公开(公告)号：US20220163900A1

公开(公告)日：2022-05-26

申请号：US17531941

申请日：2021-11-22

Applicant: SEMES CO., LTD.

Inventor： KI SANG EUM ,  JUNG YUL LEE ,  SUN WOOK JUNG ,  YANG YEOL RYU

IPC: G03F7/20

Abstract: An apparatus for treating a substrate includes a processing container having an inner space; a support unit having a support plate configured to support and rotate the substrate in the inner space; a liquid supply unit configured to supply treating liquid to the substrate supported by the support unit; and an exhaust unit configured to exhaust an air flow in the inner space, wherein the exhaust unit includes an air flow guide duct guiding a flow direction of an air flow flowing on the substrate to an outer side of the substrate due to a rotation of the substrate supported by the support unit, and the air flow guide duct having an inlet into which an air flow is introduced, the inlet provided at a substantially same level with the substrate supported by the support unit.

公开(公告)号：US20210082700A1

公开(公告)日：2021-03-18

申请号：US17107008

申请日：2020-11-30

Applicant: SEMES CO., LTD.

Inventor： YOUNG CHOI ,  KYUNG RAN KWON ,  JUNG YUL LEE ,  MIN JUNG PARK

IPC: H01L21/033 ,  H01L21/027 ,  H01L21/67

Abstract: Disclosed is an apparatus for treating a substrate. The apparatus includes a process executing module and a controller. The process executing module includes a plurality of process chambers, and a transfer chamber provided with a main robot configured to transfer the substrate between the process chambers. The controller controls the process executing module to sequentially perform a first coating process of forming a first coating layer by supplying a first coating liquid onto the substrate having a pattern, an etching process of removing the first coating layer, by supplying a chemical to the substrate, and a second coating process of forming a second coating layer by supplying a second coating liquid onto the substrate. The process chambers include a first chamber configured to perform the first coating process, and a second chamber configured to perform the second coating process.

公开(公告)号：US20180061649A1

公开(公告)日：2018-03-01

申请号：US15681347

申请日：2017-08-19

Applicant: SEMES CO., LTD.

Inventor： MIN JUNG PARK ,  JUNG YUL LEE ,  HYUN HEE LEE ,  SOO HYUN CHO

IPC: H01L21/302 ,  H01L21/683 ,  H01L21/02 ,  H01L21/311 ,  H01L21/67 ,  F26B5/04

Abstract: Disclosed are an apparatus and a method for treating a substrate. The method includes repeatedly rotating the substrate alternately at a first speed and at a second speed while the treatment liquid is supplied, and the second speed is higher than the first speed.

公开(公告)号：US20210373440A1

公开(公告)日：2021-12-02

申请号：US17336261

申请日：2021-06-01

Applicant: SEMES CO., LTD.

Inventor： MIN JUNG PARK ,  JUNG YUL LEE

IPC: G03F7/16 ,  B05B1/02

Abstract: The inventive concept provides a method for treating a substrate. In the substrate treating method, a liquid film is formed by supplying a treatment liquid to the rotating substrate, and a wetting medium is sprayed in a form of fine particles to the substrate to help diffusion of the liquid film.

公开(公告)号：US20180061641A1

公开(公告)日：2018-03-01

申请号：US15681314

申请日：2017-08-18

Applicant: SEMES CO., LTD.

Inventor： YOUNG CHOI ,  KYUNG RAN KWON ,  JUNG YUL LEE ,  MIN JUNG PARK

IPC: H01L21/033 ,  H01L21/67

CPC classification number: H01L21/0337 ,  H01L21/0271 ,  H01L21/67069 ,  H01L21/6708 ,  H01L21/67098 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196

Abstract: Disclosed is an apparatus for treating a substrate. The apparatus includes a process executing module and a controller. The process executing module includes a plurality of process chambers, and a transfer chamber provided with a main robot configured to transfer the substrate between the process chambers. The controller controls the process executing module to sequentially perform a first coating process of forming a first coating layer by supplying a first coating liquid onto the substrate having a pattern, an etching process of removing the first coating layer, by supplying a chemical to the substrate, and a second coating process of forming a second coating layer by supplying a second coating liquid onto the substrate. The process chambers include a first chamber configured to perform the first coating process, and a second chamber configured to perform the second coating process.