公开(公告)号：US20210175122A1

公开(公告)日：2021-06-10

申请号：US17093597

申请日：2020-11-09

Applicant: SPTS Technologies Limited

Inventor： Martin Hanicinec ,  Janet Hopkins ,  Oliver Ansell

IPC: H01L21/78 ,  H01L21/3065 ,  H01L21/67

Abstract: A semiconductor wafer dicing process is disclosed for dicing a wafer into individual dies, each die comprising one integrated circuit. The process comprises: disposing a coating upon the wafer; removing at least a portion of the coating to expose regions of the wafer, along which the wafer is to be diced, to form a workpiece; disposing the workpiece upon a platen within a processing chamber; plasma treating the workpiece with a set of plasma treatment conditions to etch a portion of the exposed regions of the wafer to form a wafer groove which extends laterally beneath the coating to form an undercut; and plasma etching the workpiece with a set of plasma etch conditions, which are different to the plasma treatment conditions, to etch through the wafer and dice the wafer along the wafer groove.

公开(公告)号：US11769675B2

公开(公告)日：2023-09-26

申请号：US16399193

申请日：2019-04-30

Applicant: SPTS TECHNOLOGIES LIMITED

Inventor： Gautham Ragunathan ,  David Tossell ,  Oliver Ansell

IPC: H01L21/67 ,  H01L21/3065 ,  H01L21/687 ,  H01J37/32 ,  H01L21/78 ,  H01L21/683

CPC classification number: H01L21/67069 ,  H01J37/32623 ,  H01J37/32715 ,  H01L21/3065 ,  H01L21/6831 ,  H01L21/6836 ,  H01L21/68721 ,  H01L21/68778 ,  H01L21/68785 ,  H01L21/78 ,  H01L21/67092 ,  H01L2221/68327

Abstract: An apparatus is for plasma dicing a semiconductor substrate of the type forming part of a workpiece, the workpiece further including a carrier sheet on a frame member, where the carrier sheet carries the semiconductor substrate. The apparatus includes a chamber, a plasma production device configured to produce a plasma within the chamber suitable for dicing the semiconductor substrate, a workpiece support located in the chamber for supporting the workpiece through contact with the carrier sheet, and a frame cover element configured to, in use, contact the frame member thereby clamping the carrier sheet against an auxiliary element disposed in the chamber.

公开(公告)号：US12100619B2

公开(公告)日：2024-09-24

申请号：US17093597

申请日：2020-11-09

Applicant: SPTS Technologies Limited

Inventor： Martin Hanicinec ,  Janet Hopkins ,  Oliver Ansell

IPC: H01L21/78 ,  H01L21/3065 ,  H01L21/67

CPC classification number: H01L21/78 ,  H01L21/3065 ,  H01L21/67069 ,  H01L21/67092

Abstract: A semiconductor wafer dicing process is disclosed for dicing a wafer into individual dies, each die comprising one integrated circuit. The process comprises: disposing a coating upon the wafer; removing at least a portion of the coating to expose regions of the wafer, along which the wafer is to be diced, to form a workpiece; disposing the workpiece upon a platen within a processing chamber; plasma treating the workpiece with a set of plasma treatment conditions to etch a portion of the exposed regions of the wafer to form a wafer groove which extends laterally beneath the coating to form an undercut; and plasma etching the workpiece with a set of plasma etch conditions, which are different to the plasma treatment conditions, to etch through the wafer and dice the wafer along the wafer groove.

公开(公告)号：US11710670B2

公开(公告)日：2023-07-25

申请号：US17000243

申请日：2020-08-21

Applicant: SPTS Technologies Limited

Inventor： Oliver Ansell ,  Harry Gordon-Moys

IPC: H01L21/67 ,  H01L21/3065 ,  H01J37/32 ,  H01L21/66 ,  H01J37/22

CPC classification number: H01L22/26 ,  H01J37/222 ,  H01J37/228 ,  H01J37/32715 ,  H01L21/3065 ,  H01L21/67069 ,  H01J2237/334

Abstract: A white light illumination source can illuminate a region of a substrate to be plasma etched with an incident light beam. A camera takes successive images of the region being illuminated during a plasma etch process. Image processing techniques can be applied to the images so as to identify a location of at least one feature on the substrate and to measure a reflectivity signal at the location. The plasma etch process can be modified in response to the measured reflectivity signal at the location.

公开(公告)号：US20190259640A1

公开(公告)日：2019-08-22

申请号：US16399193

申请日：2019-04-30

Applicant: SPTS TECHNOLOGIES LIMITED

Inventor： Gautham Ragunathan ,  David Tossell ,  Oliver Ansell

IPC: H01L21/67 ,  H01L21/683 ,  H01J37/32 ,  H01L21/78 ,  H01L21/687 ,  H01L21/3065

Abstract: An apparatus is for plasma dicing a semiconductor substrate of the type forming part of a workpiece, the workpiece further including a carrier sheet on a frame member, where the carrier sheet carries the semiconductor substrate. The apparatus includes a chamber, a plasma production device configured to produce a plasma within the chamber suitable for dicing the semiconductor substrate, a workpiece support located in the chamber for supporting the workpiece through contact with the carrier sheet, and a frame cover element configured to, in use, contact the frame member thereby clamping the carrier sheet against an auxiliary element disposed in the chamber.

公开(公告)号：US20210134684A1

公开(公告)日：2021-05-06

申请号：US17000243

申请日：2020-08-21

Applicant: SPTS Technologies Limited

Inventor： Oliver Ansell ,  Harry Gordon-Moys

IPC: H01L21/66 ,  H01L21/3065 ,  H01L21/67 ,  H01J37/32 ,  H01J37/22

Abstract: A white light illumination source can illuminate a region of a substrate to be plasma etched with an incident light beam. A camera takes successive images of the region being illuminated during a plasma etch process. Image processing techniques can be applied to the images so as to identify a location of at least one feature on the substrate and to measure a reflectivity signal at the location. The plasma etch process can be modified in response to the measured reflectivity signal at the location.

公开(公告)号：US10283381B2

公开(公告)日：2019-05-07

申请号：US15293153

申请日：2016-10-13

Applicant: SPTS Technologies Limited

Inventor： Gautham Ragunathan ,  David Tossell ,  Oliver Ansell

IPC: H01J37/32 ,  H01L21/3065 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687 ,  H01L21/78

Abstract: An apparatus is for plasma dicing a semiconductor substrate of the type forming part of a workpiece, the workpiece further including a carrier sheet on a frame member, where the carrier sheet carries the semiconductor substrate. The apparatus includes a chamber, a plasma production device configured to produce a plasma within the chamber suitable for dicing the semiconductor substrate, a workpiece support located in the chamber for supporting the workpiece through contact with the carrier sheet, and a frame cover element configured to, in use, contact the frame member thereby clamping the carrier sheet against an auxiliary element disposed in the chamber.

公开(公告)号：US20170117166A1

公开(公告)日：2017-04-27

申请号：US15293153

申请日：2016-10-13

Applicant: SPTS Technologies Limited

Inventor： Gautham Ragunathan ,  David Tossell ,  Oliver Ansell

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/78 ,  H01L21/683

CPC classification number: H01L21/67069 ,  H01J37/32623 ,  H01J37/32715 ,  H01L21/3065 ,  H01L21/67092 ,  H01L21/6831 ,  H01L21/6836 ,  H01L21/68721 ,  H01L21/68778 ,  H01L21/68785 ,  H01L21/78 ,  H01L2221/68327

Abstract: An apparatus is for plasma dicing a semiconductor substrate of the type forming part of a workpiece, the workpiece further including a carrier sheet on a frame member, where the carrier sheet carries the semiconductor substrate. The apparatus includes a chamber, a plasma production device configured to produce a plasma within the chamber suitable for dicing the semiconductor substrate, a workpiece support located in the chamber for supporting the workpiece through contact with the carrier sheet, and a frame cover element configured to, in use, contact the frame member thereby clamping the carrier sheet against an auxiliary element disposed in the chamber.