公开(公告)号：US09919334B2

公开(公告)日：2018-03-20

申请号：US14975540

申请日：2015-12-18

Applicant: STMicroelectronics, Inc. ,  STMICROELECTRONICS S.R.L. ,  STMicroelectronics International N.V.

Inventor： Simon Dodd ,  Joe Scheffelin ,  Dave Hunt ,  Matt Giere ,  Dana Gruenbacher ,  Faiz Sherman

IPC: B05B17/06 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  B41J2/16 ,  B41J2/14

CPC classification number: B05B17/0607 ,  B05B17/0638 ,  B05B17/0684 ,  B41J2/14016 ,  B41J2/14024 ,  B41J2/14056 ,  B41J2/14072 ,  B41J2/1433 ,  B41J2/1601 ,  B41J2/1632 ,  B41J2/175 ,  B41J2/17526 ,  B41J2/1753 ,  B41J2002/14338 ,  B41J2002/14491 ,  H05K1/0212 ,  H05K1/111 ,  H05K1/181 ,  Y10T29/49119

Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

公开(公告)号：US09833806B2

公开(公告)日：2017-12-05

申请号：US14976434

申请日：2015-12-21

Applicant: STMicroelectronics, Inc. ,  STMICROELECTRONICS S.R.L. ,  STMicroelectronics International N.V.

Inventor： Simon Dodd ,  Joe Scheffelin ,  Dave Hunt ,  Matt Giere ,  Dana Gruenbacher ,  Faiz Sherman

IPC: B05B17/06 ,  B41J2/14 ,  B41J2/16 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: B05B17/0607 ,  B05B17/0638 ,  B05B17/0684 ,  B41J2/14016 ,  B41J2/14024 ,  B41J2/14056 ,  B41J2/14072 ,  B41J2/1433 ,  B41J2/1601 ,  B41J2/1632 ,  B41J2/175 ,  B41J2/17526 ,  B41J2/1753 ,  B41J2002/14338 ,  B41J2002/14491 ,  H05K1/0212 ,  H05K1/111 ,  H05K1/181 ,  Y10T29/49119

Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

公开(公告)号：US09358567B2

公开(公告)日：2016-06-07

申请号：US14310886

申请日：2014-06-20

Applicant: STMicroelectronics, Inc.

Inventor： Simon Dodd ,  Joe Scheffelin ,  Dave Hunt ,  Matt Giere ,  Dana Gruenbacher ,  Faiz Sherman

IPC: B05B17/06 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC classification number: B05B17/0607 ,  B05B17/0638 ,  B05B17/0684 ,  B41J2/14016 ,  B41J2/14024 ,  B41J2/14056 ,  B41J2/14072 ,  B41J2/1433 ,  B41J2/1601 ,  B41J2/1632 ,  B41J2/175 ,  B41J2/17526 ,  B41J2/1753 ,  B41J2002/14338 ,  B41J2002/14491 ,  H05K1/0212 ,  H05K1/111 ,  H05K1/181 ,  Y10T29/49119

Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

Abstract translation: 本公开涉及一种微流体管芯，其包括在基底上方的多个加热器，加热器上方的多个腔室和喷嘴，联接到加热器的多个第一触头以及耦合到加热器的多个第二触点。 多个第二触点彼此耦合并耦合到地。 芯片包括多个接触焊盘，耦合到多个第二触点和多个接触焊盘中的第一触点的第一信号线以及多个第二信号线，每个第二信号线耦合到 多个第一触点，第二信号线的组被耦合在一起以用单个信号驱动一组多个加热器，每组第二信号线耦合到多个接触垫中的剩余的一个。

公开(公告)号：US09561657B2

公开(公告)日：2017-02-07

申请号：US15138997

申请日：2016-04-26

Applicant: STMicroelectronics, Inc. ,  STMicroelectronics S.r.l. ,  STMicroelectronics Asia Pacific Pte Ltd

Inventor： Simon Dodd ,  Joe Scheffelin ,  Dana Gruenbacher ,  Roberto Brioschi ,  Teck Khim Neo ,  Dave Hunt ,  Faiz Sherman

IPC: B41J2/14 ,  B41J2/175 ,  B41J2/16 ,  B05B15/00 ,  B05B1/14 ,  H01L23/00 ,  H05K3/30 ,  H01L41/113 ,  H05K1/02 ,  H05K1/09 ,  B05B11/00 ,  H05K1/18

CPC classification number: B41J2/1623 ,  B05B1/14 ,  B05B11/0054 ,  B05B15/40 ,  B41J2/14024 ,  B41J2/14145 ,  B41J2/1433 ,  B41J2/162 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L41/1132 ,  H01L2224/2732 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48096 ,  H01L2224/48097 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/19106 ,  H05K1/0272 ,  H05K1/09 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/10083 ,  H05K2201/10515 ,  H05K2201/10545 ,  Y02P70/613 ,  Y10T156/1089 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00

Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instance, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.

Abstract translation: 实施例涉及微流体补充盒及其组装方法。 微流体补充盒包括微流体递送构件，其包括用于过滤通过其中的流体的过滤器。 过滤器可以被配置为阻挡高于阈值尺寸的颗粒以防止喷嘴中的堵塞。 例如，具有大于喷嘴直径的尺寸的颗粒可以阻挡或减少通过喷嘴的流体流动。

公开(公告)号：US20150373840A1

公开(公告)日：2015-12-24

申请号：US14310601

申请日：2014-06-20

Applicant: STMicroelectronics, Inc.

Inventor： Simon Dodd ,  Joe Scheffelin ,  Dave Hunt ,  Steve Bush ,  Faiz Sherman

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K1/0272 ,  B41J2/17506 ,  B41J2/17513 ,  B41J2/1753 ,  H05K1/0212 ,  Y10T137/6416

Abstract: The present disclosure is directed to a system that is configured to eject fluid vertically away from a thermal microfluidic die for use with scented oils or other fluids. The die is coupled to a rigid planar support board that separates the die from a reservoir of the fluid. The support board includes an opening that is lined with an inert liner that protects an interior surface of the support board from the fluid. The support board includes contact to an external power supply and contacts to the die on a first surface. The die is coupled to this first surface such that the second surface remains free of electrical connections.

Abstract translation: 本公开涉及一种被配置为垂直远离热微流体模头喷射流体以与香味油或其它流体一起使用的系统。 模具耦合到将模具与流体的容器分离的刚性平面支撑板。 支撑板包括一个内衬有惰性衬垫的开口，该衬垫保护支撑板的内表面免受流体的影响。 支撑板包括与外部电源的接触并且在第一表面上与模具接触。 模具耦合到该第一表面，使得第二表面保持没有电连接。

公开(公告)号：US20150367370A1

公开(公告)日：2015-12-24

申请号：US14310986

申请日：2014-06-20

Applicant: STMicroelectronics, Inc. ,  STMicroelectronics S.r.l. ,  STMicroelectronics Asia Pacific Pte Ltd

Inventor： Simon Dodd ,  Joe Scheffelin ,  Dana Gruenbacher ,  Roberto Brioschi ,  Teck Khim Neo ,  Dave Hunt ,  Faiz Sherman

IPC: B05B15/00 ,  H05K3/30 ,  H01L23/00 ,  B05B9/01 ,  B05B1/14

CPC classification number: B41J2/1623 ,  B05B1/14 ,  B05B11/0054 ,  B05B15/40 ,  B41J2/14024 ,  B41J2/14145 ,  B41J2/1433 ,  B41J2/162 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L41/1132 ,  H01L2224/2732 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48096 ,  H01L2224/48097 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/19106 ,  H05K1/0272 ,  H05K1/09 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/10083 ,  H05K2201/10515 ,  H05K2201/10545 ,  Y02P70/613 ,  Y10T156/1089 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00

Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instances, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.

Abstract translation: 实施例涉及微流体补充盒及其组装方法。 微流体补充盒包括微流体递送构件，其包括用于过滤通过其中的流体的过滤器。 过滤器可以被配置为阻挡高于阈值尺寸的颗粒以防止喷嘴中的堵塞。 例如，具有大于喷嘴直径的尺寸的颗粒可阻挡或减少通过喷嘴的流体流动。

公开(公告)号：US20150367364A1

公开(公告)日：2015-12-24

申请号：US14311150

申请日：2014-06-20

Applicant: STMicroelectronics, Inc.

Inventor： Simon Dodd ,  Joe Scheffelin ,  Dave Hunt ,  Tim Hoekstra ,  Faiz Sherman ,  Steve Bush

IPC: B05B9/00 ,  B05B9/01 ,  A61L9/14

CPC classification number: A61L9/14 ,  A61L2/00 ,  A61L9/00 ,  A61L9/127 ,  A61L2209/132 ,  A61L2209/133 ,  A61L2209/134 ,  B05B17/0684

Abstract: One or more embodiments are directed to a microfluidic delivery system that dispenses a fluid in a direction that, at least in part, opposes gravity. In one embodiment, the microfluidic delivery system includes a microfluidic refill cartridge that is configured to be placed in a housing. The microfluidic refill cartridge includes at least one nozzle that faces upward or off to a side. The microfluidic refill cartridge includes a fluid transport member that allows fluid to travel upward from a fluid reservoir in opposition to gravity. A fluid path is located above the fluid transport member placing an end of the fluid transport member in fluid communication with a chamber and a nozzle. In response to the microfluidic delivery system receiving an electrical signal, an ejection element is configured to cause fluid in the chamber to be expelled through the nozzle. In response to the fluid being expelled from the nozzle, fluid may be pulled up through the fluid transport member and through the fluid path to refill the chamber.

Abstract translation: 一个或多个实施例涉及一种微流体输送系统，其在至少部分地与重力相反的方向上分配流体。 在一个实施例中，微流体递送系统包括配置成放置在壳体中的微流体补充盒。 微流体补充盒包括面向上或向外侧的至少一个喷嘴。 微流体补充盒包括允许流体相对于重力从流体储存器向上运动的流体输送构件。 流体路径位于流体输送构件上方，使得流体输送构件的端部与腔室和喷嘴流体连通。 响应于接收电信号的微流体传递系统，喷射元件构造成使得腔室中的流体通过喷嘴排出。 响应于从喷嘴排出的流体，流体可以被上拉通过流体输送构件并且通过流体路径以重新填充腔室。

公开(公告)号：US09174453B1

公开(公告)日：2015-11-03

申请号：US14311022

申请日：2014-06-20

Applicant: STMicroelectronics, Inc.

Inventor： Simon Dodd ,  Joe Scheffelin ,  Dave Hunt ,  David Burney

IPC: B41J2/175 ,  B41J2/14

CPC classification number: B41J2/17506 ,  B41J2/14072 ,  B41J2/17513 ,  B41J2/1753 ,  B41J2/17546 ,  B41J2/17553 ,  Y10T29/49828

Abstract: Embodiments disclosed herein are directed to a microfluidic refill cartridge having a vent hole and nozzles on a same side of the cartridge. In one or more embodiments, the vent hole and nozzles are located on upper surfaces of the cartridge, such as on a lid that is coupled to a reservoir. In particular, the nozzles and the vent hole may be formed on a microfluidic delivery member that is secured to the lid. A single cover may be used to cover the vent hole and the nozzles. In some embodiments, the single cover may be a flexible material and may adhere to the microfluidic delivery member.

Abstract translation: 本文公开的实施例涉及一种具有通气孔和在筒的同一侧上的喷嘴的微流体补充盒。 在一个或多个实施例中，通气孔和喷嘴位于盒的上表面上，例如连接到储存器的盖上。 特别地，喷嘴和通气孔可以形成在固定到盖的微流体传送构件上。 可以使用单个盖子来覆盖通气孔和喷嘴。 在一些实施例中，单个盖可以是柔性材料并且可以粘附到微流体递送构件。

公开(公告)号：US10646892B2

公开(公告)日：2020-05-12

申请号：US15803630

申请日：2017-11-03

Applicant: STMicroelectronics, Inc. ,  STMICROELECTRONICS S.R.L. ,  STMicroelectronics International N.V.

Inventor： Simon Dodd ,  Joe Scheffelin ,  Dave Hunt ,  Matt Giere ,  Dana Gruenbacher ,  Faiz Sherman

IPC: B41J2/175 ,  B05B17/06 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  B41J2/14 ,  B05B17/00 ,  B41J2/16

Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

公开(公告)号：US20190200453A1

公开(公告)日：2019-06-27

申请号：US16287949

申请日：2019-02-27

Applicant: STMicroelectronics, Inc. ,  STMicroelectronics S.R.L. ,  STMicroelectronics International N.V.

Inventor： Simon Dodd ,  Joe Scheffelin ,  Dave Hunt ,  Steve Bush ,  Faiz Sherman

IPC: H05K1/02 ,  B41J2/175

CPC classification number: H05K1/0272 ,  B41J2/17506 ,  B41J2/17513 ,  B41J2/1753 ,  H05K1/0212 ,  Y10T137/6416

Abstract: The present disclosure is directed to a system that is configured to eject fluid vertically away from a thermal microfluidic die for use with scented oils or other fluids. The die is coupled to a rigid planar support board that separates the die from a reservoir of the fluid. The support board includes an opening that is lined with an inert liner that protects an interior surface of the support board from the fluid. The support board includes contact to an external power supply and contacts to the die on a first surface. The die is coupled to this first surface such that the second surface remains free of electrical connections.