures of the fluids flowing through the supply line and the branch line between the first point and the second point are different.
Abstract translation: 本发明公开了一种基板处理装置的基板干燥装置,其包括:提供用于处理基板的空间的室;以及向该室供给处理流体的流体供给单元,其中,所述液体供给单元包括: 存储有连接供应罐和室的供应管线,从供应管线的第一点分支并连接到供应管线的第二点的分支管线以及调节流体温度的温度控制单元 流经供应管线的流体和第一点与第二点之间的分支管线的温度不同。
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公开(公告)号:US20220246452A1
公开(公告)日:2022-08-04
申请号:US17726721
申请日:2022-04-22
Applicant: Semes Co., Ltd
Inventor: Sangmin LEE , Woo Young KIM , Joo Jib PARK , Boong KIM
IPC: H01L21/67 , H01L21/687 , H01L21/673 , H01L21/02
Abstract: Provided are an apparatus and a method for treating a substrate at a high-pressure atmosphere. The apparatus for treating the substrate includes a first body and a second body combined with each other to define a treatment space in which the substrate is treated, a sealing member interposed between the first body and the second body to seal the treatment space from an outside at a position in which the first body is in close contact with the second body, and a driving member to drive the first body or the second body such that the treatment space is open or closed. The sealing member is positioned in a sealing groove formed in the first body. The sealing member is deformed to be in close contact with the second body by pressure of the treatment space when a process is performed.
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