公开(公告)号：US20020179991A1

公开(公告)日：2002-12-05

申请号：US10145388

申请日：2002-05-14

Applicant: STMicroelectronics S.A.

Inventor： Michel Varrot ,  Guillaume Bouche ,  Roberto Gonella ,  Eric Sabouret

IPC: H01L031/00

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05093 ,  H01L2224/05095 ,  H01L2224/05096 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2224/48475 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/85051 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30105 ,  Y10S257/92 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: Each connecting pad includes a continuous top metal layer on the top metallization level and having on its top face an area for welding a connecting wire. Also, the pad has a reinforcing structure under the welding area and includes at least one discontinuous metal layer on the immediately next lower metallization level, metal vias connecting the discontinuous metal layer to the bottom surface of the top metal layer, and an isolating cover covering the discontinuous metal layer and its discontinuities as well as the inter-via spaces between the two metallic layers.

Abstract translation: 每个连接焊盘包括在顶部金属化水平面上的连续的顶部金属层，并且在其顶面上具有焊接连接线的区域。 此外，焊盘在焊接区域下方具有加强结构，并且在紧接着的下一个金属化层面上包括至少一个不连续的金属层，将不连续金属层连接到顶部金属层的底表面的金属通孔以及隔离盖覆盖物 不连续金属层及其不连续性以及两个金属层之间的通孔间隔。