ONE-COMPONENT THERMOSETTING EPOXY ADHESIVE WITH IMPROVED ADHESION

    公开(公告)号:US20190092987A1

    公开(公告)日:2019-03-28

    申请号:US16140921

    申请日:2018-09-25

    Inventor: John HANLEY

    Abstract: A one-component thermosetting epoxy resin adhesive, including a) at least one epoxy resin A having on average more than one epoxide group per molecule; b) at least one latent hardener for epoxy resins; and c) at least one carboxylic acid selected from substituted or unsubstituted succinic acid and substituted or unsubstituted phthalic acid, wherein the epoxy resin adhesive contains 1.7 to 15 mmol of the at least one carboxylic acid per 100 g of epoxy resin adhesive, and the epoxy resin adhesive has a viscosity of more than 10 000 Pas at 25° C.

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