公开(公告)号：US20190292386A1

公开(公告)日：2019-09-26

申请号：US16302299

申请日：2017-04-10

申请人： SUMITOMO BAKELITE CO., LTD.

发明人： Toru MEURA

IPC分类号： C09D11/101 ,  C09D11/037 ,  C09D11/102 ,  H05K1/03 ,  H05K3/18 ,  B33Y70/00 ,  B33Y80/00

摘要： The thermosetting resin composition for LDS of the invention includes a thermosetting resin, an inorganic filler, a non-conductive metal compound that forms a metal nucleus upon irradiation with active energy rays, and a coupling agent, in which the non-conductive metal compound includes one or more selected from the group consisting of a spinel-type metal oxide, a metal oxide having two or more transition metal elements in groups adjacent to each other, the groups being selected from groups 3 to 12 of the periodic table, and a tin-containing oxide, and the coupling agent includes one or more selected from the group consisting of mercaptosilane, aminosilane, and epoxysilane.

公开(公告)号：US20130324641A1

公开(公告)日：2013-12-05

申请号：US13962530

申请日：2013-08-08

申请人： Sumitomo Bakelite Co., Ltd.

发明人： Kenzou MAEJIMA ,  Satoru KATSURAYAMA ,  Toru MEURA

IPC分类号： C09D163/00

CPC分类号： C09D163/00 ,  H01L21/563 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81091 ,  H01L2224/81093 ,  H01L2224/81097 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81204 ,  H01L2224/81209 ,  H01L2224/81211 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8349 ,  H01L2224/83862 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/3512

摘要： Provided is a method for manufacturing an electronic component by using a solder joining method for bonding a first electronic component having a metal electrode with a second electronic component having a solder electrode, the method comprising; (i) forming a resin layer containing a thermosetting resin on at least one of the solder joint surfaces of said first electronic component and said second electronic component; (ii) positioning said metal electrode of said first electronic component and said solder electrode of said second electronic component to face each other, heating said positioned electrodes and applying pressure, and thereby bringing said metal electrode and said solder electrode into contact; (iii) heating electronic components while applying pressure thereby fusion bonding said solder to said metal electrode; and (iv) heating said resin layer.

摘要翻译： 本发明提供一种电子部件的制造方法，其特征在于，使用焊料接合方法，该焊接方法用于将具有金属电极的第一电子部件与具有焊料电极的第二电子部件接合。 （i）在所述第一电子部件和所述第二电子部件的至少一个焊接面上形成含有热硬化性树脂的树脂层; （ii）将所述第一电子部件的所述金属电极和所述第二电子部件的所述焊料电极相对配置，加热所述定位电极并施加压力，从而使所述金属电极和所述焊料电极接触; （iii）在施加压力的同时加热电子部件，从而将所述焊料熔合到所述金属电极上; 和（iv）加热所述树脂层。