公开(公告)号：US20180061641A1

公开(公告)日：2018-03-01

申请号：US15681314

申请日：2017-08-18

Applicant: SEMES CO., LTD.

Inventor： YOUNG CHOI ,  KYUNG RAN KWON ,  JUNG YUL LEE ,  MIN JUNG PARK

IPC: H01L21/033 ,  H01L21/67

CPC classification number: H01L21/0337 ,  H01L21/0271 ,  H01L21/67069 ,  H01L21/6708 ,  H01L21/67098 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196

Abstract: Disclosed is an apparatus for treating a substrate. The apparatus includes a process executing module and a controller. The process executing module includes a plurality of process chambers, and a transfer chamber provided with a main robot configured to transfer the substrate between the process chambers. The controller controls the process executing module to sequentially perform a first coating process of forming a first coating layer by supplying a first coating liquid onto the substrate having a pattern, an etching process of removing the first coating layer, by supplying a chemical to the substrate, and a second coating process of forming a second coating layer by supplying a second coating liquid onto the substrate. The process chambers include a first chamber configured to perform the first coating process, and a second chamber configured to perform the second coating process.

公开(公告)号：US20210082700A1

公开(公告)日：2021-03-18

申请号：US17107008

申请日：2020-11-30

Applicant: SEMES CO., LTD.

Inventor： YOUNG CHOI ,  KYUNG RAN KWON ,  JUNG YUL LEE ,  MIN JUNG PARK

IPC: H01L21/033 ,  H01L21/027 ,  H01L21/67

Abstract: Disclosed is an apparatus for treating a substrate. The apparatus includes a process executing module and a controller. The process executing module includes a plurality of process chambers, and a transfer chamber provided with a main robot configured to transfer the substrate between the process chambers. The controller controls the process executing module to sequentially perform a first coating process of forming a first coating layer by supplying a first coating liquid onto the substrate having a pattern, an etching process of removing the first coating layer, by supplying a chemical to the substrate, and a second coating process of forming a second coating layer by supplying a second coating liquid onto the substrate. The process chambers include a first chamber configured to perform the first coating process, and a second chamber configured to perform the second coating process.