公开(公告)号：US20190259640A1

公开(公告)日：2019-08-22

申请号：US16399193

申请日：2019-04-30

Applicant: SPTS TECHNOLOGIES LIMITED

Inventor： Gautham Ragunathan ,  David Tossell ,  Oliver Ansell

IPC: H01L21/67 ,  H01L21/683 ,  H01J37/32 ,  H01L21/78 ,  H01L21/687 ,  H01L21/3065

Abstract: An apparatus is for plasma dicing a semiconductor substrate of the type forming part of a workpiece, the workpiece further including a carrier sheet on a frame member, where the carrier sheet carries the semiconductor substrate. The apparatus includes a chamber, a plasma production device configured to produce a plasma within the chamber suitable for dicing the semiconductor substrate, a workpiece support located in the chamber for supporting the workpiece through contact with the carrier sheet, and a frame cover element configured to, in use, contact the frame member thereby clamping the carrier sheet against an auxiliary element disposed in the chamber.

公开(公告)号：US11769675B2

公开(公告)日：2023-09-26

申请号：US16399193

申请日：2019-04-30

Applicant: SPTS TECHNOLOGIES LIMITED

Inventor： Gautham Ragunathan ,  David Tossell ,  Oliver Ansell

IPC: H01L21/67 ,  H01L21/3065 ,  H01L21/687 ,  H01J37/32 ,  H01L21/78 ,  H01L21/683

CPC classification number: H01L21/67069 ,  H01J37/32623 ,  H01J37/32715 ,  H01L21/3065 ,  H01L21/6831 ,  H01L21/6836 ,  H01L21/68721 ,  H01L21/68778 ,  H01L21/68785 ,  H01L21/78 ,  H01L21/67092 ,  H01L2221/68327

Abstract: An apparatus is for plasma dicing a semiconductor substrate of the type forming part of a workpiece, the workpiece further including a carrier sheet on a frame member, where the carrier sheet carries the semiconductor substrate. The apparatus includes a chamber, a plasma production device configured to produce a plasma within the chamber suitable for dicing the semiconductor substrate, a workpiece support located in the chamber for supporting the workpiece through contact with the carrier sheet, and a frame cover element configured to, in use, contact the frame member thereby clamping the carrier sheet against an auxiliary element disposed in the chamber.

公开(公告)号：US10283381B2

公开(公告)日：2019-05-07

申请号：US15293153

申请日：2016-10-13

Applicant: SPTS Technologies Limited

Inventor： Gautham Ragunathan ,  David Tossell ,  Oliver Ansell

IPC: H01J37/32 ,  H01L21/3065 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687 ,  H01L21/78

Abstract: An apparatus is for plasma dicing a semiconductor substrate of the type forming part of a workpiece, the workpiece further including a carrier sheet on a frame member, where the carrier sheet carries the semiconductor substrate. The apparatus includes a chamber, a plasma production device configured to produce a plasma within the chamber suitable for dicing the semiconductor substrate, a workpiece support located in the chamber for supporting the workpiece through contact with the carrier sheet, and a frame cover element configured to, in use, contact the frame member thereby clamping the carrier sheet against an auxiliary element disposed in the chamber.

公开(公告)号：US20170117166A1

公开(公告)日：2017-04-27

申请号：US15293153

申请日：2016-10-13

Applicant: SPTS Technologies Limited

Inventor： Gautham Ragunathan ,  David Tossell ,  Oliver Ansell

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/78 ,  H01L21/683

CPC classification number: H01L21/67069 ,  H01J37/32623 ,  H01J37/32715 ,  H01L21/3065 ,  H01L21/67092 ,  H01L21/6831 ,  H01L21/6836 ,  H01L21/68721 ,  H01L21/68778 ,  H01L21/68785 ,  H01L21/78 ,  H01L2221/68327

Abstract: An apparatus is for plasma dicing a semiconductor substrate of the type forming part of a workpiece, the workpiece further including a carrier sheet on a frame member, where the carrier sheet carries the semiconductor substrate. The apparatus includes a chamber, a plasma production device configured to produce a plasma within the chamber suitable for dicing the semiconductor substrate, a workpiece support located in the chamber for supporting the workpiece through contact with the carrier sheet, and a frame cover element configured to, in use, contact the frame member thereby clamping the carrier sheet against an auxiliary element disposed in the chamber.