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公开(公告)号：US20240136263A1
公开(公告)日：2024-04-25
申请号：US18064404
申请日：2022-12-12
发明人： Hung-Kai WANG , Yih-Jenn JIANG , Don-Son JIANG , Yu-Lung HUANG , Men-Yeh CHIANG
IPC分类号： H01L23/498 , H01L25/10 , H01L25/16
CPC分类号： H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L23/49866 , H01L25/105 , H01L25/162 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058
摘要： An electronic package is provided, in which a first electronic module and a second electronic module are stacked via a plurality of first conductive structures and a plurality of second conductive structures, and the amount of solder of the first conductive structures is greater than the amount of solder of the second conductive structures, such that the electronic package can be configured with the first conductive structures and the second conductive structures according to the degree of warpage of the electronic package, so as to effectively disperse the stress to avoid the problem of warpage.
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公开(公告)号：US20240153884A1
公开(公告)日：2024-05-09
申请号：US18148440
申请日：2022-12-30
发明人： Yi-Min FU , Hung-Kai WANG , Chi-Ching HO , Yih-Jenn JIANG , Yu-Po WANG
IPC分类号： H01L23/552 , H01L23/00 , H01L23/31 , H01L23/498
CPC分类号： H01L23/552 , H01L23/3128 , H01L23/49816 , H01L24/16 , H01L24/73 , H01L2224/04105 , H01L2224/12105 , H01L2224/48091 , H01L2924/15311 , H01L2924/181
摘要： An electronic package is provided, in which a first electronic element and a second electronic element stacked on each other are embedded in a cladding layer, a circuit structure electrically connected to the second electronic element is formed on the cladding layer, and a passive element and a package module are disposed on the circuit structure, so as to shorten the transmission distance of electrical signals between the package module and the second electronic element.
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公开(公告)号：US20240234272A9
公开(公告)日：2024-07-11
申请号：US18064404
申请日：2022-12-12
发明人： Hung-Kai WANG , Yih-Jenn JIANG , Don-Son JIANG , Yu-Lung HUANG , Men-Yeh CHIANG
IPC分类号： H01L23/498 , H01L25/10 , H01L25/16
CPC分类号： H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L23/49866 , H01L25/105 , H01L25/162 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058
摘要： An electronic package is provided, in which a first electronic module and a second electronic module are stacked via a plurality of first conductive structures and a plurality of second conductive structures, and the amount of solder of the first conductive structures is greater than the amount of solder of the second conductive structures, such that the electronic package can be configured with the first conductive structures and the second conductive structures according to the degree of warpage of the electronic package, so as to effectively disperse the stress to avoid the problem of warpage.
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公开(公告)号：US20240055402A1
公开(公告)日：2024-02-15
申请号：US18063399
申请日：2022-12-08
发明人： Lung-Yuan WANG , Feng KAO , Chiu-Ling CHEN , Hung-Kai WANG
IPC分类号： H01L25/065 , H01L21/48 , H01L23/31 , H01L23/498 , H01L23/00
CPC分类号： H01L25/0657 , H01L21/486 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/73 , H01L24/81 , H01L2224/81815 , H01L2224/73204
摘要： An electronic package is provided, in which a stacking component and a plurality of conductive pillars are embedded in a packaging layer, and a routing structure is formed on the packaging layer, where the stacking component is formed by stacking a first electronic module and a second electronic module on each other, and a plurality of first conductive vias and a plurality of second conductive vias are served as the electrical connection paths between the first electronic module and the second electronic module, such that the transmission distance of electrical signals between a first electronic element in the first electronic module and a second electronic element in the second electronic module can be reduced.
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