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246 条记录 (耗时 0.026 秒)

    Capacitance detection circuit
    2.
    发明授权
    Capacitance detection circuit 有权

    公开(公告)号：US09664719B2

    公开(公告)日：2017-05-30

    申请号：US14350808

    申请日：2012-11-19

    申请人： FUJI ELECTRIC CO., LTD.

    发明人： Masami Kishiro

    IPC分类号： G01R27/26 ,  G01P15/00 ,  H05K1/02 ,  G01D5/241 ,  G01P15/125 ,  H05K3/34 ,  G01P15/08

    CPC分类号： G01R27/2605 ,  G01D5/2417 ,  G01P15/00 ,  G01P15/125 ,  G01P2015/082 ,  G01P2015/084 ,  H05K1/0256 ,  H05K3/3452 ,  H05K2201/09972 ,  H05K2201/10151

    摘要： A capacitance detection circuit has at least a carrier signal generating circuit that supplies a carrier signal to one of a movable or a fixed electrode of a sensor, an operational amplifier with one of the movable or fixed electrode as an input and ground as another input, and a printed circuit board on which the physical quantity sensor, the carrier signal generating circuit, and the operational amplifier are mounted. An insulation-secured area on the printed circuit board is configured as a moisture absorption reduction area, including at least an electrode connection part of the physical quantity sensor, an input-side connection part of the operational amplifier, and a connection part connected to the input side of the operational amplifier out of connection parts of input-side circuit components connected between the electrode connection part and the input-side connection part.

    SENSITIVITY INSPECTION SYSTEM AND SENSITIVITY INSPECTION METHOD
    4.
    发明申请
    SENSITIVITY INSPECTION SYSTEM AND SENSITIVITY INSPECTION METHOD 审中-公开
    灵敏度检测系统和灵敏度检测方法

    公开(公告)号：US20150301076A1

    公开(公告)日：2015-10-22

    申请号：US14667884

    申请日：2015-03-25

    申请人： FUJI ELECTRIC CO., LTD.

    发明人： Minoru KAKINUMA ,  Satoru NAKAMURA

    IPC分类号： G01P15/125

    CPC分类号： G01P15/125 ,  G01P15/18 ,  G01P21/00 ,  G01P2015/082 ,  G01P2015/084

    摘要： A sensitivity inspection system for inspecting the sensitivity of an electrostatic capacitance sensor, including an output acquisition unit acquiring first and second values that are respectively the first and second outputs of the electrostatic capacitance sensor that is in an inspection state and is made inclined, a first conversion unit obtaining a first ratio of a theoretical value of the first output when first reference acceleration is applied to a theoretical value of the first output when acceleration in the first direction is applied in the inspection state, and multiplying the acquired first value by the first ratio, and a second conversion unit obtaining a second ratio of a theoretical value of the second output when second reference acceleration is applied to a theoretical value of the second output when acceleration in the second direction is applied in the inspection state, and multiplying the acquired second value by the second ratio.

    摘要翻译： 一种用于检查静电电容传感器的灵敏度的灵敏度检查系统，包括：输出获取单元，获取分别处于检查状态并被倾斜的静电电容传感器的第一和第二输出的第一和第二值;第一和第二值 转换单元，当在所述检查状态下施加在所述第一方向上的加速度时，当将第一参考加速度施加到所述第一输出的理论值时获得所述第一输出的理论值的第一比率，并将所获取的第一值乘以第一 比率，以及第二转换单元，当在检查状态下施加在第二方向上的加速度时，当将第二参考加速度施加到第二输出的理论值时获得第二输出的理论值的第二比率， 第二个值乘以第二个比例。

    Fabrication process and package design for use in a micro-machined seismometer or other device
    5.
    发明授权
    Fabrication process and package design for use in a micro-machined seismometer or other device 有权
    用于微加工地震仪或其他设备的制造工艺和封装设计

    公开(公告)号：US08978246B2

    公开(公告)日：2015-03-17

    申请号：US13007975

    申请日：2011-01-17

    申请人： William T. Pike ,  Ian Standley

    发明人： William T. Pike ,  Ian Standley

    IPC分类号： H05K3/34 ,  B29C65/00 ,  B32B37/00 ,  B32B38/04 ,  B21D39/00 ,  B23K31/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/18

    CPC分类号： G01V13/00 ,  G01P15/08 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/131 ,  G01P15/132 ,  G01P2015/0814 ,  G01P2015/082 ,  G01V1/18 ,  G01V1/181 ,  Y10T29/49002 ,  Y10T29/49144

    摘要： A method of attaching two wafers in a seismometer comprising the steps of forming a patterned wetting metal layer on a first wafer and forming a plurality of cavities mirroring the pattern of the wetting metal layer on the first wafer. The steps further include pouring a plurality of solder balls on the surface of an alignment wafer, pouring off excess solder balls, aligning the first wafer with the alignment wafer, and connecting the first wafer with the alignment wafer. The solder balls are immobilized on the wetting metal layer by performing a partial reflow onto the wetting metal layer and removing the alignment wafer. The first and second wafers are aligned so that each solder ball is immobilized between the first and second wafer. The wafers are then bonded together.

    摘要翻译： 一种在地震仪中安装两个晶片的方法，包括以下步骤：在第一晶片上形成图案化的润湿金属层，并形成多个镜像第一晶片上的润湿金属层图案的腔。 所述步骤还包括在对准晶片的表面上浇注多个焊球，排出多余的焊球，使第一晶片与对准晶片对准，以及将第一晶片与对准晶片连接。 通过对润湿金属层进行部分回流并除去对准晶片，将焊球固定在润湿金属层上。 对准第一和第二晶片，使得每个焊球固定在第一和第二晶片之间。 然后将晶片粘合在一起。

    MEMS device with stress isolation and method of fabrication
    6.
    发明授权
    MEMS device with stress isolation and method of fabrication 有权
    具有应力隔离的MEMS器件和制造方法

    公开(公告)号：US08810030B2

    公开(公告)日：2014-08-19

    申请号：US13365454

    申请日：2012-02-03

    申请人： Aaron A. Geisberger

    发明人： Aaron A. Geisberger

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： G01P15/0802 ,  B81C1/00182 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0814 ,  G01P2015/082

    摘要： A MEMS device (20) with stress isolation includes elements (28, 30, 32) formed in a first structural layer (24) and elements (68, 70) formed in a second structural layer (26), with the layer (26) being spaced apart from the first structural layer (24). Fabrication methodology (80) entails forming (92, 94, 104) junctions (72, 74) between the layers (24, 26). The junctions (72, 74) connect corresponding elements (30, 32) of the first layer (24) with elements (68, 70) of the second layer (26). The fabrication methodology (80) further entails releasing the structural layers (24, 26) from an underlying substrate (22) so that all of the elements (30, 32, 68, 70) are suspended above the substrate (22) of the MEMS device (20), wherein attachment of the elements (30, 32, 68, 70) with the substrate (22) occurs only at a central area (46) of the substrate (22).

    摘要翻译： 具有应力隔离的MEMS器件（20）包括形成在第一结构层（24）中的元件（28,30,32）和形成在第二结构层（26）中的元件（68,70），层（26） 与第一结构层（24）间隔开。 制造方法（80）需要在层（24,26）之间形成（92,94,104）结（72,74）。 接头（72,74）将第一层（24）的相应元件（30,32）与第二层（26）的元件（68,70）连接。 制造方法（80）还需要从下面的衬底（22）释放结构层（24,26），使得所有元件（30,32,68,70）都悬挂在MEMS的衬底（22）上方 装置（20），其中元件（30,32,68,70）与衬底（22）的附接仅发生在衬底（22）的中心区域（46）处。

    Laminated structure provided with movable portion
    7.
    发明授权
    Laminated structure provided with movable portion 有权
    层压结构设有可动部分

    公开(公告)号：US08707784B2

    公开(公告)日：2014-04-29

    申请号：US13047274

    申请日：2011-03-14

    申请人： Teruhisa Akashi ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Hirofumi Funabashi ,  Yoshiyuki Hata ,  Yoshiteru Omura

    发明人： Teruhisa Akashi ,  Yutaka Nonomura ,  Motohiro Fujiyoshi ,  Hirofumi Funabashi ,  Yoshiyuki Hata ,  Yoshiteru Omura

    IPC分类号： G01C19/56

    CPC分类号： G01C19/574 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/082

    摘要： A structure having a first movable portion displaced perpendicular to a substrate surface and a second movable portion displaced parallel to the substrate surface is realized by a laminated structure employing a nested structure for the first portion and the second portion. The laminated structure is provided with inner and outer movable portions. A y spring is connected to the outer portion, and the outer portion is supported in a y-axis direction by the y spring at a height apart from an outer substrate. A z spring is connected to the inner portion, and the inner portion is supported in a z-axis direction by the z spring at a height apart from the outer substrate. The outer portion and the z spring are at different heights from the substrate, and the z spring overpasses across the outer portion at a height apart from the outer movable portion.

    摘要翻译： 具有垂直于基板表面移动的第一可移动部分和平行于基板表面移动的第二可移动部分的结构通过采用用于第一部分和第二部分的嵌套结构的层压结构实现。 层叠结构设置有内部和外部可移动部分。 y弹簧连接到外部，并且外部部分通过y弹簧以与外部基板隔开的高度在y轴方向上支撑。 z弹簧连接到内部，并且内部通过z弹簧以与外基板隔开的高度在z轴方向上支撑。 外部部分和z弹簧与基板处于不同的高度，并且z弹簧在与外部可移动部分分开的高度处超过外部部分。

    Three-Dimensional Micro-Electro-Mechanical-System Sensor
    8.
    发明申请
    Three-Dimensional Micro-Electro-Mechanical-System Sensor 有权
    三维微机电系统传感器

    公开(公告)号：US20130139595A1

    公开(公告)日：2013-06-06

    申请号：US13482989

    申请日：2012-05-29

    申请人： Ming-Han Tsai ,  Chih-Ming Sun

    发明人： Ming-Han Tsai ,  Chih-Ming Sun

    IPC分类号： G01P15/125

    CPC分类号： G01P15/125 ,  G01P15/18 ,  G01P2015/082 ,  G01P2015/084 ,  G01P2015/0845

    摘要： The present invention discloses a three-dimensional micro-electro-mechanical-system sensor. The sensor includes movable first electrodes, plural movable second electrodes, plural fixed third electrodes, and plural fixed fourth electrodes. The first electrodes and their adjacent third electrodes form at least one first capacitor and at least one second capacitor, and the second electrodes and their adjacent fourth electrodes form at least one third capacitor. The capacitance change of the first capacitor reflects the displacement of the proof mass along a first axis, the capacitance change of the second capacitor reflects the displacement of the proof mass along a second axis, and the capacitance change of the third capacitor reflects the displacement of the proof mass along a third axis. The first, second, and third axes define a three-dimensional coordinate system.

    摘要翻译： 本发明公开了一种三维微机电系统传感器。 传感器包括可移动的第一电极，多个可移动的第二电极，多个固定的第三电极和多个固定的第四电极。 第一电极及其相邻的第三电极形成至少一个第一电容器和至少一个第二电容器，并且第二电极及其相邻的第四电极形成至少一个第三电容器。 第一电容器的电容变化反映了沿着第一轴的检测质量块的位移，第二电容器的电容变化反映了沿第二轴的检验质量块的位移，并且第三电容器的电容变化反映了第三电容器的位移 沿着第三轴的检验质量。 第一，第二和第三轴定义三维坐标系。

    CAPACITIVE ACCELEROMETER
    9.
    发明申请
    CAPACITIVE ACCELEROMETER 有权
    电容式加速度计

    公开(公告)号：US20130074599A1

    公开(公告)日：2013-03-28

    申请号：US13397684

    申请日：2012-02-16

    申请人： Ching-Kai Shen

    发明人： Ching-Kai Shen

    IPC分类号： G01P15/125

    CPC分类号： G01P15/125 ,  G01P15/18 ,  G01P2015/082 ,  G01P2015/0831

    摘要： A capacitive accelerometer includes a substrate and a first semiconductor layer. The first semiconductor layer is disposed on the substrate and includes a first mass, first and second support bases, first and second elastic members, and first and second comb capacitor sets. The first and second support bases are disposed at positions corresponding to first and second axes respectively. The first elastic member is connected to the first mass and the first support base in a manner of bending back and forth perpendicular to the first axis. The second elastic member is connected to the first mass and the second support base in a manner of bending back and forth perpendicular to the second axis. The first and second comb capacitor sets are disposed at positions corresponding to the second and first axes respectively and connected to the first mass. The first axis is perpendicular to the second axis.

    摘要翻译： 电容式加速度计包括衬底和第一半导体层。 第一半导体层设置在基板上，并且包括第一质量块，第一和第二支撑基座，第一和第二弹性构件以及第一和第二梳状电容器组。 第一和第二支撑基座分别设置在与第一和第二轴对应的位置。 第一弹性构件以垂直于第一轴线来回弯曲的方式连接到第一质量块和第一支撑基座。 第二弹性构件以与第二轴线垂直的方式来回弯曲的方式连接到第一质量块和第二支撑基座。 第一梳状电容器组和第二梳状电容器组分别设置在与第二和第二轴对应的位置处，并连接到第一质量块。 第一轴垂直于第二轴。

    Method for adjusting an acceleration sensor
    10.
    发明授权
    Method for adjusting an acceleration sensor 有权
    调整加速度传感器的方法

    公开(公告)号：US08381570B2

    公开(公告)日：2013-02-26

    申请号：US12927345

    申请日：2010-11-12

    申请人： Torsten Ohms ,  Axel Franke

    发明人： Torsten Ohms ,  Axel Franke

    IPC分类号： G01P21/00 ,  G01P15/18

    CPC分类号： G01P15/125 ,  G01P15/18 ,  G01P21/00 ,  G01P2015/082

    摘要： A method for adjusting an acceleration sensor which includes a substrate and a seismic mass, the acceleration sensor having first and further first electrodes attached to the substrate on a first side, counter-electrodes of the seismic mass being situated between the first and further first electrodes, the acceleration sensor having further second electrodes on a second side and further fourth electrodes on a fourth side opposite the second side, an essentially equal first excitation voltage being applied to the first and further first electrodes in a first step for exciting a first deflection of the seismic mass along a first direction, the first deflection being compensated in a second step by applying a first compensation voltage to the further second and further fourth electrodes.

    摘要翻译： 一种用于调整加速度传感器的方法，所述加速度传感器包括基板和地震块，所述加速度传感器具有在第一侧上附接到所述基板的第一和另外的第一电极，所述地震质量块的对电极位于所述第一和第二电极之间 加速度传感器在第二侧具有另外的第二电极，在与第二侧相反的第四侧具有另外的第四电极，在第一步骤中将基本上相等的第一激励电压施加到第一和第二电极，用于激发第一偏转 所述地震质量沿着第一方向，所述第一偏转在第二步骤中通过向所述另外的第二和第四电极施加第一补偿电压来补偿。