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公开(公告)号：US20240110027A1
公开(公告)日：2024-04-04
申请号：US18270290
申请日：2021-03-19
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Cheng LUO , Yundong MENG , Shanyin YAN
CPC classification number: C08J5/244 , C08J5/249 , C08K5/0066 , C08L33/04 , C08L47/00 , C08L53/02 , C08L71/126 , H05K1/0366 , C08J2309/06 , C08J2315/00 , C08J2333/04 , C08J2353/02 , C08J2371/12 , C08K2201/005 , C08K2201/011 , C08L2203/30 , C08L2205/035 , C08L2312/02
Abstract: The present invention relates to a thermosetting resin composition and application thereof, said thermosetting resin composition comprising: A: a styrene-butadiene-styrene triblock copolymer having a star-shaped structure; B: a linear olefin resin containing 1,2-ethylene, and a modifier thereof, C: at least one resin or small molecule compound substituted with an acrylic group; taking the total mass of component A, component B, and component C as 100%, the added amount of said component A is 3%-85%, the added amount of said component B is 10%-95%, and the added amount of said component C is 1%-70%. The resin composition provided by the present invention does not undergo phase separation under initiator conditions, and has high heat resistance and a relatively low dielectric constant and dielectric loss tangent value, and is capable of providing the desired dielectric properties and thermal reliability of a copper-clad plate.
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公开(公告)号：US20240084137A1
公开(公告)日：2024-03-14
申请号：US18266040
申请日：2021-03-19
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Dongliang LIU , Qing WANG , Junqi TANG , Jinchao DONG
Abstract: Resin composition, resin adhesive film, and application thereof. The resin composition comprises the following components in parts by weight: 80-120 parts an epoxy resin, 1-20 parts a carbodiimide compound, 30-130 parts a phenolic resin, 20-250 parts a modified polymer, and 50-500 parts silicon dioxide; where the modified polymer is selected from a polyethersulfone or a polyamide-imide resin. By means of selection and compounding of components, the present resin composition has a uniquely advantageous film forming property, effectively solves the problem of a semi-cured resin adhesive film being prone to cracking or fracture, has outstanding heat resistance, a high glass transition temperature, a high modulus, good strength and toughness, and can to form a high strength stable bond with a metal film, has uniquely advantageous reliability, can amply satisfy printed circuit board and chip packaging performance requirements, and is suitable in a variety of chip packaging processes.
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公开(公告)号：US11584851B2
公开(公告)日：2023-02-21
申请号：US17160011
申请日：2021-01-27
Applicant: Shengyi Technology Co., Ltd.
Inventor： Jianying Shi , Weifeng Yin , Yongjing Xu , Shanyin Yan
IPC: C08L71/12 , B32B7/12 , B32B15/14 , B32B15/20 , C09D171/12 , C09J171/12 , C08L9/06 , C08L9/00 , C09J109/06 , B32B15/085 , C08L47/00 , C09D147/00 , C09J147/00 , C08J5/24 , H05K1/03 , B32B5/26
Abstract: The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.
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4.发明申请公开(公告)号：US20220227942A1
公开(公告)日：2022-07-21
申请号：US17614169
申请日：2019-05-31
Applicant: Shengyi Technology Co., Ltd.
Inventor： Hongjie LI , Junqi TANG
Abstract: A resin composition, comprising: a modified maleimide resin (A), an active ester resin (B), and an epoxy resin (C); the modified maleimide resin (A) is obtained by means of reacting a maleimide compound (M) having at least two maleimide groups/molecules with an amine compound (N1) having at least one primary amine group/molecule and an amine compound (N2) having at least two primary amine groups/molecules, and the molecular weight distribution is: molecules having a molecular weight between 1000 and 4500 account for 25-60% the total number of molecules.
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公开(公告)号：US11319397B2
公开(公告)日：2022-05-03
申请号：US16633012
申请日：2017-11-02
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Minshe Su , Zhongqiang Yang
IPC: C08F279/02 , C08F299/02 , B32B15/08 , C08J5/24 , C08K3/36 , H05K1/02 , H05K1/03 , C08F222/40
Abstract: Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and another thermosetting resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the other thermosetting resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20200283575A1
公开(公告)日：2020-09-10
申请号：US16066272
申请日：2016-09-14
Applicant: Shengyi Technology Co., Ltd.
Inventor： Chane YUAN , Hongyun LUO , Wei LIN , Huayong FAN
Abstract: A silicone-modified polyphenylene ether resin containing an unsaturated double bond, and a thermosetting resin composition, a prepreg, and a laminate containing the resin. By introducing a C═C double bond and a siloxy group into an end group of polyphenylene ether, the resin combines the low dielectric property of double bond curing and the advantages such as desirable heat resistance, weatherability, flame retardancy, dielectric property, and low water absorbency of the siloxy group. The resin can provide a high-frequency, high-speed copper-clad laminate with excellent dielectric property, humidity resistance, and heat resistance that are required by the high-frequency, high-speed copper-clad laminate.
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公开(公告)号：US10723875B2
公开(公告)日：2020-07-28
申请号：US15744686
申请日：2017-08-14
Applicant: Shengyi Technology Co., Ltd.
Inventor： Xianping Zeng , Liexiang He
Abstract: The present disclosure relates to a halogen-free epoxy resin composition and a prepreg and a laminate using the same. The halogen-free epoxy resin composition comprises: (A) a halogen-free epoxy resin; (B) an active ester resin; and (C) a reactive phosphorous-containing flame retardant. The prepreg and laminate made from the halogen-free epoxy resin composition have the advantages of high inter-laminar adhesive force, low coefficient of thermal expansion and high heat-humidity resistance, and can achieve the halogen-free flame retardant purpose.
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8.发明申请公开(公告)号：US20200224026A1
公开(公告)日：2020-07-16
申请号：US16633018
申请日：2017-11-02
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Minshe SU , Zhongqiang YANG
Abstract: Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.
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9.发明申请公开(公告)号：US20200207976A1
公开(公告)日：2020-07-02
申请号：US16063079
申请日：2016-09-14
Applicant: Shengyi Technology Co., Ltd.
Inventor： Xianping ZENG , Liexiang HE , Haosheng XU
Abstract: Provided are an epoxy resin composition and a prepreg, laminated board and printed-circuit board comprising same. The epoxy resin composition comprises the following components: (A) 38-54 parts by weight of an epoxy resin comprising a DCPD structure; (B) 30-36 parts by weight of an active ester curing agent; and (C) 16-32 parts by weight of a cyanate resin, With the mutual cooperation and synergistic facilitation effects of the particular contents of the three essential components, the epoxy resin composition is obtained. Under the premise of having a high resistance to heat and humidity and a high heat resistance at the same time, the prepreg, laminated board and printed-circuit board made of the epoxy resin composition further have a low thermal expansion coefficient, a low water absorption rate and excellent dielectric properties.
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10.发明申请公开(公告)号：US20200157261A1
公开(公告)日：2020-05-21
申请号：US16631929
申请日：2017-10-19
Applicant: Shengyi Technology Co., Ltd.
Inventor： Chiji GUAN , Xianping ZENG , Guangbing CHEN , Haosheng XU
IPC: C08F212/36 , C08J5/24 , C08L23/20 , C08L9/00 , C08F236/06 , C08F212/06 , B32B15/082 , B32B15/14
Abstract: Thermosetting resin composition, prepreg, and metal foil clad laminate prepared from same. The thermosetting resin composition comprises (A): a solvent-soluble polyfunctional vinyl aromatic copolymer, the copolymer being a polyfunctional vinyl aromatic copolymer having a structural unit derived from a monomer including a divinyl aromatic compound and an ethyl vinyl aromatic compound, and (B): selected from a polybutadiene resin having a number-average molecular weight of 500 to 10,000; the content of vinyl addition across 1, 2 positions in the molecule of the polybutadiene resin being 50% or more. The prepreg and the copper foil clad laminate prepared from the thermosetting resin composition of the present invention have a good toughness, maintain a high glass-transition temperature and a low water absorption, dielectric property and heat and humidity resistance, and are suitable for use in the field of high-frequency high-speed printed circuit boards and for processing of multilayer printed circuit boards.
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