公开(公告)号：US20160172262A1

公开(公告)日：2016-06-16

申请号：US14565484

申请日：2014-12-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yiyi MA ,  Kim-Yong GOH ,  Xueren ZHANG ,  Wei Zhen GOH

IPC: H01L23/31 ,  H01L23/482 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L24/85 ,  H01L23/3107 ,  H01L23/4822 ,  H01L23/49555 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48177 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit (IC) device includes an IC and encapsulating material surrounding the IC. Leads are coupled to the IC and extend outwardly from sides of the encapsulating material, with each lead having three contiguous exposed segments with upper and lower bends defining a Z-shape. In another example, the leads include an upper horizontal segment, lower horizontal segment, and intermediate curved segment extending upwardly from the upper horizontal segment and downwardly to the lower horizontal segment.

Abstract translation: 集成电路（IC）装置包括IC和围绕IC的封装材料。 引线耦合到IC并从封装材料的侧面向外延伸，每个引线具有三个连续的暴露段，其中上部和下部弯曲限定Z形。 在另一示例中，引线包括上水平段，下水平段和从上水平段向上延伸到下水平段的中间弯曲段。

公开(公告)号：US20160293512A1

公开(公告)日：2016-10-06

申请号：US14674156

申请日：2015-03-31

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yiyi MA ,  Kim-Yong GOH ,  Xueren ZHANG

IPC: H01L23/367 ,  H01L23/00 ,  H01L25/00 ,  H01L27/18

CPC classification number: H01L23/367 ,  H01L23/36 ,  H01L23/3738 ,  H01L23/433 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L25/50 ,  H01L27/18 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/33183 ,  H01L2924/351

Abstract: An electronic device may include a substrate, an active IC die above the substrate, and a dummy IC die above the active IC die. The electronic device may include a first adhesive layer between the active IC die and the dummy IC die, and a heat sink layer above the dummy IC die and extending laterally outwardly to define a gap between the substrate and opposing portions of the heat sink layer.

Abstract translation: 电子器件可以包括衬底，衬底上方的有源IC裸片以及有源IC裸片上的虚设IC裸片。 电子设备可以包括在有源IC管芯和虚设IC管芯之间的第一粘合剂层和位于虚设IC管芯上方的散热层，并且横向向外延伸以限定衬底和散热层的相对部分之间的间隙。