-
公开(公告)号：US20240264389A1
公开(公告)日：2024-08-08
申请号：US18310635
申请日：2023-05-02
发明人： Chao-Chiang PU , Chi-Ching HO , Yi-Min FU , Che-Yu LEE , Po-Yuan SU
CPC分类号： G02B6/4243 , G02B6/4251 , H01L23/3185 , H01L24/19 , H01L24/20 , H01L25/16 , H01L2224/19 , H01L2224/211 , H01L2224/215 , H01L2924/01029
摘要： An electronic package and the manufacturing method thereof are provided, in which a photonic element and an electronic element are embedded in an encapsulation layer, and the photonic element has an external contact area exposed from the encapsulation layer, such that signals of the electronic element can be directly transmitted to an optical fiber via the external contact area of the photonic element to achieve the purpose of photoelectric integration.
-
公开(公告)号：US20240290701A1
公开(公告)日：2024-08-29
申请号：US18644953
申请日：2024-04-24
发明人： Yi-Min FU , Chi-Ching HO , Cheng-Yu KANG , Yu-Po WANG
IPC分类号： H01L23/498 , H01L21/48 , H01L23/00 , H01L23/367
CPC分类号： H01L23/49822 , H01L21/4857 , H01L21/486 , H01L23/367 , H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L24/73 , H01L2224/73204 , H01L2924/3511
摘要： Provided is an electronic package providing a circuit structure having auxiliary circuit layers. Further, an electronic component is disposed on the circuit structure and electrically connected to the auxiliary circuit layers. In addition, an encapsulant covers the electronic component, and the circuit structure is disposed on the package substrate having a plurality of main circuit layers, such that the main circuit layers are electrically connected to the auxiliary circuit layers. As such, a number of layers of the auxiliary circuit layers is used to replace a layer number configuration of the main circuit layers.
-
公开(公告)号：US20240274519A1
公开(公告)日：2024-08-15
申请号：US18643424
申请日：2024-04-23
发明人： Yi-Min FU , Chi-Ching HO , Cheng-Yu KANG , Yu-Po WANG
IPC分类号： H01L23/498 , H01L21/48 , H01L23/00 , H01L23/367
CPC分类号： H01L23/49822 , H01L21/4857 , H01L21/486 , H01L23/367 , H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L24/73 , H01L2224/73204 , H01L2924/3511
摘要： Provided is an electronic package providing a circuit structure having auxiliary circuit layers. Further, an electronic component is disposed on the circuit structure and electrically connected to the auxiliary circuit layers. In addition, an encapsulant covers the electronic component, and the circuit structure is disposed on the package substrate having a plurality of main circuit layers, such that the main circuit layers are electrically connected to the auxiliary circuit layers. As such, a number of layers of the auxiliary circuit layers is used to replace a layer number configuration of the main circuit layers.
-
公开(公告)号：US20240363545A1
公开(公告)日：2024-10-31
申请号：US18352952
申请日：2023-07-14
发明人： Che-Yu LEE , Chi-Ching HO , Chao-Chiang PU , Yi-Min FU , Po-Yuan SU
IPC分类号： H01L23/544 , H01L21/8254 , H01L23/00 , H01L23/498
CPC分类号： H01L23/544 , H01L21/8254 , H01L23/49816 , H01L24/09 , H01L2223/54453 , H01L2223/5448 , H01L2223/54486 , H01L2224/0951
摘要： An electronic package and a manufacturing method thereof are provided, in which a full-panel wafer is provided and includes a plurality of electronic bodies arranged in an array at intervals, a plurality of trenches are formed across the electronic bodies along a first direction on the full-panel wafer, so that the trenches on a single electronic body are arranged parallel to each other at interval and along a second direction perpendicular to the first direction. Then, in a singulation process, any trench can be selected for cutting to obtain a plurality of electronic elements of a required size. Finally, each of the electronic elements is disposed on a packaging region of a carrier structure, so that each of the electronic elements is electrically connected to at least a portion of electrical contact pads in the packaging region.
-
公开(公告)号：US20240153884A1
公开(公告)日：2024-05-09
申请号：US18148440
申请日：2022-12-30
发明人： Yi-Min FU , Hung-Kai WANG , Chi-Ching HO , Yih-Jenn JIANG , Yu-Po WANG
IPC分类号： H01L23/552 , H01L23/00 , H01L23/31 , H01L23/498
CPC分类号： H01L23/552 , H01L23/3128 , H01L23/49816 , H01L24/16 , H01L24/73 , H01L2224/04105 , H01L2224/12105 , H01L2224/48091 , H01L2924/15311 , H01L2924/181
摘要： An electronic package is provided, in which a first electronic element and a second electronic element stacked on each other are embedded in a cladding layer, a circuit structure electrically connected to the second electronic element is formed on the cladding layer, and a passive element and a package module are disposed on the circuit structure, so as to shorten the transmission distance of electrical signals between the package module and the second electronic element.
-
-
-
-
搜索结果
5 条记录 (耗时 0.014 秒)
