公开(公告)号：US20210317592A1

公开(公告)日：2021-10-14

申请号：US17357406

申请日：2021-06-24

Applicant: SPTS TECHNOLOGIES LIMITED

Inventor： JOHN MACNEIL ,  MARTIN AYRES ,  TREVOR THOMAS

IPC: C25D17/00 ,  H01L21/67 ,  C25D17/06 ,  H01L21/677 ,  H01L21/687

Abstract: A method of processing a semiconductor wafer is provided. The method includes introducing the wafer to a main chamber via a loading port, using a transfer mechanism to transfer the wafer to a first wafer processing module in a stack so that the wafer is disposed substantially horizontally in the first wafer processing module with a front face facing upwards, and performing a processing step on the front face of the wafer in the first wafer processing module.

公开(公告)号：US20180211856A1

公开(公告)日：2018-07-26

申请号：US15876300

申请日：2018-01-22

Applicant: SPTS Technologies Limited

Inventor： JOHN MACNEIL ,  MARTIN AYRES ,  TREVOR THOMAS

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  C25D17/00 ,  C25D17/06

CPC classification number: H01L21/67196 ,  C25D17/001 ,  C25D17/004 ,  C25D17/06 ,  H01L21/2885 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/6723 ,  H01L21/67766 ,  H01L21/67769 ,  H01L21/67778 ,  H01L21/68707

Abstract: An apparatus for processing a front face of a semiconductor wafer is provided. The apparatus includes a main chamber, at least one loading port connected to the main chamber for introducing the wafer to the main chamber, at least one stack of wafer processing modules, and a transfer mechanism for transferring the wafer between the loading port and the processing modules. The at least one stack of wafer processing modules includes three or more substantially vertically stacked wafer processing modules, wherein adjacent wafer processing modules in the stack have a vertical separation of less than 50 cm, and each processing module is configured to process the wafer when disposed substantially horizontally therein with the front face of the wafer facing upwards, and at least one wafer processing module is an electrochemical wafer processing module.