公开(公告)号：US20190259640A1

公开(公告)日：2019-08-22

申请号：US16399193

申请日：2019-04-30

Applicant: SPTS TECHNOLOGIES LIMITED

Inventor： Gautham Ragunathan ,  David Tossell ,  Oliver Ansell

IPC: H01L21/67 ,  H01L21/683 ,  H01J37/32 ,  H01L21/78 ,  H01L21/687 ,  H01L21/3065

Abstract: An apparatus is for plasma dicing a semiconductor substrate of the type forming part of a workpiece, the workpiece further including a carrier sheet on a frame member, where the carrier sheet carries the semiconductor substrate. The apparatus includes a chamber, a plasma production device configured to produce a plasma within the chamber suitable for dicing the semiconductor substrate, a workpiece support located in the chamber for supporting the workpiece through contact with the carrier sheet, and a frame cover element configured to, in use, contact the frame member thereby clamping the carrier sheet against an auxiliary element disposed in the chamber.

公开(公告)号：US11769675B2

公开(公告)日：2023-09-26

申请号：US16399193

申请日：2019-04-30

Applicant: SPTS TECHNOLOGIES LIMITED

Inventor： Gautham Ragunathan ,  David Tossell ,  Oliver Ansell

IPC: H01L21/67 ,  H01L21/3065 ,  H01L21/687 ,  H01J37/32 ,  H01L21/78 ,  H01L21/683

CPC classification number: H01L21/67069 ,  H01J37/32623 ,  H01J37/32715 ,  H01L21/3065 ,  H01L21/6831 ,  H01L21/6836 ,  H01L21/68721 ,  H01L21/68778 ,  H01L21/68785 ,  H01L21/78 ,  H01L21/67092 ,  H01L2221/68327

Abstract: An apparatus is for plasma dicing a semiconductor substrate of the type forming part of a workpiece, the workpiece further including a carrier sheet on a frame member, where the carrier sheet carries the semiconductor substrate. The apparatus includes a chamber, a plasma production device configured to produce a plasma within the chamber suitable for dicing the semiconductor substrate, a workpiece support located in the chamber for supporting the workpiece through contact with the carrier sheet, and a frame cover element configured to, in use, contact the frame member thereby clamping the carrier sheet against an auxiliary element disposed in the chamber.

公开(公告)号：US10366899B2

公开(公告)日：2019-07-30

申请号：US15626250

申请日：2017-06-19

Applicant: SPTS TECHNOLOGIES LIMITED

Inventor： Oliver J Ansell ,  David A Tossell ,  Gautham Ragunathan

IPC: H01S5/02 ,  H01L41/338 ,  H01L21/78 ,  H01L21/683 ,  H01L21/67 ,  H01L21/66 ,  H01L21/3213 ,  H01L21/3065 ,  H01J37/32

Abstract: A method is for detecting a condition associated with a final phase of a plasma dicing process. The method includes providing a non-metallic substrate having a plurality of dicing lanes defined thereon, plasma etching through the substrate along the dicing lanes, wherein during the plasma etching infrared emission emanating from at least a portion of the dicing lanes is monitored so that an increase in infrared emission from the dicing lanes is observed as the final phase of the plasma dicing operation is entered, and detecting the condition associated with the final phase of the plasma dicing from the monitored infrared emission.

公开(公告)号：US10283381B2

公开(公告)日：2019-05-07

申请号：US15293153

申请日：2016-10-13

Applicant: SPTS Technologies Limited

Inventor： Gautham Ragunathan ,  David Tossell ,  Oliver Ansell

IPC: H01J37/32 ,  H01L21/3065 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687 ,  H01L21/78

Abstract: An apparatus is for plasma dicing a semiconductor substrate of the type forming part of a workpiece, the workpiece further including a carrier sheet on a frame member, where the carrier sheet carries the semiconductor substrate. The apparatus includes a chamber, a plasma production device configured to produce a plasma within the chamber suitable for dicing the semiconductor substrate, a workpiece support located in the chamber for supporting the workpiece through contact with the carrier sheet, and a frame cover element configured to, in use, contact the frame member thereby clamping the carrier sheet against an auxiliary element disposed in the chamber.

公开(公告)号：US20170117166A1

公开(公告)日：2017-04-27

申请号：US15293153

申请日：2016-10-13

Applicant: SPTS Technologies Limited

Inventor： Gautham Ragunathan ,  David Tossell ,  Oliver Ansell

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/78 ,  H01L21/683

CPC classification number: H01L21/67069 ,  H01J37/32623 ,  H01J37/32715 ,  H01L21/3065 ,  H01L21/67092 ,  H01L21/6831 ,  H01L21/6836 ,  H01L21/68721 ,  H01L21/68778 ,  H01L21/68785 ,  H01L21/78 ,  H01L2221/68327

Abstract: An apparatus is for plasma dicing a semiconductor substrate of the type forming part of a workpiece, the workpiece further including a carrier sheet on a frame member, where the carrier sheet carries the semiconductor substrate. The apparatus includes a chamber, a plasma production device configured to produce a plasma within the chamber suitable for dicing the semiconductor substrate, a workpiece support located in the chamber for supporting the workpiece through contact with the carrier sheet, and a frame cover element configured to, in use, contact the frame member thereby clamping the carrier sheet against an auxiliary element disposed in the chamber.