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公开(公告)号:US20200235332A1
公开(公告)日:2020-07-23
申请号:US16648172
申请日:2017-09-27
发明人: YUHKI KOBAYASHI , SHINICHI KAWATO , KIYOSHI MINOURA , SHINJI SHIMADA , HIROSHI TSUCHIYA , MASAHIRO MITANI , KOHZOH NAKAMURA , KATSUHIKO KISHIMOTO , YOZO NARUTAKI
IPC分类号: H01L51/52 , G02F1/1339 , G02F1/1368 , H01L51/56
摘要: In the present embodiment, a sealing agent (50) sealing two substates contains a low melting-point glass material and is adhered to each of a first substrate (10) and a second substrate (20), a barrier rib (60), which is formed in such a manner as to surround the outer periphery of an electronic element (30), is disposed between the sealing agent (50) and the electronic element (30), and between the first substrate (10) and the second substrate (20), and the sealing agent (50) is spaced apart from the barrier rib (60). As a result, a deterioration of the electronic element, caused by the heat produced when sealing, may be prevented while the electronic element formed between the two substrates is protected from moisture and oxygen.
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2.
公开(公告)号:US20200303482A1
公开(公告)日:2020-09-24
申请号:US16771590
申请日:2017-12-22
IPC分类号: H01L27/32 , H01L51/52 , G02F1/1368 , G02F1/1343 , H01L51/56 , G02F1/1339
摘要: A sealing structure according to an embodiment of the present invention is provided with: first and second substrates that are opposed to each other; an electronic element that is formed between the first and second substrates; and a sealant that closes the gap between the first and second substrates, at the outer periphery of the electronic element, wherein the sealant includes a low-melting point glass material and a plurality of spacers, and the spacers have melting points higher than the softening point of the low-melting point glass material.
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公开(公告)号:US20180047904A1
公开(公告)日:2018-02-15
申请号:US15552796
申请日:2016-02-18
发明人: YUHKI KOBAYASHI , SHINICHI KAWATO
CPC分类号: C23C4/134 , C23C14/042 , C23C14/044 , C23C14/24 , H01L21/203 , H01L51/50 , H01L2221/1052 , H01L2221/1068 , H01L2221/1042 , H01L2924/00014
摘要: A vapor deposition unit (1) includes: a vapor deposition mask (10); a limiting plate unit (20) having limiting plates (22); and a vapor deposition source (30). The vapor deposition source (30) includes: a plurality of first openings (31) for injection of vapor deposition particles; and at least one second opening (32) for pressure release, wherein each of the first openings (31) is provided in a corresponding one of limiting plate openings (23) between the limiting plates (22) in a plan view, and the at least one second opening (32) is provided in such a position as not to face the limiting plate openings (23) in a plan view.
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4.
公开(公告)号:US20190097135A1
公开(公告)日:2019-03-28
申请号:US15527065
申请日:2015-11-10
发明人: MASAHIRO ICHIHARA , EIICHI MATSUMOTO , YUHKI KOBAYASHI , KATSUHIRO KIKUCHI , SHINICHI KAWATO , TAKASHI OCHI , KAZUKI MATSUNAGA , SATOSHI INOUE
摘要: The present invention provides a vapor deposition device including a novel alignment mechanism applicable to a large substrate, a vapor deposition method, and a method for manufacturing an organic electroluminescence element. The vapor deposition device of the present invention is a vapor deposition device for performing vapor deposition while transporting a substrate in a first direction, and includes: a mask; a substrate tray including a substrate-holding portion and a guide portion protruding from the substrate-holding portion to the mask side and disposed along the first direction; at least one distance meter disposed on a first end which is one end of the mask or the guide portion; and at least one driver coupled with a second end which is the other end of the mask. The at least one distance meter is configured to measure a distance between the at least one distance meter and the guide portion or the first end when the guide portion faces the first end. The at least one driver is capable of driving the mask in a second direction perpendicular to the first direction based on the measured value of the at least one distance meter.
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公开(公告)号:US20180015493A1
公开(公告)日:2018-01-18
申请号:US15548258
申请日:2016-01-27
CPC分类号: B05B12/20 , B05B7/14 , C23C14/042 , C23C14/24 , H01L51/0002 , H01L51/0011 , H01L51/5012
摘要: In plan view, a magnet plate (10) has a first magnetic domain (11) and a second magnetic domain (12), a magnetic domain boundary line (14) is inclined to an opening side (26) and is bent or curved, and the magnet plate has magnetic fields that are generated in a respective plurality of different directions.
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公开(公告)号:US20180009190A1
公开(公告)日:2018-01-11
申请号:US15544238
申请日:2016-01-19
IPC分类号: B32B3/10 , B05B15/04 , C23C14/24 , C23C14/04 , B23K26/362 , B29C35/08 , B29C65/18 , B29C65/00 , B32B7/02 , B32B15/08 , B32B27/28 , B32B37/06 , H01L51/00 , B29L9/00 , B29K79/00 , B29L7/00
CPC分类号: B32B3/10 , B05B12/20 , B23K26/362 , B29C35/0805 , B29C65/18 , B29C66/742 , B29C2035/0838 , B29K2079/08 , B29K2995/0012 , B29L2007/00 , B29L2009/003 , B32B7/02 , B32B15/08 , B32B27/281 , B32B37/06 , B32B38/04 , B32B2307/30 , B32B2310/0843 , B32B2311/00 , B32B2379/08 , B32B2457/20 , C23C14/042 , C23C14/24 , H01L51/001 , H01L51/0011
摘要: It comprises: a film made of a resin in which an aperture pattern is formed, the aperture pattern passing through the film, the aperture being with a shape and dimension corresponding to the thin-film pattern in a pre-established region for formation of the thin-film pattern on the substrate; and a metal member that has an aperture part opposite the aperture pattern with a shape and dimension larger than the aperture pattern, the metal member being provided as a thin sheet in intimate contact with one surface of the film on an outside part of the aperture pattern of the film. The film is mutually distanced and distributed, at a position where the film does not overlap the aperture pattern, into a plurality of divided parts on one surface of the metal member.
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公开(公告)号:US20180002803A1
公开(公告)日:2018-01-04
申请号:US15541407
申请日:2015-12-28
CPC分类号: C23C14/042 , C23C16/042 , H01L51/0011 , H01L51/56
摘要: The present invention is directed to a method for manufacturing a vapor deposition mask (2) which includes a mask section (3) and a mask frame (4). The mask section (3) includes an alloy containing iron and nickel. The method includes a heat treatment step of carrying out heat treatment with respect to the mask section (3) in a state in which end parts of the mask section (3) are fixed to the mask frame (4) while tension is applied to the mask section (3).
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