公开(公告)号：US20150332995A1

公开(公告)日：2015-11-19

申请号：US14278458

申请日：2014-05-15

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Kim-Yong GOH ,  Wing Shenq Wong

IPC: H01L23/498 ,  H01L23/31 ,  H05K1/18

CPC classification number: H05K3/3426 ,  H01L23/13 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49555 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/10757 ,  Y02P70/613 ,  Y10T29/49147 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic device may include a surface mount integrated circuit (IC) package to be attached to a printed circuit board (PCB). The surface mount IC package may include at least one IC and an encapsulating material surrounding the at least one IC and having a component receiving cavity defined therein on a bottom surface thereof to be positioned adjacent the PCB. The surface mount IC package may also include electrical leads coupled to the at least one IC and extending outwardly from the encapsulating material to be coupled to the PCB. The electronic device may also include at least one electronic component carried within the component receiving cavity and that includes electrical contacts to be coupled to the PCB.

Abstract translation: 电子设备可以包括要附着到印刷电路板（PCB）的表面贴装集成电路（IC）封装。 表面安装IC封装可以包括至少一个IC和围绕至少一个IC的封装材料，并且在其底表面上具有限定在其中的部件容纳腔，以邻近PCB定位。 表面贴装IC封装还可以包括耦合到至少一个IC并从封装材料向外延伸以耦合到PCB的电引线。 电子设备还可以包括在部件接收腔内承载的至少一个电子部件，并且包括要联接到PCB的电触点。

公开(公告)号：US20160190029A1

公开(公告)日：2016-06-30

申请号：US14585566

申请日：2014-12-30

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Kim-Yong GOH ,  Yiyi Ma ,  Xueren Zhang

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L23/367

CPC classification number: H01L23/3135 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of making an electronic device may include positioning an integrated circuit (IC) die on an upper surface of a grid array substrate having connections on a lower surface thereof and coupling respective bond pads of the IC die to the grid array with bond wires. The method may also include forming a first encapsulating layer over the IC die and bond wires and positioning a heat spreader on the substrate above the first encapsulating layer after forming the first encapsulating layer. The method may further include forming a second encapsulating layer over the first encapsulating layer and embedding the heat spreader in the second encapsulating layer.

Abstract translation: 制造电子设备的方法可以包括将集成电路（IC）裸片定位在具有在其下表面上的连接的网格阵列基板的上表面上，并且将IC芯片的各个接合焊盘与接合线连接到网格阵列。 该方法还可以包括在IC芯片上方形成第一封装层，并且在形成第一封装层之后，将第一封装层上的基板上的散热器定位在第一封装层上方的基板上。 该方法还可以包括在第一封装层上形成第二封装层，并将散热器嵌入第二封装层中。

公开(公告)号：US20160172262A1

公开(公告)日：2016-06-16

申请号：US14565484

申请日：2014-12-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yiyi MA ,  Kim-Yong GOH ,  Xueren ZHANG ,  Wei Zhen GOH

IPC: H01L23/31 ,  H01L23/482 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L24/85 ,  H01L23/3107 ,  H01L23/4822 ,  H01L23/49555 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48177 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit (IC) device includes an IC and encapsulating material surrounding the IC. Leads are coupled to the IC and extend outwardly from sides of the encapsulating material, with each lead having three contiguous exposed segments with upper and lower bends defining a Z-shape. In another example, the leads include an upper horizontal segment, lower horizontal segment, and intermediate curved segment extending upwardly from the upper horizontal segment and downwardly to the lower horizontal segment.

Abstract translation: 集成电路（IC）装置包括IC和围绕IC的封装材料。 引线耦合到IC并从封装材料的侧面向外延伸，每个引线具有三个连续的暴露段，其中上部和下部弯曲限定Z形。 在另一示例中，引线包括上水平段，下水平段和从上水平段向上延伸到下水平段的中间弯曲段。

公开(公告)号：US20160293512A1

公开(公告)日：2016-10-06

申请号：US14674156

申请日：2015-03-31

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yiyi MA ,  Kim-Yong GOH ,  Xueren ZHANG

IPC: H01L23/367 ,  H01L23/00 ,  H01L25/00 ,  H01L27/18

CPC classification number: H01L23/367 ,  H01L23/36 ,  H01L23/3738 ,  H01L23/433 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L25/50 ,  H01L27/18 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/33183 ,  H01L2924/351

Abstract: An electronic device may include a substrate, an active IC die above the substrate, and a dummy IC die above the active IC die. The electronic device may include a first adhesive layer between the active IC die and the dummy IC die, and a heat sink layer above the dummy IC die and extending laterally outwardly to define a gap between the substrate and opposing portions of the heat sink layer.

Abstract translation: 电子器件可以包括衬底，衬底上方的有源IC裸片以及有源IC裸片上的虚设IC裸片。 电子设备可以包括在有源IC管芯和虚设IC管芯之间的第一粘合剂层和位于虚设IC管芯上方的散热层，并且横向向外延伸以限定衬底和散热层的相对部分之间的间隙。