公开(公告)号：US11945924B2

公开(公告)日：2024-04-02

申请号：US17766440

申请日：2020-12-17

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Songgang Chai ,  Qianfa Liu ,  Liangpeng Hao ,  Wei Liang

IPC: C08J5/18 ,  C08K7/18 ,  C08K9/06 ,  C08L27/18 ,  H05K1/03

CPC classification number: C08J5/18 ,  C08K7/18 ,  C08K9/06 ,  C08L27/18 ,  H05K1/0373 ,  C08J2327/18 ,  C08J2427/18 ,  C08J2471/02 ,  C08K2201/005 ,  C08L2201/52 ,  C08L2203/16 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/03 ,  H05K2201/0209

Abstract: The present invention relates to a fluorine-containing resin composition, and a resin vanish, a fluorine-containing dielectric sheet, a laminate, a copper clad laminate and a printed circuit board containing the same. The fluorine-containing resin composition comprises 30 wt. %-70 wt. % of a fluorine-containing polymer, 30 wt. %-70 wt. % of an inorganic filler which includes the following particle size distribution: D10 is greater than 1.5 μm; and D50 is 10-15 μm. In the present invention, the selection of an inorganic filler with a specific particle size distribution can ensure that the boards prepared by the fluorine-containing resin composition have excellent dielectric properties and voltage resistance performance, even if the inorganic filler is added in a large amount.

公开(公告)号：US10208188B2

公开(公告)日：2019-02-19

申请号：US15028578

申请日：2013-10-11

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Cuiming Du ,  Liangpeng Hao ,  Songgang Chai

IPC: B32B3/10 ,  C08K5/5398 ,  C08J5/24 ,  C08G59/40 ,  C08K13/02 ,  C08L63/00 ,  C08L83/04 ,  H05K1/03 ,  C08J5/10 ,  C08G59/06 ,  C08K3/22 ,  C08K3/36 ,  C08K5/05 ,  C08K5/39 ,  C08G59/24 ,  C08G59/68 ,  B32B15/08 ,  B32B27/20 ,  C08L61/04 ,  C08G77/12 ,  C08G77/20

Abstract: A thermosetting resin composition comprising a thermosetting resin, an inorganic filler, and an organomolybdenum compound is disclosed. The thermosetting resin composition may be used for preparing a resin vanish and a prepreg, wherein the prepreg is used for laminates and printed circuit boards.