公开(公告)号：US20010026866A1

公开(公告)日：2001-10-04

申请号：US09809279

申请日：2001-03-16

Applicant: SONY CHEMICALS CORP

Inventor： Yasuhiro Suga ,  Motohide Takeichi

IPC: B32B003/00 ,  C09J001/00

CPC classification number: H01L24/28 ,  C08L2666/54 ,  C09J5/06 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/10674 ,  Y10T428/24917 ,  Y10T428/25 ,  H01L2924/00 ,  H01L2924/3512

Abstract: An anisotropically electroconductive adhesive material is configured of a thermosetting resin and electroconductive particles dispersed in the thermosetting resin, wherein a 10% modulus of compressive elasticity (E) in the electroconductive particles and the modulus of longitudinal elasticity (Enull) of the projecting electrodes of the electronic element to be connected by the anisotropically electroconductive adhesive material satisfy the below relational Formula (1). 0.02nullE/Enullnull0.5nullnull(1)

Abstract translation: 各向异性导电粘合剂材料由热固性树脂和分散在热固性树脂中的导电颗粒构成，其中导电颗粒中10％的压缩弹性模量（E）和突出电极的纵向弹性模量（E'） 通过各向异性导电粘合剂材料连接的电子元件满足下述关系式（1）。 <段落lvl =“0”> 0.02 <= E / E'<= 0.5（1）