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公开(公告)号：US20180050901A1
公开(公告)日：2018-02-22
申请号：US15240709
申请日：2016-08-18
Applicant: STMicroelectronics Asia Pacific Pte Ltd , STMicroelectronics S.r.l. , STMicroelectronics, Inc.
Inventor： Teck Khim Neo , Mauro Pasetti , Franco Consiglieri , Luca Molinari , Andrea Nicola Colecchia , Simon Dodd
CPC classification number: B81B7/008 , B05B1/24 , B05B17/06 , B41J2/04501 , B41J2/04541 , B41J2/04543 , B41J2/14016 , B41J2/14072 , B81B2201/05 , B81B2207/012 , B81B2207/091
Abstract: The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.
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公开(公告)号：US20180194614A1
公开(公告)日：2018-07-12
申请号：US15915454
申请日：2018-03-08
Applicant: STMicroelectronics Asia Pacific Pte Ltd , STMicroelectronics S.r.l. , STMicroelectronics, Inc.
Inventor： Teck Khim Neo , Mauro Pasetti , Franco Consiglieri , Luca Molinari , Andrea Nicola Colecchia , Simon Dodd
CPC classification number: B81B7/008 , B05B1/24 , B05B17/06 , B41J2/04501 , B41J2/04541 , B41J2/04543 , B41J2/14016 , B41J2/14072 , B81B2201/05 , B81B2207/012 , B81B2207/091
Abstract: The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.
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公开(公告)号：US09938136B2
公开(公告)日：2018-04-10
申请号：US15240709
申请日：2016-08-18
Applicant: STMicroelectronics Asia Pacific Pte Ltd , STMicroelectronics S.r.l. , STMicroelectronics, Inc.
Inventor： Teck Khim Neo , Mauro Pasetti , Franco Consiglieri , Luca Molinari , Andrea Nicola Colecchia , Simon Dodd
CPC classification number: B81B7/008 , B05B1/24 , B05B17/06 , B41J2/04501 , B41J2/04541 , B41J2/04543 , B41J2/14016 , B41J2/14072 , B81B2201/05 , B81B2207/012 , B81B2207/091
Abstract: The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.
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Patent Agency Ranking
公开(公告)号：US09873250B2
公开(公告)日：2018-01-23
申请号：US15260218
申请日：2016-09-08
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS S.R.L.
Inventor： Simon Dodd , Andrea Nicola Colecchia
CPC classification number: H01L24/09 , B41J2/14072 , B41J2/14201 , B41J2/1753 , B41J2/17546 , B41J2/17553 , B41J2002/14491 , H01L2224/0401
Abstract: Embodiments of the present disclosure are directed to a microfluidic delivery system that includes a microfluidic semiconductor die coupled to a flexible interconnect substrate to form an assembly. At least one embodiment is directed to a semiconductor die having an active surface that includes a layout that has electrically active bond pads along one side of the active surface of the die. A second side of the active surface of the die includes one or more mechanical pads.
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公开(公告)号：US20170259568A1
公开(公告)日：2017-09-14
申请号：US15260218
申请日：2016-09-08
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS S.R.L.
Inventor： Simon Dodd , Andrea Nicola Colecchia
CPC classification number: H01L24/09 , B41J2/14072 , B41J2/14201 , B41J2/1753 , B41J2/17546 , B41J2/17553 , B41J2002/14491 , H01L2224/0401
Abstract: Embodiments of the present disclosure are directed to a microfluidic delivery system that includes a microfluidic semiconductor die coupled to a flexible interconnect substrate to form an assembly. At least one embodiment is directed to a semiconductor die having an active surface that includes a layout that has electrically active bond pads along one side of the active surface of the die. A second side of the active surface of the die includes one or more mechanical pads.
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公开(公告)号：US12023919B2
公开(公告)日：2024-07-02
申请号：US18064829
申请日：2022-12-12
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Domenico Giusti , Andrea Nicola Colecchia , Gaetano Santoruvo
IPC: B41J2/03 , H10N30/074 , H10N30/20 , H10N39/00
CPC classification number: B41J2/03 , H10N30/074 , H10N30/2047 , H10N39/00
Abstract: A microfluidic device for continuous ejection of fluids includes: a semiconductor body that laterally delimits chambers; an intermediate structure which forms membranes each delimiting a top of a corresponding chamber; and a nozzle body which overlies the intermediate structure. The device includes, for each chamber: a corresponding piezoelectric actuator; a supply channel which traverses the intermediate structure and communicates with the chamber; and a nozzle which traverses the nozzle body and communicates with the supply channel. Each actuator is configured to operate i) in a resting condition such that the pressure of a fluid within the corresponding chamber causes the fluid to pass through the supply channel and become ejected from the nozzle as a continuous stream, and ii) in an active condition, where it causes a deformation of the corresponding membrane and a consequent variation of the pressure of the fluid, causing a temporary interruption of the continuous stream.
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公开(公告)号：US11541653B2
公开(公告)日：2023-01-03
申请号：US16882215
申请日：2020-05-22
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Domenico Giusti , Andrea Nicola Colecchia , Gaetano Santoruvo
IPC: B41J2/03 , H01L27/20 , H01L41/09 , H01L41/314
Abstract: A microfluidic device for continuous ejection of fluids includes: a semiconductor body that laterally delimits chambers; an intermediate structure which forms membranes each delimiting a top of a corresponding chamber; and a nozzle body which overlies the intermediate structure. The device includes, for each chamber: a corresponding piezoelectric actuator; a supply channel which traverses the intermediate structure and communicates with the chamber; and a nozzle which traverses the nozzle body and communicates with the supply channel. Each actuator is configured to operate i) in a resting condition such that the pressure of a fluid within the corresponding chamber causes the fluid to pass through the supply channel and become ejected from the nozzle as a continuous stream, and ii) in an active condition, where it causes a deformation of the corresponding membrane and a consequent variation of the pressure of the fluid, causing a temporary interruption of the continuous stream.
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公开(公告)号：US11117156B2
公开(公告)日：2021-09-14
申请号：US15601623
申请日：2017-05-22
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Domenico Giusti , Andrea Nicola Colecchia , Claudio Crippa
Abstract: A microfluidic device provided in a body accommodating a fluid containment chamber. A fluidic access channel and a drop emission channel are formed in the body and are in fluidic connection with the fluid containment chamber to form a fluidic path towards the body outside through a nozzle having an outlet section. An actuator is operatively coupled to the fluid containment chamber and is configured to cause ejection of fluid drops through the drop emission channel in an operating condition of the microfluidic device. The drop emission channel comprises a portion of reduced section having a smaller area than the outlet section of the nozzle.
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