公开(公告)号：US10053547B2

公开(公告)日：2018-08-21

申请号：US15033299

申请日：2013-11-06

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Cuiming Du ,  Songgang Chai

IPC: C08K5/5398 ,  C08K3/30 ,  C08K3/08 ,  C08J5/24 ,  C08K3/11 ,  C08K3/013 ,  C08K3/01 ,  C08L63/00 ,  C08G59/00 ,  B32B7/12 ,  C08K3/34 ,  C08K3/40 ,  C08K3/26 ,  C08K3/38 ,  C08L101/00 ,  C08K3/36 ,  C08K3/16 ,  C08K3/22 ,  C08K3/24 ,  C08K7/22 ,  C08K5/56 ,  C08G59/40 ,  C08G59/68 ,  C08K5/00 ,  C08K5/057 ,  C08K5/39

CPC classification number: C08J5/24 ,  B32B7/12 ,  B32B2260/046 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/306 ,  B32B2307/71 ,  B32B2307/714 ,  C08G59/4021 ,  C08G59/686 ,  C08J2363/00 ,  C08J2363/02 ,  C08K3/01 ,  C08K3/013 ,  C08K3/11 ,  C08K3/16 ,  C08K3/22 ,  C08K3/24 ,  C08K3/26 ,  C08K3/30 ,  C08K3/34 ,  C08K3/36 ,  C08K3/38 ,  C08K3/40 ,  C08K5/0091 ,  C08K5/057 ,  C08K5/39 ,  C08K5/5398 ,  C08K5/56 ,  C08K7/22 ,  C08K2003/0887 ,  C08K2003/2227 ,  C08K2003/3009 ,  C08L63/00 ,  C08L101/00 ,  C09D5/024 ,  C09D7/61 ,  C09D7/66 ,  C08L67/00

Abstract: The present invention relates to a thermosetting resin composition. The composition comprises from about 20 wt. % to about 70 wt. % of a thermosetting resin, from about 1 wt. % to about 30 wt. % of a curing agent, from about 0 wt. % to about 10 wt. % of an accelerant, a tungsten compound, and an inorganic filler. A prepreg may be prepared in an impregnation manner or a coating product may be prepared in a coating manner. The composition may decrease the thermal expansion coefficient of laminates and may effectively block UV light and decrease the light transmissivity.

公开(公告)号：US10208188B2

公开(公告)日：2019-02-19

申请号：US15028578

申请日：2013-10-11

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Cuiming Du ,  Liangpeng Hao ,  Songgang Chai

IPC: B32B3/10 ,  C08K5/5398 ,  C08J5/24 ,  C08G59/40 ,  C08K13/02 ,  C08L63/00 ,  C08L83/04 ,  H05K1/03 ,  C08J5/10 ,  C08G59/06 ,  C08K3/22 ,  C08K3/36 ,  C08K5/05 ,  C08K5/39 ,  C08G59/24 ,  C08G59/68 ,  B32B15/08 ,  B32B27/20 ,  C08L61/04 ,  C08G77/12 ,  C08G77/20

Abstract: A thermosetting resin composition comprising a thermosetting resin, an inorganic filler, and an organomolybdenum compound is disclosed. The thermosetting resin composition may be used for preparing a resin vanish and a prepreg, wherein the prepreg is used for laminates and printed circuit boards.

公开(公告)号：US20180346675A1

公开(公告)日：2018-12-06

申请号：US15780621

申请日：2016-09-14

Applicant: Shengyi Technology Co., Ltd.

Inventor： Wenxin Chen ,  Cuiming Du ,  Songgang Chai

IPC: C08J9/10 ,  C08J5/24 ,  C08L79/08 ,  C08L71/00 ,  C08L67/00 ,  C08L63/00 ,  C08L83/04 ,  C08K5/00

CPC classification number: B32B15/092 ,  B32B15/20 ,  B32B27/04 ,  C08J5/24 ,  C08J9/10 ,  C08J9/28 ,  C08L61/06 ,  C08L63/00 ,  H05K1/03

Abstract: A thermosetting resin composition. The composition comprises thermosetting resin, a cross-linking agent, accelerator, and a porogen. The porogen is a porogen capable of being dissolved in an organic solvent. The organic solvent is an organic solvent capable of dissolving the thermosetting resin. A mode of directly adding the dissolvable porogen to a resin system is used, tiny pores that are uniform in pore diameter can be evenly distributed in resin matrix by means of a simple process at low cost, and the high-performance composition having a low dielectric constant and low dielectric loss is obtained; the method has good applicability to a great number of resin systems; because the pore size in the system reaches a nanometer grade, performance of the final system, such as mechanical strength, thermal performance and water absorption rate, is not sacrificed.

公开(公告)号：US11945924B2

公开(公告)日：2024-04-02

申请号：US17766440

申请日：2020-12-17

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Songgang Chai ,  Qianfa Liu ,  Liangpeng Hao ,  Wei Liang

IPC: C08J5/18 ,  C08K7/18 ,  C08K9/06 ,  C08L27/18 ,  H05K1/03

CPC classification number: C08J5/18 ,  C08K7/18 ,  C08K9/06 ,  C08L27/18 ,  H05K1/0373 ,  C08J2327/18 ,  C08J2427/18 ,  C08J2471/02 ,  C08K2201/005 ,  C08L2201/52 ,  C08L2203/16 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/03 ,  H05K2201/0209

Abstract: The present invention relates to a fluorine-containing resin composition, and a resin vanish, a fluorine-containing dielectric sheet, a laminate, a copper clad laminate and a printed circuit board containing the same. The fluorine-containing resin composition comprises 30 wt. %-70 wt. % of a fluorine-containing polymer, 30 wt. %-70 wt. % of an inorganic filler which includes the following particle size distribution: D10 is greater than 1.5 μm; and D50 is 10-15 μm. In the present invention, the selection of an inorganic filler with a specific particle size distribution can ensure that the boards prepared by the fluorine-containing resin composition have excellent dielectric properties and voltage resistance performance, even if the inorganic filler is added in a large amount.

公开(公告)号：US20160264745A1

公开(公告)日：2016-09-15

申请号：US15033299

申请日：2013-11-06

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Cuiming Du ,  Songgang Chai

IPC: C08J5/24 ,  C08K3/22 ,  C08K3/36 ,  C08K3/30 ,  C08K5/56

CPC classification number: C08J5/24 ,  B32B7/12 ,  B32B2260/046 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/306 ,  B32B2307/71 ,  B32B2307/714 ,  C08G59/4021 ,  C08G59/686 ,  C08J2363/00 ,  C08J2363/02 ,  C08K3/01 ,  C08K3/013 ,  C08K3/11 ,  C08K3/16 ,  C08K3/22 ,  C08K3/24 ,  C08K3/26 ,  C08K3/30 ,  C08K3/34 ,  C08K3/36 ,  C08K3/38 ,  C08K3/40 ,  C08K5/0091 ,  C08K5/057 ,  C08K5/39 ,  C08K5/5398 ,  C08K5/56 ,  C08K7/22 ,  C08K2003/0887 ,  C08K2003/2227 ,  C08K2003/3009 ,  C08L63/00 ,  C08L101/00 ,  C09D5/024 ,  C09D7/61 ,  C09D7/66 ,  C08L67/00

Abstract: The present invention relates to a thermosetting resin composition. The composition comprises from about 20 wt. % to about 70 wt. % of a thermosetting resin, from about 1 wt. % to about 30 wt. % of a curing agent, from about 0 wt. % to about 10 wt. % of an accelerant, a tungsten compound, and an inorganic filler. A prepreg may be prepared in an impregnation manner or a coating product may be prepared in a coating manner. The composition may decrease the thermal expansion coefficient of laminates and may effectively block UV light and decrease the light transmissivity.

Abstract translation: 本发明涉及一种热固性树脂组合物。 组合物包含约20wt。 ％至约70wt。 ％的热固性树脂，约1wt。 ％至约30wt。 ％的固化剂，约0wt。 ％至约10wt。 ％的促进剂，钨化合物和无机填料。 预浸料可以以浸渍方式制备，也可以以涂布方式制备涂料。 该组合物可能会降低层压板的热膨胀系数，并可有效阻挡紫外光并降低透光率。