公开(公告)号：US20140377910A1

公开(公告)日：2014-12-25

申请号：US14478799

申请日：2014-09-05

Applicant: STMicroelectronics, Inc.

Inventor： Jerry Tan ,  William Cabreros

IPC: H01L23/495

CPC classification number: H01L23/49575 ,  H01L21/4828 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48471 ,  H01L2224/49052 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012

Abstract: A leadless semiconductor package includes a package body on a leadframe that includes a die paddle and a plurality of bond pads, none of which extend as far as a lateral face of the body. During manufacture of the package, molding compound is deposited over a face of the leadframe on which the die paddle and bond pads are positioned. After the molding compound is cured, a back side of the leadframe is etched to isolate the die paddle and bond pads, back surfaces of which remain exposed at a back face of the body. During manufacture of the leadframe, a parent substrate is etched to define the die paddle and a plurality of bond pads on one side of the substrate and a plurality of cavities on the opposite face.

Abstract translation: 无引线半导体封装包括在引线框上的封装体，其包括管芯焊盘和多个接合焊盘，其中没有一个延伸到主体的侧面。 在包装的制造期间，将模塑料沉积在引线框的面上，在其上定位有管芯焊盘和焊盘。 在模塑料固化之后，对引线框架的背面进行蚀刻以隔离模板和粘结垫，焊盘的背面在主体的背面保持暴露。 在引线框的制造期间，蚀刻母基板以限定管芯焊盘和在衬底的一侧上的多个接合焊盘和在相对的面上的多个空腔。

公开(公告)号：US09117810B2

公开(公告)日：2015-08-25

申请号：US14478799

申请日：2014-09-05

Applicant: STMicroelectronics, Inc.

Inventor： Jerry Tan ,  William Cabreros

IPC: H01L21/00 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L21/4828 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48471 ,  H01L2224/49052 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012

Abstract: A leadless semiconductor package includes a package body on a leadframe that includes a die paddle and a plurality of bond pads, none of which extend as far as a lateral face of the body. During manufacture of the package, molding compound is deposited over a face of the leadframe on which the die paddle and bond pads are positioned. After the molding compound is cured, a back side of the leadframe is etched to isolate the die paddle and bond pads, back surfaces of which remain exposed at a back face of the body. During manufacture of the leadframe, a parent substrate is etched to define the die paddle and a plurality of bond pads on one side of the substrate and a plurality of cavities on the opposite face.

Abstract translation: 无引线半导体封装包括在引线框上的封装体，其包括管芯焊盘和多个接合焊盘，其中没有一个延伸到主体的侧面。 在包装的制造期间，将模塑料沉积在引线框的面上，在其上定位有管芯焊盘和焊盘。 在模塑料固化之后，对引线框架的背面进行蚀刻以隔离模板和粘结垫，焊盘的背面在主体的背面保持暴露。 在引线框的制造期间，蚀刻母基板以限定管芯焊盘和在衬底的一侧上的多个接合焊盘和在相对的面上的多个空腔。