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公开(公告)号:US20230166285A1
公开(公告)日:2023-06-01
申请号:US18060030
申请日:2022-11-30
申请人: SEMES CO., LTD.
发明人: Yun Sang Kim , Yoon Seok Choi , Young Dae Chung , Soon-Cheon Cho , Se Hoon Oh
CPC分类号: B05C5/02 , B05C13/02 , H05B6/78 , H05B6/80 , H05B2206/04
摘要: Provided are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes: a chamber for providing a processing space; a substrate support unit provided in the processing space to support a substrate and rotate the substrate; a liquid supply unit including a chemical liquid discharge nozzle that discharges a chemical liquid to the substrate supported by the substrate support unit; and a microwave applying member for emitting microwaves to the substrate.
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公开(公告)号:US20230369021A1
公开(公告)日:2023-11-16
申请号:US18135740
申请日:2023-04-18
申请人: SEMES CO., LTD.
发明人: Yoon Seok Choi , Yun Sang Kim , Youn Gun Bong , Jae Won Shin , Jong Won Park
IPC分类号: H01J37/32
CPC分类号: H01J37/3222 , H01J37/32568 , H01J37/32229 , H01J37/32238 , H01J37/32633 , H01J2237/334
摘要: A substrate treating apparatus is provided to provide heating and plasma treatment of a substrate in a single device, and the substrate treating apparatus includes a treatment container in which a substrate is accommodated, a support member supporting the substrate in the treatment container, a plasma providing unit including an electrode generating plasma within the treatment container, and a microwave introducing unit connected to a microwave generating unit and introducing microwaves into the treatment container.
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