Process of manufacturing an avalanche diode

    公开(公告)号:US10290760B2

    公开(公告)日:2019-05-14

    申请号:US16017492

    申请日:2018-06-25

    Abstract: In one form, a process of manufacturing an avalanche photodiode includes forming an insulating layer over an active region of a semiconductor substrate. A shallow terminal of the avalanche photodiode is defined using a first patterned mask. A first dopant is implanted through the first patterned mask and the insulating layer to form the shallow terminal. The first patterned mask is removed. A deep terminal of the avalanche photodiode is defined using second patterned mask. A second dopant is implanted through the second patterned mask and insulating layer to form the deep terminal of the avalanche photodiode. A respective terminal of at least one of the shallow terminal and the deep terminal is defined using a respective patterned mask that forms at least two regions that are spatially separated from each other with no implanted structure located in a space therebetween.

    PROCESS OF MANUFACTURING AN AVALANCHE DIODE
    3.
    发明申请

    公开(公告)号:US20180309012A1

    公开(公告)日:2018-10-25

    申请号:US16017492

    申请日:2018-06-25

    CPC classification number: H01L31/107 H01L27/1446 H01L31/022408 H01L31/1804

    Abstract: In one form, a process of manufacturing an avalanche photodiode includes forming an insulating layer over an active region of a semiconductor substrate. A shallow terminal of the avalanche photodiode is defined using a first patterned mask. A first dopant is implanted through the first patterned mask and the insulating layer to form the shallow terminal. The first patterned mask is removed. A deep terminal of the avalanche photodiode is defined using second patterned mask. A second dopant is implanted through the second patterned mask and insulating layer to form the deep terminal of the avalanche photodiode. A respective terminal of at least one of the shallow terminal and the deep terminal is defined using a respective patterned mask that forms at least two regions that are spatially separated from each other with no implanted structure located in a space therebetween.

    Semiconductor photomultiplier
    4.
    发明授权
    Semiconductor photomultiplier 有权
    半导体光电倍增管

    公开(公告)号:US09437630B2

    公开(公告)日:2016-09-06

    申请号:US14283006

    申请日:2014-05-20

    CPC classification number: H01L27/1446 H01L31/107 H01L31/115

    Abstract: The present disclosure relates to photon detectors. In particular, the present disclosure relates to high sensitivity photon detectors such as semiconductor photomultipliers. A semiconductor photomultiplier is described which comprises an array of interconnected photosensitive microcells; and at least one dark count rate (DCR) suppression element associated with the array.

    Abstract translation: 本公开涉及光子检测器。 特别地,本发明涉及诸如半导体光电倍增管的高灵敏度光子检测器。 描述了一种半导体光电倍增管,其包括互连的光敏微电池阵列; 以及与阵列相关联的至少一个暗计数率(DCR)抑制元件。

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