公开(公告)号：US11705322B2

公开(公告)日：2023-07-18

申请号：US16882219

申请日：2020-05-22

Applicant: SLT Technologies, Inc

Inventor： Wenkan Jiang ,  Mark P. D'Evelyn ,  Derrick S. Kamber ,  Dirk Ehrentraut ,  Jonathan D. Cook ,  James Wenger

IPC: C30B7/10 ,  C30B7/00 ,  C30B29/40 ,  H01L29/20 ,  H01L21/02 ,  C30B33/10 ,  H01L29/778 ,  H01L33/32

CPC classification number: H01L21/02005 ,  C30B7/005 ,  C30B7/105 ,  C30B29/406 ,  C30B33/10 ,  H01L21/0254 ,  H01L21/02642 ,  H01L21/02647 ,  H01L29/2003 ,  H01L29/7788 ,  H01L33/32

Abstract: Embodiments of the present disclosure include techniques related to techniques for processing materials for manufacture of group-III metal nitride and gallium based substrates. More specifically, embodiments of the disclosure include techniques for growing large area substrates using a combination of processing techniques. Merely by way of example, the disclosure can be applied to growing crystals of GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, and others for manufacture of bulk or patterned substrates. Such bulk or patterned substrates can be used for a variety of applications including optoelectronic and electronic devices, lasers, light emitting diodes, solar cells, photo electrochemical water splitting and hydrogen generation, photodetectors, integrated circuits, and transistors, and others.