公开(公告)号：US20240162101A1

公开(公告)日：2024-05-16

申请号：US18190344

申请日：2023-03-27

申请人： SILICONWARE PRECISION INDUSTRIES CO., LTD.

发明人： Yung-Ta LI

IPC分类号： H01L23/16 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16

CPC分类号： H01L23/16 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3185 ,  H01L24/19 ,  H01L24/20 ,  H01L25/16 ,  H01L21/561 ,  H01L24/95 ,  H01L2224/19 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2224/95001

摘要： An electronic package includes a first electronic element and a dummy die embedded in an encapsulation layer, where the dummy die is used to prevent a warpage caused by the mismatch of coefficient of thermal expansion (CTE) between the encapsulation layer and the first electronic element in the manufacturing process of large full-panel.

公开(公告)号：US20230411364A1

公开(公告)日：2023-12-21

申请号：US18310072

申请日：2023-05-01

申请人： SILICONWARE PRECISION INDUSTRIES CO., LTD.

发明人： Po-Kai HUANG ,  Yung-Ta LI

IPC分类号： H01L25/10 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L23/538 ,  H01L23/31 ,  H01L21/48

CPC分类号： H01L25/105 ,  H01L24/32 ,  H01L24/73 ,  H01L23/49816 ,  H01L23/49838 ,  H01L25/50 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/3128 ,  H01L21/4853 ,  H01L24/16 ,  H01L23/5381 ,  H01L2224/32225 ,  H01L2225/1058 ,  H01L2225/1041 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2924/15311

摘要： An electronic package is provided and includes an electronic module and a packaging module stacked on each other, where the electronic module includes a bridge component, a plurality of conductive pillars and an encapsulation layer encapsulating the bridge component and the plurality of conductive pillars, and the packaging module includes a circuit structure and a plurality of electronic elements disposed on the circuit structure, such that the packaging module is stacked on the electronic module via a plurality of supporting elements, and the plurality of electronic elements are electrically bridged with each other via the circuit structure, the plurality of supporting elements and the bridge component. Therefore, the electronic module and the packaging module are fabricated separately to prevent the bridge component from going through too many thermal processes, thereby preventing voids of the bridge component from transferring to the packaging module.