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公开(公告)号:US09777317B2
公开(公告)日:2017-10-03
申请号:US13956677
申请日:2013-08-01
Applicant: STMicroelectronics S.r.l. , bioMérieux S.A.
Inventor: Giuseppe Emanuele Spoto , Luigi Giuseppe Occhipinti , Cristian Dall'Oglio , Crocifisso Marco Antonio Renna , Laurent Drazek
CPC classification number: C12Q1/686 , B01L3/5027 , B01L2300/0816 , B01L2300/0864
Abstract: A microfluidic device (1000-1005), comprising: a semiconductor body (2) having a first side (2a) and a second side (2b) opposite to one another, and housing, at the first side, a plurality of wells (4), having a first depth; an inlet region (30) forming an entrance point for a fluid to be supplied to the wells; a main channel (6a) fluidically connected to the inlet region, and having a second depth; and a plurality of secondary channels (6b) fluidically connecting the main channel to a respective well, and having a third depth. The first depth is higher than the second depth, which in turn is higher than the third depth. According to an aspect, the microfluidic device further comprises a cover layer (8), arranged above the first side of the semiconductor body, configured for sealing the wells and provided with at least a first valve hole (54) which extends through the cover layer and overlaps, at least partially, the secondary channels; and a flexible layer (14), arranged above the cover layer and provided with at least a protrusion (74) extending through the first valve hole towards the semiconductor body and overlapping, at least partially, the secondary channels, the flexible layer being configured such that, when a pressure is applied on it, the protrusion contacts the semiconductor body and enters the secondary channels thus fluidically isolating the wells from one another.
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公开(公告)号:US11852650B2
公开(公告)日:2023-12-26
申请号:US17675501
申请日:2022-02-18
Applicant: STMICROELECTRONICS S.r.l.
Inventor: Francesco Rizzini , Nicolo' Manca , Cristian Dall'Oglio
IPC: G01P15/125 , B81B7/02 , G01P15/08 , G01P15/18
CPC classification number: G01P15/125 , B81B7/02 , G01P15/18 , B81B2201/0235 , G01P2015/082
Abstract: The present disclosure is directed to micro-electromechanical system (MEMS) accelerometers that are configured for a user interface mode and a true wireless stereo (TWS) mode of an audio device. The accelerometers are fabricated with specific electromechanical parameters, such as mass, stiffness, active capacitance, and bonding pressure. As a result of the specific electromechanical parameters, the accelerometers have a resonance frequency, quality factor, sensitivity, and Brownian noise density that are suitable for both the user interface mode and the TWS mode.
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