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公开(公告)号：US20210002474A1
公开(公告)日：2021-01-07
申请号：US16913836
申请日：2020-06-26
发明人： Shoichi OSADA , Hiroki OISHI , Norifumi KAWAMURA , Kenji HAGIWARA , Ryuhei YOKOTA , Masahiro KANETA
IPC分类号： C08L63/00
摘要： Provided are an epoxy resin composition for semiconductor encapsulation; and a semiconductor device having a cured product of such composition. The composition has a superior curability, and a metal layer (plated layer) can be selectively and easily formed on the surface of or inside the cured product of this composition via an electroless plating treatment. The composition of the present invention contains: (A) an epoxy resin; (B) a phenolic curing agent; (C) a curing accelerator having a urea structure; (D) a laser direct structuring additive; and (E) an inorganic filler.
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公开(公告)号：US20230312909A1
公开(公告)日：2023-10-05
申请号：US18019283
申请日：2021-07-30
CPC分类号： C08L63/00 , C08K3/36 , C08K5/541 , H01L23/295 , H01L23/3142 , C08L2203/20
摘要： A thermosetting resin composition, including: a thermosetting resin; a laser direct structuring additive; an inorganic filler; and a coupling agent, wherein the coupling agent contains one or more selected from the group consisting of a triazine functional group-, isocyanate functional group-, isocyanuric acid functional group-, benzotriazole functional group-, acid anhydride functional group-, azasilacyclopentane functional group-, imidazole functional group-, and unsaturated group-containing-silane coupling agent, and is not a mercaptosilane coupling agent, an amino silane coupling agent, or an epoxy silane coupling agent.
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公开(公告)号：US20190055377A1
公开(公告)日：2019-02-21
申请号：US16027024
申请日：2018-07-03
摘要： The present invention is a thermosetting epoxy resin sheet for encapsulating a semiconductor, characterized by being a sheet formed from a composition including: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25° C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in a molecule thereof, (D) an inorganic filler, and (E) an urea-based curing accelerator. The present invention provides a thermosetting epoxy resin sheet for encapsulating a semiconductor that has excellent flexibility and good handleability in an uncured state, together with excellent storage stability and formability.
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公开(公告)号：US20220372274A1
公开(公告)日：2022-11-24
申请号：US17734325
申请日：2022-05-02
摘要： Provided are a resin composition for encapsulation that is superior in high-temperature reverse bias test (HTRB test) reliability; and a semiconductor device. The resin composition for encapsulation is used to encapsulate a power semiconductor element made of Si, SiC, GaN, Ga2O3 or diamond, and a cured product of the resin composition for encapsulation has a dielectric tangent of not larger than 0.50 when measured at 150° C. and 0.1 Hz. The semiconductor device is such that a power semiconductor element made of Si, SiC, GaN, Ga2O3 or diamond is encapsulated by the cured product of the resin composition for encapsulation.
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公开(公告)号：US20190067147A1
公开(公告)日：2019-02-28
申请号：US16040850
申请日：2018-07-20
CPC分类号： H01L23/3135 , B29C70/086 , B29C70/681 , B29C70/70 , B29K2063/00 , B29L2031/3481 , C08G59/245 , C08G59/4021 , C08G59/621 , C08L63/00 , C08L2205/02 , H01L21/561 , H01L21/565 , H01L21/78 , H01L23/293 , C08K3/36 , C08L63/04
摘要： A fiber-containing resin substrate includes a thermosetting epoxy resin-impregnated fiber base material, and an uncured resin layer formed on one side thereof formed from a composition containing: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25° C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in one molecule, (D) an inorganic filler, and (E) an urea-based curing accelerator. The fiber-containing resin substrate collectively encapsulates a semiconductor devices mounting surface or a semiconductor devices forming surface on a wafer level, even when a large-diameter wafer or a large-diameter substrate is encapsulated, to reduce warpage of the substrate or the wafer and peeling of a semiconductor device from the substrate, and to have the uncured resin layer excellent in storage stability and handleability before curing.
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公开(公告)号：US20240263004A1
公开(公告)日：2024-08-08
申请号：US18631187
申请日：2024-04-10
CPC分类号： C08L63/04 , C08G59/245 , C08K3/36 , H01L21/56 , H01L23/295 , H01L24/16 , C08L2203/206 , H01L2224/05105 , H01L2224/05193 , H01L2924/04642 , H01L2924/0503 , H01L2924/0543 , H01L2924/10253 , H01L2924/10254 , H01L2924/186
摘要： Provided are a resin composition for encapsulation that is superior in high-temperature reverse bias test (HTRB test) reliability; and a semiconductor device. The resin composition for encapsulation is used to encapsulate a power semiconductor element made of Si, SiC, GaN, Ga2O3 or diamond, and a cured product of the resin composition for encapsulation has a dielectric tangent of not larger than 0.50 when measured at 150° C. and 0.1 Hz. The semiconductor device is such that a power semiconductor element made of Si, SiC, GaN, Ga2O3 or diamond is encapsulated by the cured product of the resin composition for encapsulation.
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公开(公告)号：US20230399467A1
公开(公告)日：2023-12-14
申请号：US18203792
申请日：2023-05-31
CPC分类号： C08G73/12 , C08K5/541 , C08L79/085 , C08G2190/00 , C08L2203/16
摘要： Provided is an encapsulation resin composition that is suitable for encapsulating a semiconductor element-mounted surface of a substrate with a semiconductor element(s) mounted thereon or a semiconductor element-forming surface of a wafer with a semiconductor element(s) formed thereon, and is superior in low warpage property and grindability. The encapsulation resin composition of the present invention contains:
(A) a maleimide compound having at least one dimer acid frame-derived hydrocarbon group per molecule;
(B) a reaction initiator; and
(C) an inorganic filler surface-treated with a silane coupling agent,
wherein the component (C) has a maximum particle size of not larger than 40 μm.-
公开(公告)号：US20210024749A1
公开(公告)日：2021-01-28
申请号：US16910619
申请日：2020-06-24
摘要： Provided is a heat-curable maleimide resin composition capable of being turned into a cured product with a superior dielectric property, and allowing a plating layer(s) to be formed only at laser-irradiated parts on the surface of or inside the cured product. The heat-curable maleimide resin composition contains: (A) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; and (B) a laser direct structuring additive being a metal oxide having a spinel structure and represented by the following average composition formula (1): AB2O4 (1) wherein A represents one or more metal elements selected from iron, copper, nickel, cobalt, zinc, magnesium and manganese, B represents iron or chrome, provided that A and B do not both represent iron.
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9.发明申请公开(公告)号：US20190241696A1
公开(公告)日：2019-08-08
申请号：US16256300
申请日：2019-01-24
CPC分类号： C08G59/38 , C08G59/5073 , C08G59/62 , C08K3/36 , H01L33/56
摘要： This is to provide a thermosetting epoxy resin sheet for encapsulating a semiconductor which is excellent in flexibility in a state before curing, and good in handling property, while maintaining a high glass transition temperature after curing, and also excellent in storage stability and moldability. The thermosetting epoxy resin sheet for encapsulating a semiconductor is a material which comprises a composition containing (A) a bisphenol A type epoxy resin and/or a bisphenol F type epoxy resin each having crystallinity, (B) a polyfunctional type epoxy resin which is solid at 25° C. and other than the Component (A), (C) a phenol compound having two or more phenolic hydroxyl groups in one molecule, (D) an inorganic filler, and (E) an imidazole-based curing accelerator having a melting point of 170° C. or higher, and one or two hydroxymethyl groups in one molecule, being molded in a sheet form.
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