公开(公告)号：US20150029689A1

公开(公告)日：2015-01-29

申请号：US14328765

申请日：2014-07-11

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kei IMAFUJI ,  Katsumi YAMAZAKI ,  Noritaka KATAGIRI ,  Teruaki CHINO

IPC: H05K1/11 ,  H05K1/18 ,  H01B5/00

CPC classification number: H05K1/111 ,  H01L2224/16225 ,  H05K1/181 ,  H05K3/3426 ,  H05K3/4007 ,  H05K2201/09427 ,  H05K2201/09745 ,  H05K2201/09827 ,  H05K2201/10704 ,  Y02P70/611 ,  Y02P70/613

Abstract: A bump structure provided on an electrode pad includes a solder member, and a metal layer having a cylindrical portion covering a side surface of the solder member, the metal layer being made of a metal which is higher in melting point than the solder member. An upper part of the cylindrical portion of the metal layer is opened wide.

Abstract translation: 设置在电极焊盘上的凸块结构包括焊料构件和金属层，该金属层具有覆盖焊料构件的侧面的圆筒部，金属层由熔点高于焊料构件的金属制成。 金属层的圆筒部的上部开口宽。

公开(公告)号：US20140146503A1

公开(公告)日：2014-05-29

申请号：US14087350

申请日：2013-11-22

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Teruaki CHINO

IPC: H05K1/11

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K3/3436 ,  H05K3/3473 ,  H05K2201/0338 ,  H01L2924/00

Abstract: There is provided a wiring substrate. The wiring substrate includes: a wiring pattern of an outermost layer; a solder resist layer having an opening portion therein, wherein a portion of the wiring pattern is exposed through the opening portion, and the exposed portion of the wiring pattern is defined as a connection pad; and a solder bump on the connection pad. The connection pad includes: a solder layer; and a metal post that is entirely covered by the solder layer, wherein a portion of the solder layer is interposed between the connection pad and the metal post.

Abstract translation: 提供了布线基板。 布线基板包括：最外层的布线图案; 其中具有开口部分的阻焊层，其中所述布线图案的一部分通过所述开口部露出，并且所述布线图案的所述露出部分被定义为连接垫; 和连接焊盘上的焊料凸块。 连接焊盘包括：焊料层; 以及完全被焊料层覆盖的金属柱，其中焊料层的一部分插入在连接焊盘和金属柱之间。