公开(公告)号：US20240425730A1

公开(公告)日：2024-12-26

申请号：US18385287

申请日：2023-10-30

Applicant: SHENGYI TECHNOLOGY CO.,LTD.

Inventor： Zengbiao HUANG ,  Jianlong HUANG ,  Yanhua ZHANG

IPC: C09J157/00 ,  C08K5/14 ,  C08K5/23 ,  C08K9/06 ,  C09J11/06

Abstract: The present application provides a resin composition, and the resin composition comprises the following components: (A) a resin containing unsaturated bonds, (B) an initiator, and (C) an inorganic filler which has been subjected to surface treatment by a silane coupling agent; the silane coupling agent contains a structure shown in formula (I). In the present application, the inorganic filler is subjected to surface treatment by a silane coupling agent containing the structure shown in formula (I), which can improve the binding force at the interface between the inorganic filler and the unsaturated resin matrix, and the prepared insulating adhesive film has excellent dielectric properties, good dielectric stability, and a small change amplitude of ΔDf (10 GHz) after HAST, which can be applied to a high-frequency and high-speed printed circuit board prepared by a semi-additive process or additive process.

公开(公告)号：US20230063436A1

公开(公告)日：2023-03-02

申请号：US17788966

申请日：2020-03-31

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Zengbiao HUANG ,  Huayong FAN ,  Yongjing XU ,  Jianlong HUANG ,  Naidong SHE

IPC: C08L51/06 ,  C08J5/24 ,  B32B5/02 ,  B32B5/26 ,  H05K1/03

Abstract: Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.