公开(公告)号：US20150029689A1

公开(公告)日：2015-01-29

申请号：US14328765

申请日：2014-07-11

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kei IMAFUJI ,  Katsumi YAMAZAKI ,  Noritaka KATAGIRI ,  Teruaki CHINO

IPC: H05K1/11 ,  H05K1/18 ,  H01B5/00

CPC classification number: H05K1/111 ,  H01L2224/16225 ,  H05K1/181 ,  H05K3/3426 ,  H05K3/4007 ,  H05K2201/09427 ,  H05K2201/09745 ,  H05K2201/09827 ,  H05K2201/10704 ,  Y02P70/611 ,  Y02P70/613

Abstract: A bump structure provided on an electrode pad includes a solder member, and a metal layer having a cylindrical portion covering a side surface of the solder member, the metal layer being made of a metal which is higher in melting point than the solder member. An upper part of the cylindrical portion of the metal layer is opened wide.

Abstract translation: 设置在电极焊盘上的凸块结构包括焊料构件和金属层，该金属层具有覆盖焊料构件的侧面的圆筒部，金属层由熔点高于焊料构件的金属制成。 金属层的圆筒部的上部开口宽。