公开(公告)号：USRE48455E1

公开(公告)日：2021-03-02

申请号：US16397879

申请日：2019-04-29

申请人： Smith International, Inc.

发明人： Yuelin Shen ,  Youhe Zhang ,  Zhou Yong ,  Jiaqing Yu ,  Madapusi K. Keshavan

IPC分类号： E21B10/52 ,  E21B10/567 ,  E21B10/573

摘要： A cutting element for a drill bit includes an outer support element and an inner rotatable cutting element, a portion of which is disposed in the outer support element, where the inner rotatable cutting element has a body with a non-planar cutting face.

公开(公告)号：USRE47369E1

公开(公告)日：2019-04-30

申请号：US15599194

申请日：2017-05-18

申请人： Smith International, Inc.

发明人： Yuelin Shen ,  Youhe Zhang ,  Zhou Yong ,  Jiaqing Yu ,  Madapusi K. Keshavan

IPC分类号： E21B10/52 ,  E21B10/567 ,  E21B10/573 ,  E21B10/62

摘要： A cutting element for a drill bit includes an outer support element and an inner rotatable cutting element, a portion of which is disposed in the outer support element, where the inner rotatable cutting element has a body with a non-planar cutting face.

公开(公告)号：US10076824B2

公开(公告)日：2018-09-18

申请号：US15083281

申请日：2016-03-28

申请人： Smith International, Inc.

发明人： Yuelin Shen ,  Youhe Zhang ,  Guodong Zhan

IPC分类号： B22F7/06 ,  B24D3/10 ,  C22C26/00 ,  E21B10/567 ,  E21B10/573 ,  B22F5/00 ,  B24D18/00

CPC分类号： B24D3/10 ,  B22F7/06 ,  B22F2005/002 ,  B22F2999/00 ,  B24D18/0009 ,  C22C26/00 ,  E21B10/567 ,  E21B10/5735 ,  B22F2207/03

摘要： Polycrystalline diamond constructions comprises a diamond body attached to a metallic substrate, and having an engineered metal content. The body comprises bonded together diamond crystals with a metal material disposed interstitially between the crystals. A body working surface has metal content of 2 to 8 percent that increases moving away therefrom. A transition region between the body and substrate includes metal rich and metal depleted regions having controlled metal content that provides improved thermal expansion matching/reduced residual stress. A point in the body adjacent the metal rich zone has a metal content that is at least about 3 percent by weight greater than that at a body/substrate interface. The metal depleted zone metal content increases gradually moving from the body, and has a thickness greater than 1.25 mm. Metal depleted zone metal content changes less about 4 percent per millimeter moving along the substrate.

公开(公告)号：US09683410B2

公开(公告)日：2017-06-20

申请号：US14250435

申请日：2014-04-11

申请人： Smith International, Inc

发明人： Youhe Zhang ,  Yuelin Shen ,  Yuri Burhan ,  Gregory T. Lockwood

IPC分类号： E21B10/567 ,  E21B10/573 ,  B23P15/28 ,  E21B10/52 ,  E21B10/633

CPC分类号： E21B10/567 ,  B23P15/28 ,  E21B10/52 ,  E21B10/573 ,  E21B10/633

摘要： Cutter assemblies include an outer support and a cutting element disposed therein. The cutting element is immovably attached to the outer support element. Also disclosed is downhole tools incorporating such cutter assemblies and methods of making such downhole tools.

公开(公告)号：US20170144272A1

公开(公告)日：2017-05-25

申请号：US15276970

申请日：2016-09-27

申请人： Smith International, Inc.

发明人： Ronald K. Eyre ,  Daniel J. Belnap ,  Youhe Zhang ,  Yuelin Shen ,  Jibin Shi ,  Yuri Yoris Burhan

IPC分类号： B24D18/00 ,  E21B10/567

CPC分类号： B24D18/0009 ,  B22F3/14 ,  B22F5/00 ,  B22F7/008 ,  B22F2005/001 ,  C04B35/52 ,  C22C26/00 ,  E21B10/46 ,  E21B10/54 ,  E21B10/567

摘要： A method of forming a cutting element may include placing a plurality of diamond particles adjacent to a substrate in a reaction cell and subjecting the plurality of diamond particles to high pressure high temperature conditions to form a polycrystalline diamond body. The polycrystalline diamond body may include a cutting face area to thickness ratio ranging from 60:16 to 500:5. The polycrystalline diamond body may have at least one dimension greater than 8 mm.

公开(公告)号：US20160229031A1

公开(公告)日：2016-08-11

申请号：US15083281

申请日：2016-03-28

申请人： Smith International, Inc.

发明人： Yuelin Shen ,  Youhe Zhang ,  Guodong Zhan

IPC分类号： B24D3/10 ,  E21B10/573

CPC分类号： B24D3/10 ,  B22F7/06 ,  B22F2005/002 ,  B22F2999/00 ,  B24D18/0009 ,  C22C26/00 ,  E21B10/567 ,  E21B10/5735 ,  B22F2207/03

摘要： Polycrystalline diamond constructions comprises a diamond body attached to a metallic substrate, and having an engineered metal content. The body comprises bonded together diamond crystals with a metal material disposed interstitially between the crystals. A body working surface has metal content of 2 to 8 percent that increases moving away therefrom. A transition region between the body and substrate includes metal rich and metal depleted regions having controlled metal content that provides improved thermal expansion matching/reduced residual stress. A point in the body adjacent the metal rich zone has a metal content that is at least about 3 percent by weight greater than that at a body/substrate interface. The metal depleted zone metal content increases gradually moving from the body, and has a thickness greater than 1.25 mm. Metal depleted zone metal content changes less about 4 percent per millimeter moving along the substrate.

公开(公告)号：US09115553B2

公开(公告)日：2015-08-25

申请号：US14048692

申请日：2013-10-08

申请人： SMITH INTERNATIONAL, INC.

发明人： Youhe Zhang ,  Yuelin Shen ,  Madapusi K. Keshavan

IPC分类号： E21B10/55 ,  E21B10/567 ,  B22F7/06 ,  B23P6/00 ,  B23P15/28 ,  C22C26/00 ,  B22F5/00

CPC分类号： E21B10/55 ,  B22F7/062 ,  B22F2005/001 ,  B22F2007/068 ,  B22F2999/00 ,  B23P6/00 ,  B23P15/28 ,  C22C26/00 ,  C22C2204/00 ,  E21B10/567 ,  Y10T29/49732 ,  B22F3/26 ,  B22F3/14

摘要： A method of re-processing used TSP material layers to form cutting elements, bits with such cutting elements mounted on their bodies, and bits having re-processed TSP material layers attached to their bodies, as well as such cutting elements and bits are provided. The method includes providing a used TSP material cutting element having a TSP material layer and substrate, or a bit having a TSP material layer attached to the bit, removing the used TSP material layer from the cutting element or bit, cutting the used TSP material layer to a new shape, if necessary, optionally re-leaching the used TSP layer and re-using the TSP material layer to form a cutting element, or in forming a bit body. The formed cutting element may be mounted on a bit body.

摘要翻译： 提供了一种重新处理使用的TSP材料层以形成切割元件的方法，具有安装在其主体上的这种切割元件的钻头以及连接到其主体上的具有重新处理的TSP材料层的钻头以及这些切割元件和钻头。 该方法包括提供具有TSP材料层和衬底的已使用的TSP材料切割元件，或者具有附接到该钻头的TSP材料层的钻头，从切割元件或钻头中去除所使用的TSP材料层，切割所使用的TSP材料层 如果需要，可选地再次浸出所使用的TSP层并重新使用TSP材料层以形成切割元件，或者形成钻头体。 成形的切割元件可以安装在钻头体上。

公开(公告)号：US20140223836A1

公开(公告)日：2014-08-14

申请号：US14257096

申请日：2014-04-21

申请人： Smith International, Inc.

发明人： Yuelin Shen ,  Youhe Zhang ,  Jibin Shi ,  Yuri Burhan ,  Gregory T. Lockwood

IPC分类号： E21B10/573

CPC分类号： E21B10/5735 ,  B22F2005/001 ,  C22C26/00 ,  C22C29/08

摘要： A cutting element may include a polycrystalline diamond layer and a reduced-CTE substrate comprising diamond particles disposed in a matrix material, wherein the diamond particles have a contiguity of 15% or less. Also, a cutting element may include a polycrystalline diamond layer and a reduced-CTE substrate comprising a matrix material, at least one diamond-filled region, and embedded diamond particles.

摘要翻译： 切割元件可以包括多晶金刚石层和包含设置在基体材料中的金刚石颗粒的还原CTE基底，其中金刚石颗粒具有15％或更小的邻接性。 此外，切割元件可以包括多晶金刚石层和包含基体材料，至少一个金刚石填充区域和嵌入金刚石颗粒的还原CTE基底。

公开(公告)号：US10480252B2

公开(公告)日：2019-11-19

申请号：US16180038

申请日：2018-11-05

申请人： Smith International, Inc.

发明人： J. Daniel Belnap ,  Georgiy Voronin ,  Feng Yu ,  Peter T. Cariveau ,  Youhe Zhang ,  Yuelin Shen ,  Guodong Zhan

IPC分类号： E21B10/55 ,  E21B10/567 ,  B01J3/06 ,  B22F5/00 ,  C22C26/00 ,  E21B10/573 ,  B24D3/10 ,  B22F3/24

摘要： The present disclosure relates to cutting elements incorporating polycrystalline diamond bodies used for subterranean drilling applications, and more particularly, to polycrystalline diamond bodies having a high diamond content which are configured to provide improved properties of thermal stability and wear resistance, while maintaining a desired degree of impact resistance, when compared to prior polycrystalline diamond bodies. In various embodiments disclosed herein, a cutting element with high diamond content includes a modified PCD structure and/or a modified interface (between the PCD body and a substrate), to provide superior performance.

公开(公告)号：US09776917B2

公开(公告)日：2017-10-03

申请号：US14802827

申请日：2015-07-17

申请人： Smith International, Inc.

发明人： Ted Tessitore ,  Anthony Griffo ,  Yuelin Shen ,  Youhe Zhang ,  Madapusi K. Keshavan

IPC分类号： C03C25/68 ,  E21B10/54 ,  C22C26/00 ,  C22C1/10 ,  B22F3/24

CPC分类号： C03C25/68 ,  B22F2003/244 ,  C22C1/1094 ,  C22C26/00 ,  E21B10/54

摘要： A cutting element includes a polycrystalline diamond layer having a cutting face and a diamond layer side surface, a substrate attached to the polycrystalline diamond layer, the substrate having a bottom surface and a substrate side surface, an interface between the diamond layer and the substrate, and a mask covering at least the bottom surface and the substrate side surface of the cutting element.