公开(公告)号：US20180249597A1

公开(公告)日：2018-08-30

申请号：US15797889

申请日：2017-10-30

Applicant: STMicroelectronics S.r.l.

Inventor： Giovanni Luca Torrisi ,  Domenico Porto

IPC: H05K7/20 ,  G06F1/30 ,  G06F1/32

CPC classification number: H05K7/20945 ,  G06F1/206 ,  G06F1/305 ,  G06F1/3206 ,  G06F1/3243 ,  G06F1/3287 ,  Y02D10/16 ,  Y02D10/171

Abstract: An embodiment circuit includes a plurality of heat-generating circuits, a heat-sensitive circuit exposed to heat generated during operation of the plurality of heat-generating circuit, and a temperature sensor disposed at a location between the heat-sensitive circuit and the plurality of heat-generating circuits, the temperature sensor being configured to generate an over-temperature signal as a function of temperature sensed at the location. The plurality of heat-generating circuits may be selectively deactivatable in an ordered sequence based on deactivation weights respectively assigned to the plurality of heat-generating circuits and in response to the over-temperature signal.

公开(公告)号：US10924100B2

公开(公告)日：2021-02-16

申请号：US16849020

申请日：2020-04-15

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics (Alps) SAS

Inventor： Giovanni Luca Torrisi ,  Domenico Porto ,  Christophe Roussel

IPC: H03K17/00 ,  H02P7/03

Abstract: An H-bridge circuit includes a supply voltage node, a first pair of transistors and a second pair of transistors. First transistors in each pair have the current paths therethrough included in current flow lines between the supply node and, respectively, a first output node and a second output node. Second transistors in each pair have the current paths therethrough coupled to a third output node and a fourth output node, respectively. The first and third output nodes are mutually isolated from each other and the second and fourth output nodes are mutually isolated from each other. The H-bridge circuit is operable in a selected one of a first, second and third mode.

公开(公告)号：US10588247B2

公开(公告)日：2020-03-10

申请号：US15797889

申请日：2017-10-30

Applicant: STMicroelectronics S.r.l.

Inventor： Giovanni Luca Torrisi ,  Domenico Porto

IPC: H05K7/20 ,  G06F1/3287 ,  G06F1/3206 ,  G06F1/20 ,  G06F1/30 ,  G06F1/3234

Abstract: An embodiment circuit includes a plurality of heat-generating circuits, a heat-sensitive circuit exposed to heat generated during operation of the plurality of heat-generating circuit, and a temperature sensor disposed at a location between the heat-sensitive circuit and the plurality of heat-generating circuits, the temperature sensor being configured to generate an over-temperature signal as a function of temperature sensed at the location. The plurality of heat-generating circuits may be selectively deactivatable in an ordered sequence based on deactivation weights respectively assigned to the plurality of heat-generating circuits and in response to the over-temperature signal.

公开(公告)号：US09123753B2

公开(公告)日：2015-09-01

申请号：US14144801

申请日：2013-12-31

Applicant: STMicroelectronics S.r.l.

Inventor： Domenico Porto

IPC: H01L29/06 ,  H01L29/66 ,  H01L27/10 ,  H01L29/16 ,  G06N99/00 ,  B82Y10/00 ,  H01L29/82

CPC classification number: H01L29/66977 ,  B82Y10/00 ,  G06N99/002 ,  H01L27/10 ,  H01L29/1606 ,  H01L29/82

Abstract: QCA assemblies, in which basic cells are formed on the basis of graphene in order to provide a coupling field distribution in the form of an electrostatic field, a magnetic field, and the like which allows a unique association between field distribution and logic state. Moreover, the corresponding energy structure may be selected so as to allow operation of the QCA assemblies at ambient temperature. Hence, the signal processing capabilities of QCA assemblies may be obtained at significantly reduced complexity compared to conventional quantum-based QCA assemblies, which typically operate at very low temperatures.

Abstract translation: QCA组件，其中基于石墨烯形成基本单元，以提供静电场，磁场等形式的耦合场分布，其允许场分布和逻辑状态之间的独特关联。 此外，可以选择相应的能量结构，以允许在环境温度下操作QCA组件。 因此，与通常在非常低的温度下操作的常规基于量子的QCA组件相比，可以以显着降低的复杂度获得QCA组件的信号处理能力。

公开(公告)号：US20140191199A1

公开(公告)日：2014-07-10

申请号：US14144801

申请日：2013-12-31

Applicant: STMicroelectronics S.r.l.

Inventor： Domenico Porto

IPC: H01L29/66

CPC classification number: H01L29/66977 ,  B82Y10/00 ,  G06N99/002 ,  H01L27/10 ,  H01L29/1606 ,  H01L29/82

Abstract: QCA assemblies, in which basic cells are formed on the basis of graphene in order to provide a coupling field distribution in the form of an electrostatic field, a magnetic field, and the like which allows a unique association between field distribution and logic state.Moreover, the corresponding energy structure may be selected so as to allow operation of the QCA assemblies at ambient temperature. Hence, the signal processing capabilities of QCA assemblies may be obtained at significantly reduced complexity compared to conventional quantum-based QCA assemblies, which typically operate at very low temperatures.

Abstract translation: QCA组件，其中基于石墨烯形成基本单元，以提供静电场，磁场等形式的耦合场分布，其允许场分布和逻辑状态之间的独特关联。 此外，可以选择相应的能量结构，以允许在环境温度下操作QCA组件。 因此，与通常在非常低的温度下操作的常规基于量子的QCA组件相比，可以以显着降低的复杂度获得QCA组件的信号处理能力。