公开(公告)号：US20230253468A1

公开(公告)日：2023-08-10

申请号：US17650456

申请日：2022-02-09

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Zia HOSSAIN ,  Balaji PADMANABHAN ,  Christopher Lawrence REXER ,  Gordon M. GRIVNA ,  Sauvik CHOWDHURY

IPC: H01L29/423 ,  H01L29/78 ,  H01L29/40 ,  H01L29/66

CPC classification number: H01L29/4236 ,  H01L29/7813 ,  H01L29/7811 ,  H01L29/408 ,  H01L29/66734

Abstract: In one general aspect, an apparatus can include a substrate having a semiconductor region, and a trench defined in the semiconductor region and having a sidewall. The apparatus can include a shield electrode disposed in the trench and insulated from the sidewall of the trench by a shield dielectric, the shield dielectric having a low-k dielectric portion and a high-k dielectric portion. The apparatus can include a gate electrode disposed in the trench and at least partially surrounded by a gate dielectric, and an inter-electrode dielectric disposed between the shield electrode and the gate electrode.

公开(公告)号：US20240119206A1

公开(公告)日：2024-04-11

申请号：US18539697

申请日：2023-12-14

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： James Joseph VICTORY ,  Thomas NEYER ,  YunPeng XIAO ,  Hyeongwoo JANG ,  Peter DINGENEN ,  Vaclav VALENTA ,  Mehrdad BAGHAIE YAZDI ,  Christopher Lawrence REXER ,  Stanley BENCZKOWSKI ,  Thierry BORDIGNON ,  Wai Lun CHU ,  Roman SICKARUK

IPC: G06F30/31 ,  G06F30/367 ,  G06F30/392 ,  G06F30/398 ,  G06N3/04 ,  G06N3/08

CPC classification number: G06F30/31 ,  G06F30/367 ,  G06F30/392 ,  G06F30/398 ,  G06N3/04 ,  G06N3/08 ,  G06F2119/08

Abstract: Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.

公开(公告)号：US20230004700A1

公开(公告)日：2023-01-05

申请号：US17930091

申请日：2022-09-07

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： James Joseph VICTORY ,  Thomas NEYER ,  YunPeng XIAO ,  Hyeongwoo JANG ,  Peter DINGENEN ,  Vaclav VALENTA ,  Mehrdad BAGHAIE YAZDI ,  Christopher Lawrence REXER ,  Stanley BENCZKOWSKI ,  Thierry BORDIGNON ,  Wai Lun CHU ,  Roman SICKARUK

IPC: G06F30/31 ,  G06F30/367 ,  G06F30/392 ,  G06F30/398 ,  G06N3/04 ,  G06N3/08

Abstract: Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.

公开(公告)号：US20210117598A1

公开(公告)日：2021-04-22

申请号：US17076039

申请日：2020-10-21

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： James Joseph VICTORY ,  Thomas NEYER ,  YunPeng XIAO ,  Hyeongwoo JANG ,  Peter DINGENEN ,  Vaclav VALENTA ,  Tirthajyoti SARKAR ,  Mehrdad BAGHAIE YAZDI ,  Christopher Lawrence REXER ,  Stanley BENCZKOWSKI ,  Thierry BORDIGNON ,  Wai Lun CHU ,  Roman SICKARUK

IPC: G06F30/31 ,  G06F30/367 ,  G06N3/08 ,  G06N3/04

Abstract: Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.