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公开(公告)号：US10646892B2
公开(公告)日：2020-05-12
申请号：US15803630
申请日：2017-11-03
Applicant: STMicroelectronics, Inc. , STMICROELECTRONICS S.R.L. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana Gruenbacher , Faiz Sherman
Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
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公开(公告)号：US10543504B2
公开(公告)日：2020-01-28
申请号：US15636491
申请日：2017-06-28
Applicant: STMicroelectronics, Inc. , STMICROELECTRONICS S.R.L. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana Gruenbacher , Faiz Sherman
Abstract: A microfluidic die is disclosed that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
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Patent Agency Ranking
公开(公告)号：US20160107443A1
公开(公告)日：2016-04-21
申请号：US14976434
申请日：2015-12-21
Applicant: STMicroelectronics, Inc. , STMICROELECTRONICS S.R.L. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana GRUENBACHER , Faiz SHERMAN
IPC: B41J2/14
CPC classification number: B05B17/0607 , B05B17/0638 , B05B17/0684 , B41J2/14016 , B41J2/14024 , B41J2/14056 , B41J2/14072 , B41J2/1433 , B41J2/1601 , B41J2/1632 , B41J2/175 , B41J2/17526 , B41J2/1753 , B41J2002/14338 , B41J2002/14491 , H05K1/0212 , H05K1/111 , H05K1/181 , Y10T29/49119
Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
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公开(公告)号：US20150367373A1
公开(公告)日：2015-12-24
申请号：US14310886
申请日：2014-06-20
Applicant: STMicroelectronics, Inc.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana Gruenbacher , Faiz Sherman
CPC classification number: B05B17/0607 , B05B17/0638 , B05B17/0684 , B41J2/14016 , B41J2/14024 , B41J2/14056 , B41J2/14072 , B41J2/1433 , B41J2/1601 , B41J2/1632 , B41J2/175 , B41J2/17526 , B41J2/1753 , B41J2002/14338 , B41J2002/14491 , H05K1/0212 , H05K1/111 , H05K1/181 , Y10T29/49119
Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
Abstract translation: 本公开涉及一种微流体管芯，其包括在基底上方的多个加热器，加热器上方的多个腔室和喷嘴，联接到加热器的多个第一触头以及耦合到加热器的多个第二触点。 多个第二触点彼此耦合并耦合到地。 芯片包括多个接触焊盘，耦合到多个第二触点和多个接触焊盘中的第一触点的第一信号线以及多个第二信号线，每个第二信号线耦合到 多个第一触点，第二信号线的组被耦合在一起以用单个信号驱动一组多个加热器，每组第二信号线耦合到多个接触垫中的剩余的一个。
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公开(公告)号：US09919334B2
公开(公告)日：2018-03-20
申请号：US14975540
申请日：2015-12-18
Applicant: STMicroelectronics, Inc. , STMICROELECTRONICS S.R.L. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana Gruenbacher , Faiz Sherman
CPC classification number: B05B17/0607 , B05B17/0638 , B05B17/0684 , B41J2/14016 , B41J2/14024 , B41J2/14056 , B41J2/14072 , B41J2/1433 , B41J2/1601 , B41J2/1632 , B41J2/175 , B41J2/17526 , B41J2/1753 , B41J2002/14338 , B41J2002/14491 , H05K1/0212 , H05K1/111 , H05K1/181 , Y10T29/49119
Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
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公开(公告)号：US09833806B2
公开(公告)日：2017-12-05
申请号：US14976434
申请日：2015-12-21
Applicant: STMicroelectronics, Inc. , STMICROELECTRONICS S.R.L. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana Gruenbacher , Faiz Sherman
CPC classification number: B05B17/0607 , B05B17/0638 , B05B17/0684 , B41J2/14016 , B41J2/14024 , B41J2/14056 , B41J2/14072 , B41J2/1433 , B41J2/1601 , B41J2/1632 , B41J2/175 , B41J2/17526 , B41J2/1753 , B41J2002/14338 , B41J2002/14491 , H05K1/0212 , H05K1/111 , H05K1/181 , Y10T29/49119
Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
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公开(公告)号：US09358567B2
公开(公告)日：2016-06-07
申请号：US14310886
申请日：2014-06-20
Applicant: STMicroelectronics, Inc.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana Gruenbacher , Faiz Sherman
CPC classification number: B05B17/0607 , B05B17/0638 , B05B17/0684 , B41J2/14016 , B41J2/14024 , B41J2/14056 , B41J2/14072 , B41J2/1433 , B41J2/1601 , B41J2/1632 , B41J2/175 , B41J2/17526 , B41J2/1753 , B41J2002/14338 , B41J2002/14491 , H05K1/0212 , H05K1/111 , H05K1/181 , Y10T29/49119
Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
Abstract translation: 本公开涉及一种微流体管芯，其包括在基底上方的多个加热器，加热器上方的多个腔室和喷嘴，联接到加热器的多个第一触头以及耦合到加热器的多个第二触点。 多个第二触点彼此耦合并耦合到地。 芯片包括多个接触焊盘，耦合到多个第二触点和多个接触焊盘中的第一触点的第一信号线以及多个第二信号线，每个第二信号线耦合到 多个第一触点，第二信号线的组被耦合在一起以用单个信号驱动一组多个加热器，每组第二信号线耦合到多个接触垫中的剩余的一个。
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