ISOLATION TRENCH WITH ROUNDED CORNERS FOR BiCMOS PROCESS
    1.
    发明申请
    ISOLATION TRENCH WITH ROUNDED CORNERS FOR BiCMOS PROCESS 有权
    用于BiCMOS工艺的带圆角的隔离开关

    公开(公告)号:US20110073955A1

    公开(公告)日:2011-03-31

    申请号:US12962159

    申请日:2010-12-07

    IPC分类号: H01L27/06

    摘要: A semiconductor device comprising a first transistor device (130) on or in a semiconductor substrate (115) and a second transistor device (132) on or in the substrate. The device further comprises an insulating trench (200) located between the first transistor device and the second transistor device. At least one upper corner (610) of the insulating trench is a rounded corner in a lateral plane (620) of the substrate.

    摘要翻译: 一种半导体器件,包括在半导体衬底(115)上或半导体衬底(115)中的第一晶体管器件(130)和衬底上或衬底中的第二晶体管器件(132)。 该器件还包括位于第一晶体管器件和第二晶体管器件之间的绝缘沟槽(200)。 绝缘沟槽的至少一个上角(610)是衬底的横向平面(620)中的圆角。

    Isolation trench with rounded corners for BiCMOS process
    2.
    发明授权
    Isolation trench with rounded corners for BiCMOS process 有权
    用于BiCMOS工艺的带圆角的隔离槽

    公开(公告)号:US08274131B2

    公开(公告)日:2012-09-25

    申请号:US12962159

    申请日:2010-12-07

    IPC分类号: H01L21/70

    摘要: A semiconductor device comprising a first transistor device (130) on or in a semiconductor substrate (115) and a second transistor device (132) on or in the substrate. The device further comprises an insulating trench (200) located between the first transistor device and the second transistor device. At least one upper corner (610) of the insulating trench is a rounded corner in a lateral plane (620) of the substrate.

    摘要翻译: 一种半导体器件,包括在半导体衬底(115)上或半导体衬底(115)中的第一晶体管器件(130)和衬底上或衬底中的第二晶体管器件(132)。 该器件还包括位于第一晶体管器件和第二晶体管器件之间的绝缘沟槽(200)。 绝缘沟槽的至少一个上角(610)是衬底的横向平面(620)中的圆角。

    Distributed high voltage JFET
    6.
    发明授权
    Distributed high voltage JFET 有权
    分布式高电压JFET

    公开(公告)号:US07910417B2

    公开(公告)日:2011-03-22

    申请号:US12176488

    申请日:2008-07-21

    IPC分类号: H01L21/337

    CPC分类号: H01L29/808 H01L29/1066

    摘要: A Junction Field Effect Transistor (JFET) can be fabricated with a well region that include a channel region having an average dopant concentration substantially less the average doping concentration of the remaining portions of the well region. The lower average doping concentration of channel region compared to the remaining portions of the well region reduces the pinch-off voltage of the JFET.

    摘要翻译: 结型场效应晶体管(JFET)可以制造具有阱区,阱区包括平均掺杂剂浓度基本上小于阱区的剩余部分的平均掺杂浓度的沟道区。 与阱区域的其余部分相比,沟道区域的较低平均掺杂浓度降低了JFET的夹断电压。

    Distributed high voltage JFET
    7.
    发明授权
    Distributed high voltage JFET 有权
    分布式高电压JFET

    公开(公告)号:US07605412B2

    公开(公告)日:2009-10-20

    申请号:US11534395

    申请日:2006-09-22

    IPC分类号: H01L31/112

    CPC分类号: H01L29/808 H01L29/1066

    摘要: A Junction Field Effect Transistor (JFET) can be fabricated with a well region that include a channel region having an average dopant concentration substantially less the average doping concentration of the remaining portions of the well region. The lower average doping concentration of channel region compared to the remaining portions of the well region reduces the pinch-off voltage of the JFET.

    摘要翻译: 结型场效应晶体管(JFET)可以制造具有阱区,阱区包括平均掺杂剂浓度基本上小于阱区的剩余部分的平均掺杂浓度的沟道区。 与阱区域的其余部分相比,沟道区域的较低平均掺杂浓度降低了JFET的夹断电压。

    DISTRIBUTED HIGH VOLTAGE JFET
    8.
    发明申请
    DISTRIBUTED HIGH VOLTAGE JFET 有权
    分布式高电压JFET

    公开(公告)号:US20080299716A1

    公开(公告)日:2008-12-04

    申请号:US12176488

    申请日:2008-07-21

    IPC分类号: H01L21/337

    CPC分类号: H01L29/808 H01L29/1066

    摘要: A Junction Field Effect Transistor (JFET) can be fabricated with a well region that include a channel region having an average dopant concentration substantially less the average doping concentration of the remaining portions of the well region. The lower average doping concentration of channel region compared to the remaining portions of the well region reduces the pinch-off voltage of the JFET.

    摘要翻译: 结型场效应晶体管(JFET)可以制造具有阱区,阱区包括平均掺杂剂浓度基本上小于阱区的剩余部分的平均掺杂浓度的沟道区。 与阱区域的其余部分相比,沟道区域的较低平均掺杂浓度降低了JFET的夹断电压。

    Distributed high voltage JFET
    9.
    发明授权
    Distributed high voltage JFET 有权
    分布式高电压JFET

    公开(公告)号:US07417270B2

    公开(公告)日:2008-08-26

    申请号:US10874479

    申请日:2004-06-23

    IPC分类号: H01L29/80

    CPC分类号: H01L29/808 H01L29/1066

    摘要: A Junction Field Effect Transistor (JFET) can be fabricated with a well region that include a channel region having an average dopant concentration substantially less the average doping concentration of the remaining portions of the well region. The lower average doping concentration of channel region compared to the remaining portions of the well region reduces the pinch-off voltage of the JFET.

    摘要翻译: 结型场效应晶体管(JFET)可以制造具有阱区,阱区包括平均掺杂剂浓度基本上小于阱区的剩余部分的平均掺杂浓度的沟道区。 与阱区域的其余部分相比,沟道区域的较低平均掺杂浓度降低了JFET的夹断电压。

    ESD robust bipolar transistor with high variable trigger and sustaining voltages
    10.
    发明授权
    ESD robust bipolar transistor with high variable trigger and sustaining voltages 有权
    具有高可变触发和维持电压的ESD稳健双极晶体管

    公开(公告)号:US06624481B1

    公开(公告)日:2003-09-23

    申请号:US10407037

    申请日:2003-04-04

    IPC分类号: H01L2362

    摘要: An ESD robust bipolar transistor (200) that includes first and second bipolar elements (210, 220), wherein a first trigger voltage of the first bipolar element (210) is proximate a second sustaining voltage of the second bipolar element (220). The first and second bipolar elements (210, 220) include first and second bases (214, 224), emitters (216, 226) and collectors (212, 222), respectively. The first and second bases (214, 224) are coupled and the first and second collectors (212, 222) are coupled. The ESD robust bipolar transistor (200) also includes an emitter resistor (250) and a base resistor (260), wherein the emitter resistor (250) couples the first and second emitters (216, 226) and the base resistor (260) couples the second emitter (226) and the first and second bases (214, 224).

    摘要翻译: 包括第一和第二双极元件(210,220)的ESD坚固的双极晶体管(200),其中第一双极元件(210)的第一触发电压接近第二双极元件(220)的第二维持电压。 第一和第二双极元件(210,220)分别包括第一和第二基极(214,224),发射极(216,226)和集电极(212,222)。 耦合第一和第二基极(214,224),并且耦合第一和第二集电极(212,222)。 ESD稳健双极晶体管(200)还包括发射极电阻(250)和基极电阻(260),其中发射极电阻(250)将第一和第二发射极(216,226)和基极电阻(260)耦合 第二发射器(226)和第一和第二基极(214,224)。