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公开(公告)号:US20230378397A1
公开(公告)日:2023-11-23
申请号:US18192577
申请日:2023-03-29
发明人: Hyung Seok KIM , Si Sung KIM , Jong Jin LEE , Dong Gyun KIM , Dong Eon LEE , Hyun Min CHO , Sang Wook HAN
IPC分类号: H01L33/38 , H01L33/20 , H01L25/075
CPC分类号: H01L33/382 , H01L33/20 , H01L25/0753
摘要: A light emitting element includes: a light emitting element core including a first semiconductor layer, a light emitting layer on the first semiconductor layer, and a second semiconductor layer on the light emitting layer; and a first element insulating layer surrounding a side surface of the light emitting element core. An outer surface of the first element insulating layer has a first outer surface adjacent to one surface of the first semiconductor layer, the one surface of the first semiconductor layer being opposite to another surface of the first semiconductor layer facing the second semiconductor layer, and a second outer surface farther away from a side surface of the first semiconductor layer than the first outer surface is.
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公开(公告)号:US20240332265A1
公开(公告)日:2024-10-03
申请号:US18678529
申请日:2024-05-30
发明人: In Hyuk KIM , Dong Gyun KIM , Jae Hoon JUNG , Jin Oh KWAG , Hee Yeon YOO , Sung Chan JO , Jeong In CHOI , Hye Jung HONG , Jong Hyuk KANG , Dong Eon LEE , Hyun Min CHO
IPC分类号: H01L25/075 , H01L21/68 , H01L21/78 , H01L33/00
CPC分类号: H01L25/0753 , H01L21/68 , H01L21/7806 , H01L33/005
摘要: An apparatus includes a base including a receiving portion that receives a substrate on which semiconductor elements are disposed; and at least one ultrasonic generator that generates and applies ultrasonic waves to the substrate placed in the base.
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公开(公告)号:US20240170460A1
公开(公告)日:2024-05-23
申请号:US18325903
申请日:2023-05-30
发明人: Jae Hoon JUNG , Dong Gyun KIM , Jun Bo SIM , Hee Yeon YOO
IPC分类号: H01L25/075 , C09D11/36 , C09K11/02 , H01L33/38
CPC分类号: H01L25/0753 , C09D11/36 , C09K11/02 , H01L33/38 , C09K2211/10 , H01L2933/0016
摘要: A light emitting element solvent and method of fabricating a display device are provided. The light emitting element solvent includes a light emitting element solvent, and light emitting elements dispersed in the light emitting element solvent and each including a plurality of semiconductor layers and an insulating film surrounding outer surfaces of the semiconductor layers, wherein the light emitting element solvent includes a solvent molecule represented by Formula 1 and an ion remover represented by Formula 2.
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公开(公告)号:US20230282778A1
公开(公告)日:2023-09-07
申请号:US17992656
申请日:2022-11-22
发明人: Dong Gyun KIM , Jun Bo SIM , Hee Yeon YOO , Jeong In CHOI , Chul Jong YOO , Yo Han LEE , Sung Ae JANG , Hyun Min CHO , Hyung Rae CHA
IPC分类号: H01L33/38 , H01L25/075 , H01L33/62
CPC分类号: H01L33/382 , H01L25/0753 , H01L33/62
摘要: A light-emitting element comprises a core comprising a first semiconductor layer, a second semiconductor layer provided on the first semiconductor layer, and an emissive layer provided between the first semiconductor layer and the second semiconductor layer, and a first element insulating film around a side surface of the core, wherein the first element insulating film comprises a composite of an insulating member and an elastic member.
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公开(公告)号:US20220037292A1
公开(公告)日:2022-02-03
申请号:US17382825
申请日:2021-07-22
发明人: In Hyuk KIM , Dong Gyun KIM , Jae Hoon JUNG , Jin Oh KWAG , Hee Yeon YOO , Sung Chan JO , Jeong In CHOI , Hye Jung HONG , Jong Hyuk KANG , Dong Eon LEE , Hyun Min CHO
IPC分类号: H01L25/075 , H01L33/00 , H01L21/68 , H01L21/78
摘要: An apparatus includes a base including a receiving portion that receives a substrate on which semiconductor elements are disposed; and at least one ultrasonic generator that generates and applies ultrasonic waves to the substrate placed in the base.
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公开(公告)号:US20230006095A1
公开(公告)日:2023-01-05
申请号:US17757218
申请日:2020-12-07
发明人: Hoo Keun PARK , Moon Jung AN , Dong Eon LEE , Chul Jong YOO , Hye Lim KANG , Dong Gyun KIM
摘要: A light-emitting element including: a first semiconductor layer doped with a first type of dopant; a second semiconductor layer doped with a second type of dopant that is different from the first type of dopant; and an active layer between the first semiconductor layer and the second semiconductor layer, wherein a length of the light-emitting element measured in a first direction, which may be a direction in which the first semiconductor layer, the active layer, and the second semiconductor layer may be arranged, may be shorter than the width measured in a second direction that is perpendicular to the first direction.
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公开(公告)号:US20220376144A1
公开(公告)日:2022-11-24
申请号:US17636218
申请日:2020-02-27
发明人: Moon Jung AN , Sung Chan JO , Hoo Keun PARK , Chul Jong YOO , Hye Lim KANG , Dong Gyun KIM , Dong Eon LEE , Hyun Min CHO
摘要: A light emitting element includes: a first semiconductor layer doped with a first polarity; a second semiconductor layer doped with a second polarity different from the first polarity; an active layer between the first semiconductor layer and the second semiconductor layer in a first direction; and an insulating film surrounding an outer surface of at least the active layer and extending in the first direction. A thickness of a first portion of the insulating film surrounding the active layer is in a range of 10% to 16% of a diameter of the active layer.
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公开(公告)号:US20220367756A1
公开(公告)日:2022-11-17
申请号:US17638169
申请日:2020-02-27
发明人: Dong Eon LEE , Hoo Keun PARK , Moon Jung AN , Chul Jong YOO , Hye Lim KANG , Dong Gyun KIM
摘要: A light emitting element includes: a first semiconductor layer doped with a first polarity; a second semiconductor layer doped with a second polarity different from the first polarity; an active layer between the first semiconductor layer and the second semiconductor layer in a first direction; a first outer film around an outer surface of at least the active layer and extending in the first direction; and a second outer film around an outer surface of a portion of the first semiconductor layer on which the first outer film is not present.
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公开(公告)号:US20230187578A1
公开(公告)日:2023-06-15
申请号:US17926031
申请日:2020-09-15
发明人: Je Won YOO , Dong Gyun KIM , Hyun Min CHO
IPC分类号: H01L33/24 , H01L25/075 , H01L33/00
CPC分类号: H01L33/24 , H01L25/0756 , H01L33/005
摘要: A method of manufacturing a light emitting element includes providing light emitting patterns on a substrate, providing a soft material layer between the light emitting patterns, deforming the soft material layer, and separating the light emitting patterns from the substrate.
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公开(公告)号:US20230027490A1
公开(公告)日:2023-01-26
申请号:US17786260
申请日:2020-12-15
发明人: Hye Lim KANG , Dong Gyun KIM , Hoo Keun PARK , Moon Jung AN , Chul Jong YOO , Dong Eon LEE
摘要: A display device includes a first electrode, a second electrode disposed spaced apart from the first electrode in a first direction, and an element part disposed between the first electrode and the second electrode. The element part includes light-emitting elements that have a shape extending in one direction and are arranged spaced apart from each other in a second direction perpendicular to the first direction; and a binder surrounding each of the light-emitting elements and fixing the light-emitting elements. The one direction in which the light-emitting elements extend is parallel to the first direction.
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