公开(公告)号：US20170321001A1

公开(公告)日：2017-11-09

申请号：US15534557

申请日：2015-05-27

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Huayang DENG ,  Zengbiao HUANG ,  Qianfa LIU ,  Zhongqiang YANG ,  Peng WANG

IPC: C08G59/66 ,  C08J5/04 ,  C08J11/04 ,  C08G59/24 ,  B32B15/092 ,  C08G59/56 ,  C08G59/50 ,  C08K3/36 ,  C08J5/24

CPC classification number: C08G59/66 ,  B32B15/092 ,  C08G59/245 ,  C08G59/504 ,  C08G59/56 ,  C08J3/243 ,  C08J5/043 ,  C08J5/24 ,  C08J11/04 ,  C08J11/16 ,  C08J11/18 ,  C08J2363/00 ,  C08J2363/02 ,  C08K3/36 ,  C08L63/00 ,  Y02W30/705 ,  Y02W30/706

Abstract: Disclosed are a resin composition, and prepreg, laminate and copper clad laminate using the same, and degrading method thereof, the resin composition comprising: an epoxy resin, a degradable amine curing agent, a degradable mercaptan curing agent and an inorganic filler. A copper clad laminate manufactured by the resin composition comprises several pieces of stacked prepreg, and copper foil arranged at one side or two sides of stacked prepreg, each of the prepreg comprising a reinforced material and the resin composition adhered thereon after soaking and drying. The present invention mixes the degradable amine curing agent and the degradable mercaptan curing agent to obtain a curing system having an adjustable reaction rate, thus facilitating process control when manufacturing the copper clad laminate, and the manufactured copper clad laminate has high overall performance and is completely degradable, thus recycling and reusing each of the effective components.

公开(公告)号：US20170342301A1

公开(公告)日：2017-11-30

申请号：US15537519

申请日：2015-05-27

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Zengbiao HUANG ,  Huayang DENG ,  Yongjing XU

IPC: C09J163/00 ,  C09J9/02 ,  C09J11/06 ,  C09J11/04 ,  C01B13/00

CPC classification number: C09J163/00 ,  C01B13/00 ,  C08G59/223 ,  C08G59/504 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C08K3/10

Abstract: The present invention provides a degradable and recyclable epoxy conductive adhesive, which comprises the following raw materials in percentage by weight: 15% to 30% of epoxy resin, 1% to 10% of a curing agent, 0.1% to 2% of a reaction diluent and 15% to 85% of a conductive filler, wherein the curing agent comprises a breakable molecular structure. According to the epoxy conductive adhesive of the present invention, after the epoxy resin in the conductive adhesive is cured by using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the conductive adhesive can be degraded in normal pressure, mild and specific conditions, the process is simple and the operation is convenient, no contamination is brought to the environment, the recycling cost is largely reduced, and the recycling of the conductive adhesive has enormous economic and environmental advantages. By using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the shear strength of the conductive adhesive is greatly increased, and the reliability and the service life of the conductive adhesive are largely improved.

公开(公告)号：US20240287282A1

公开(公告)日：2024-08-29

申请号：US18575212

申请日：2022-07-27

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Naidong SHE ,  Qianfa LIU ,  Zengbiao HUANG ,  Yongjing XU ,  Songgang CHAI ,  Yanhua ZHANG

IPC: C08K3/36 ,  C08J5/24 ,  C09D7/40 ,  C09D7/61 ,  C09J7/30 ,  C09J11/04 ,  H05K1/03

CPC classification number: C08K3/36 ,  C08J5/244 ,  C08J5/249 ,  C09D7/61 ,  C09D7/68 ,  C09D7/69 ,  C09J7/30 ,  C09J11/04 ,  C08J2363/00 ,  C08K2201/005 ,  C09J2400/166 ,  C09J2463/00 ,  H05K1/0366

Abstract: The present invention provides a resin composition and an application thereof, the resin composition comprising the following components by weight percentage: 15-39% cross-linkable curable resin and 61-85% filler, the filler being silicon dioxide prepared by means of organosilicon hydrolysis, the average particle diameter D50 of the silicon dioxide being 0.1-3 μm, the ratio of D100:D10 thereof being less than or equal to 2.5, and the purity of the silicon dioxide being greater than 99.9%. The resin composition of the present invention can make prepared adhesive films and resin-coated copper foils have relatively high tensile strength and peel strength, relatively good drilling processability, controllable fluidity, good filling ability, and higher electric strength, and can achieve finer line processing ability; it is a printed circuit board material applicable to multilayer laminates, especially a printed circuit board material for multilayer laminates of thin lines.

公开(公告)号：US20240425730A1

公开(公告)日：2024-12-26

申请号：US18385287

申请日：2023-10-30

Applicant: SHENGYI TECHNOLOGY CO.,LTD.

Inventor： Zengbiao HUANG ,  Jianlong HUANG ,  Yanhua ZHANG

IPC: C09J157/00 ,  C08K5/14 ,  C08K5/23 ,  C08K9/06 ,  C09J11/06

Abstract: The present application provides a resin composition, and the resin composition comprises the following components: (A) a resin containing unsaturated bonds, (B) an initiator, and (C) an inorganic filler which has been subjected to surface treatment by a silane coupling agent; the silane coupling agent contains a structure shown in formula (I). In the present application, the inorganic filler is subjected to surface treatment by a silane coupling agent containing the structure shown in formula (I), which can improve the binding force at the interface between the inorganic filler and the unsaturated resin matrix, and the prepared insulating adhesive film has excellent dielectric properties, good dielectric stability, and a small change amplitude of ΔDf (10 GHz) after HAST, which can be applied to a high-frequency and high-speed printed circuit board prepared by a semi-additive process or additive process.

公开(公告)号：US20230063436A1

公开(公告)日：2023-03-02

申请号：US17788966

申请日：2020-03-31

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Zengbiao HUANG ,  Huayong FAN ,  Yongjing XU ,  Jianlong HUANG ,  Naidong SHE

IPC: C08L51/06 ,  C08J5/24 ,  B32B5/02 ,  B32B5/26 ,  H05K1/03

Abstract: Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.

公开(公告)号：US20230045848A1

公开(公告)日：2023-02-16

申请号：US17789005

申请日：2020-03-31

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Huayong FAN ,  Zengbiao HUANG ,  Yongjing XU

IPC: C08L47/00 ,  C08J5/04 ,  B32B15/20

Abstract: Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.

公开(公告)号：US20210221743A1

公开(公告)日：2021-07-22

申请号：US16770004

申请日：2018-03-23

Applicant: Shengyi Technology Co., Ltd.

Inventor： Zengbiao HUANG

IPC: C04B35/583 ,  C08K5/14 ,  C08L53/02 ,  C08K5/03 ,  C08K3/36 ,  C04B35/63 ,  C08K5/00 ,  C08J5/24 ,  C01B21/064

Abstract: Provided is a boron nitride agglomerate. The boron nitride agglomerate is of a multi-stage structure formed by arranging flaky hexagonal boron nitride primary particles in three-dimensional directions through adhesion of an inorganic binder. Further provided is a method for preparing the boron nitride agglomerate. The method comprises: mixing flaky hexagonal boron nitride primary particles with an inorganic binder, and controlling the mass of the inorganic binder to account for 0.02-20% of the mass of the flaky hexagonal boron nitride primary particles, so as to obtain the boron nitride agglomerate. The boron nitride agglomerate provided can be added to thermosetting resin compositions, and resin sheets, resin composite metal foil, prepregs, laminates, metal foil-covered laminates, and printed wiring boards prepared using the same have higher boron nitride addition, high thermal conductivity, and high peel strength.

公开(公告)号：US20200332109A1

公开(公告)日：2020-10-22

申请号：US16849041

申请日：2020-04-15

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Naidong SHE ,  Zengbiao HUANG

IPC: C08L63/00 ,  C09D163/00 ,  C09D7/61 ,  B32B15/20 ,  B32B15/04 ,  B32B7/12 ,  B32B15/18

Abstract: The present disclosure provides a resin composition for a metal substrate, and a resin varnish and a metal base copper-clad laminate comprising the same. The resin composition comprises 5-40% of a main resin and 60-95% of a thermally conductive filler when the total weight of the resin composition is calculated as 100%, wherein the main resin comprises 60-90% of a flexible epoxy resin having a structure as shown in Formula I and 10-40% of a phenoxy resin when the total weight of the main resin is calculated as 100%. The resin composition provided by the present disclosure has a low modulus, can alleviate the stress generated by thermal shocks and can withstand more than 1000 thermal cycles.