公开(公告)号：US20180233712A1

公开(公告)日：2018-08-16

申请号：US15893307

申请日：2018-02-09

Applicant: SHOWA DENKO PACKAGING CO., LTD.

Inventor： Yuji MINAMIBORI ,  Diasuke NAKAJIMA

IPC: H01M2/02 ,  B41J3/407 ,  B41M3/00 ,  B32B7/12 ,  B32B15/20 ,  B32B15/085 ,  B32B15/088 ,  B32B27/08 ,  B32B27/32 ,  B32B37/12 ,  B29C55/02 ,  B32B15/09 ,  B32B27/36 ,  B32B27/34

CPC classification number: H01M2/0287 ,  B05D1/28 ,  B05D3/0254 ,  B05D5/04 ,  B05D2201/02 ,  B05D2401/20 ,  B05D2503/00 ,  B05D2504/00 ,  B29C55/023 ,  B29K2623/12 ,  B29K2667/006 ,  B29K2677/00 ,  B29K2705/02 ,  B29L2031/3468 ,  B29L2031/712 ,  B32B7/12 ,  B32B15/085 ,  B32B15/088 ,  B32B15/09 ,  B32B15/20 ,  B32B27/08 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B37/12 ,  B32B2250/05 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2307/518 ,  B32B2457/10 ,  B32B2553/00 ,  B41J2/01 ,  B41J3/4073 ,  B41M3/00 ,  B41M5/52 ,  B41M5/5254 ,  B41M5/5263 ,  C23C22/07 ,  H01M2/0277 ,  H01M2/0285 ,  H01M10/0525

Abstract: The shape-forming packaging material is a shape-forming packaging material including a heat resistant resin layer as an outer layer, a heat fusible resin layer as an inner layer, and a metal foil layer disposed between both the layers, and is configured such that a print improving resin layer is laminated on a further outer side of the heat resistant resin layer.